• Title/Summary/Keyword: printed electronic paper

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Ultra-High-Speed PCB Design Methods (초고속 PCB 설계 기법)

  • Kim, Chang-Gyun;Lee, Seongsoo
    • Journal of IKEEE
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    • v.22 no.3
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    • pp.882-885
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    • 2018
  • Recently, signal integrity on PCB (printed circuit board) becomes very important as the system operation speed increases. So far, PCB is customarily designed to minimize area and cost. However, ultra-high-speed PCB often fail to operate properly, unless it is precisely and carefully designed considering dielectric characteristics, line width, line spacing, and impedance matching. This paper surveys many problems in ultra-high-speed PCB and various design methods to mitigate them.

Optimization of Printing Process for the Development of Metal-oxide Resistivity Sensor (전기저항형 금속산화물 센서의 인쇄공정 최적화에 관한 연구)

  • Lee, Seokhwan;Koo, Jieun;Lee, Moonjin;Jung, Jung-Yeul;Chang, Jiho
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.29 no.6
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    • pp.353-358
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    • 2016
  • In this paper, we have studied about the optimum fabrication condition of the printed Indium Tin Oxide (ITO) layers for the electrical resistance-type sensor application. We have investigated on the substrates surface treatments, mixing ratio of organic binder/ITO powder, and viscosity of the printing paste to determine the optimum condition of the screen printed ITO layer. Also, we found that the printing condition is closely related with the sensor performance. To know the feasibility of printed ITO layer as an electrical resistance-type sensor, we have fabricated the ITO sensors with a printed and sputtered ITO layers. The printed ITO films revealed $10^2$ times higher sensitivity than the sputtered ITO layer. Also, the sputtered ITO layer exhibited an operating temperature of $127^{\circ}C$ at the operating voltage of 5 V. While, in case of the printed ITO layer showed the operating temperature of $27.6^{\circ}C$ in high operating voltage of 30 V. We found that the printed ITO layer is suitable for the various sensor applications.

Compact Printed Monopole Antenna With Inverted L-shaped Slot for Dual-band Operations

  • Kwak, Chang-Sub;Lee, Yeong-Min;Lee, Young-Soon
    • International Journal of Internet, Broadcasting and Communication
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    • v.12 no.1
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    • pp.37-44
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    • 2020
  • In this paper, we proposed a compact printed monopole antenna with an inverted L-shaped slot for dual-band operations. Two operating frequency bands are achieved with the use of an inverted L-shaped slot etched on the radiating strip for bandwidth enhancement and a defected ground structure for return loss improvement in the higher frequency band. The measured results showthat the proposed antenna has impedance bandwidths (S11< -10 dB) of 270 MHz (1.81-2.08 GHz) and 340 MHz (2.36-2.70 GHz), covering the required bandwidths for PCS (1850.5-1989.5 MHz), CDMA 2000 (1850-1990 MHz), TD-SCDMA (1880-2025 MHz) and 2.4 GHz WLAN (2400-2484 MHz). The measured return loss of the proposed antenna has a good value of approximately 27.2 dB at 2.4 GHz WLAN. The antenna's peak gains also have a high value of 1.92 dBi at 2 GHz and 2.12 dBi at 2.45 GHz. The proposed antenna shows omnidirectional radiation patterns over the entire frequency range of interest.

Design Consideration and Verification on Random Vibration of Satellite Electronic Equipment while Launching (발사시 야기되는 랜덤진동을 고려한 위성체 전장품 설계 및 검증에 대한 연구)

  • 김홍배;서현석
    • Journal of KSNVE
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    • v.10 no.6
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    • pp.971-976
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    • 2000
  • High level random vibration environments induced while launching of spacecraft can damage sensitive electronic equipment, unless the equipment is properly packaged. Thus careful consideration on the launch environment, especially for high level random vibration, is required in the design stage of electronic equipment of spacecraft. This paper describes the development process of Solar Array Regulator for KOMPAT-2, which is designed and tested by Korean engineers. Both analytical and experimental techniques are introduced in this paper.

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3D Printed Electronics Research Trend (3차원 인쇄기술을 이용한 전자소자 연구 동향)

  • Park, Yea-Seol;Lee Ju-Yong;Kang, Seung-Kyun
    • Journal of the Microelectronics and Packaging Society
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    • v.28 no.2
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    • pp.1-12
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    • 2021
  • 3D printing, which designs product in three dimensions, draws attention as a technology that will lead the future for it dramatically shortens time for production without assembly, no matter how complex the structure is. The paper studies the latest researches of 3D-printed electronics and introduces papers studied electronics components, power supply, circuit interconnection and 3D-printed PCBs' applications. 3D-printed electronics showed possibility to simplify facilities and personalize electric devices by providing one-stop printing process of electronic components, soldering, stacking, and even encapsulation.

Estimation of Transferred Power from a Noise Source to an IC with Forwarded Power Characteristics

  • Pu, Bo;Kim, Taeho;Kim, SungJun;Kim, Jong-Hyeon;Kim, SoYoung;Nah, Wansoo
    • Journal of electromagnetic engineering and science
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    • v.13 no.4
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    • pp.233-239
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    • 2013
  • This paper proposes an accurate approach for predicting transferred power from a noise source to integrated circuits based on the characteristics of the power transfer network. A power delivery trace on a package and a printed circuit board are designed to transmit power from an external source to integrated circuits. The power is demonstrated between an injection terminal on the edge of the printed circuit board and integrated circuits, and the power transfer function of the power distribution network is derived. A two-tier calibration is applied to the test, and scattering parameters of the network are measured for the calculation of the power transfer function. After testing to obtain the indispensable parameters, the real received and tolerable power of the integrated circuits can be easily achieved. Our proposed estimation method is an enhancement of the existing the International Electrotechnical Commission standard for precise prediction of the electromagnetic immunity of integrated circuits.

Printed 1x2 Dipole Array Antenna Fed by Tapered Stripline for Wideband (테이퍼된 스트립 선로로 급전된 광대역 프린트 1X2 다이폴 배열 안테나)

  • Seung-Yeop Rhee
    • The Journal of the Korea institute of electronic communication sciences
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    • v.19 no.4
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    • pp.641-646
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    • 2024
  • This paper is studied for the design and experiment of a wideband printed 1x2 dipole array antenna for 3.5GHz band application. The printed dipole antenna used in the array antenna was implemented in the form of a rectangular strip, and was consisted with a broadside coupled stripline (BCS). The feed line was designed to be tapered for broadband impedance matching. As a result of comparing the simulation results and measurement results, it was found that the two results were in good agreement with 2.8% error(100MHz shift @3.5GHz). As a result of the experiment, based on VSWR=2, a bandwidth of about 16% was obtained from the center frequency of 3.5 GHz to 3.15~3.70 GHz.

A Printed Yagi Antenna Available at 2.4 GHz for Remote Management of Underground Facility (지하 매설물 원격 관리를 위한 2.4 GHz 대역의 인쇄형 야기 안테나)

  • Park, Dong-Kook;Cho, Ik-Hyun;Seo, Hong-Eun;Yun, Na-Ra;Kim, Jin-Young
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.19 no.12
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    • pp.1360-1366
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    • 2008
  • This paper proposes a printed yagi-antenna available at 2.45 GHz, for the remote-management system of the underground equipment. To improve the solidity and waterproof property, the proposed antenna is coated with bakelite. The manufactured antenna is operated at $2.15{\sim}2.52\;GHz$, whose gain measures 10 dBi. These results are a little different from those of the simulated antenna, but the trend is totally similar. Developed antenna is expected to be useful in the underground facility.

A study of guaranteeing reliability for IC of electronic instruments according temperature

  • Yoon, Geon;Park, Yong-Oon;Kwon, Soon-Chang
    • 제어로봇시스템학회:학술대회논문집
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    • 2005.06a
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    • pp.320-323
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    • 2005
  • This paper discusses heat problem of IC, which composes the electronic instruments, to guarantee reliability of electronic instruments. And also proposes the unified equivalent model for various electronic instrument products to guarantee reliability and life of its parts. Because electronic instruments are down sizing and operated with high frequency, the internal temperature of electronic instruments is rising steadily. The internal temperature of the electronic instruments gives a big effect to electronic instrument's reliability and life. The semiconductor parts are the representative heat generation parts because of its complicated function, high frequency and high density. Consequently, guaranteeing reliability and life of electronic semiconductor is the important start point in securing the reliability and life of the electronic instrument product. Unfortunately, there are many factors, which affect heat dissipation efficiency. The heat dissipation efficiency follows the environment where the electronic instrument products are used. Therefore it is very difficult to define reliability and life of the electronic manufactures. Electronic instrument products are composed of printed circuit board (PCB), integrated circuit (IC), resistance, and capacitor and so on. And there are superposed thermal resistances, because the parts are arrayed on the printed circuit board (PCB), Therefore the total thermal resistance is variable. Consequently it cannot have same thermal model for each electronic instrument products. In the next part, we propose the unified equivalent model for various electronic instruments. And using the proposed equivalent model proofs the method for analysis reliability of electronic parts.

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Augmenting Text Document by Controlling Its IR-Reflectance (적외선 반사 특성 제어를 통한 텍스트 문서 증강)

  • Park, Hanhoon;Moon, Kwang-Seok
    • Journal of Korea Multimedia Society
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    • v.20 no.6
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    • pp.882-892
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    • 2017
  • Locally Likely Arrangement Hashing (LLAH) is a method that describes image features based on the geometry between their neighbors. Thus, it has been preferred to implement augmented reality on poorly-textured objects such as text documents. However, LLAH strongly requires that image features be detected with high repeatability and located at a distance from one another. To fulfill the requirement for text document, this paper proposes a method that facilitates the word detection in infrared (IR) range by adjusting the IR-reflectance of words. Specifically, the words are printed out with two different black inks: one is using the K(carbon black) ink only, the other is mixing the C(cyan), M(magenta), Y(yellow) inks. Since only the words printed out with the K ink is visible in IR range, a part of words are selected in advance to be used as features and printed out the K ink. The selected words can be robustly detected with high repeatability in IR range and this enables to implement augmented reality on text documents with high fidelity. The validity of the proposed method was verified through experiments.