• 한국전기전자재료학회논문지
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• 제15권8호
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• pp.702-707
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• 2002

This paper presents a micro fluxgate sensor in printed circuit board (PCB). The fluxgate sensor consists of five PCB stack layers including one layer magnetic core and four layers of excitation and pick-up coils. The center layer as a magnetic core is made of a micro patterned amorphous magnetic ribbon and the core has a rectangular-ring shape. The amorphous magnetic core is easily saturated due to the low coercive field and closed magnetic path for the excitation field. Four outer layers as an excitation and pick-up coils have a planar solenoid structure. The chip size of the fabricated sensing element is 7.3$\times$5.7$\textrm{mm}^2$. Excellent linear response over the range of -100$\mu$T to +100$\mu$T is obtained with 540V/T sensitivity at excitation square wave of 3 $V_{p-p}$ and 360kHz. The very low power consumption of ~8mW was measured. This magnetic sensing element, which measures the lower fields than 50$\mu$T, is very useful for various applications such as: portable navigation systems, military research, medical research, and space research.h.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.60-60
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• 2008

We manufactured Liquid Crystal Polymer (LCP) and (1-x)$BaTiO_3-xSrTiO_3$(BST) ceramic composites and investigated dielectric properties to use as embedded capacitor in printed circuit boards and replace LTCC substrates. The dielectric properties of these composites are varied with volume fraction of BST and ratios of BT/ST. Dielectric constants are in the range of 3~28. In addition, we could get low TCC and High Q value that could not achieve in other ceramic-polymer composites. Especially, in composite with x=0.4 and 50vol% BST, the dieletric constant and Q-value are 27 and 300, respectively. And more TCC is -116~145ppm/$^{\circ}C$ in the temperature range of -55~$125^{\circ}C$. We think that this composites can be used high-Q substrate material like LTCC and embedded temperature compensation capacitor in printed circuit boards.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.232-233
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• 2007

We manufactured Liquid Crystal Polymer (LCP) and (1-x)CaTiO3-xLaAlO3 (CT-LA) ceramic composites and investigated dielectric properties to use as embedded capacitor in printed circuit boards and replace LTCC substrate. The dielectric properties of these composites are varied with volume fraction of CT-LA and ratios of CT/LA. Dielectric constants are in the range of 3~15. In addition, we could get low TCC and High Q value that could not achieve in other ceramic-polymer composites. Especially, in composite with x=0.01 and 30 vol% CT-LA, the dieletric constant and Q-value are 10 and 200, respectively. And more TCC is $-28{\sim}300ppm/^{\circ}C$ in the temperature range of $-55{\sim}125^{\circ}C$. We think that this composites can be used high-Q substrate material like LTCC and embedded temperature compensation capacitor in printed circuit boards.

• 한국전기전자재료학회논문지
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• 제20권4호
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• pp.342-347
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• 2007

$Bi_6Mg_2Nb_4O_{21}(BMN)$ thin films were deposited at various substrates by sputtering system for embedded capacitor applications. BMN thin films deposited at room temperature are manufactured as MIM(Metal/Insulator/Metal) structures. Dielectric properties and leakage current density were investigated as a function of various substrates and thickness of BMN thin films. Leakage current density of BMN thin films deposited on CCL(Copper Clad Laminates) showed relatively high value ($1{\times}10^{-3}A/cm^2$) at an applied field of 300 kV/cm on substrates, possibly due to relatively high value of roughness(rms $50{\AA}$) of CCL substrates. 100 nm-thick BMN thin films deposited on Cu/Ti/Si substrates showed the capacitance density of $300 nF/cm^2$, a dielectric constant of 32, a dielectric loss of 2 % at 100 kHz and the leakage current density of $1{\times}10^{-6}A/cm^2$ at an applied field of 300 kV/cm. BMN capacitors are expected to be promising candidates as embedded capacitors for printed circuit board(PCB).

• 마이크로전자및패키징학회지
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• 제28권2호
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• pp.1-12
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• 2021

3차원 인쇄 기술은 제품의 설계를 3차원으로 하여 조립없이 제품의 생산까지의 시간을 획기적으로 줄이고 복잡한 구조도 구현할 수 있어 미래의 기술로 각광받고 있다. 본 논문은 3차원 인쇄기술을 이용한 전자소자에 대한 최근 연구동향을 알아보면서 구성품, 전원공급장치와 회로에서의 연결과 3차원 인쇄기술 PCB의 응용한 연구논문들을 소개하고 있다. 3차원 인쇄기술로 제작한 전자소자는 원스톱으로 전자소자, 솔더링(soldering), 스태킹(stacking), 회로의 봉지막(encapsulation)까지 제작함으로써 생산설비의 단순화와 전자기기를 개인 맞춤형을 할 수 있는 가능성을 보여주었다.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2004년도 하계종합학술대회 논문집(1)
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• pp.269-272
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• 2004

Printed circuit boards (PCB) replaced conventional wiring in most electronic equipment I, reducing the size and weight of electronic equipment while improving reliability, uniformity, precision and performance. PCB is used in all kinds of electronic products because they can be mass-produced with very high circuit density and also enable easier trouble-shooting. This paper presents the analyses of the patent information of Build-up PCB which is seen as the most promising solution, as its substrate supports multi-level packaging, thinner board profiles and smaller pitches.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2006년 추계학술발표대회 개요집
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• pp.136-138
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• 2006

Recently a lots of problems have observed in high densified and high integrated electronic components. One of them is ion migration phenomena, which induce the electrical short of electrical circuit. Ion migration phenomena has been observed in the field of exposing the specific environment and using for a long time. Also as the RoHS restriction was started in July 1st, 2006, Pb-free solder was utilized in electronics assemblies. In this case, it is very important to compatible between components and printed circuit board(PCB), thus surface treatment materials of PCB was changed to Sn, Sn-3.0Ag-0.5Cu, Cu. Therefore these new application become to need to reevaluate the sensitivity about electrochemical ion migration. This study was evaluated the occurrence time of electrochemical ion migration using by water drop test. We utilized PCB(printed circuit board) having a comb pattern as follows 0.1, 0.318, 0.5, 1.0 mm pattern distance. Sn-3.0Ag-0.5Cu and Sn-37Pb were electroplated on the comb pattern. 6.5V and 15.0V were applied in the comb pattern and then we measured the electrical short time causing by occurring the ion migration. In these results, we evaluate the sensitivity and derived the prediction models of ion migration occurrence time depending on the pattern materials, applied voltage and pattern spacing of PCB conductor.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 추계학술대회 논문집
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• pp.182-182
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• 2009

일반적으로 스크린 프린팅 공정은 실비가 간단하고 공정이 쉬우며 가격이 저렴한 특성을 가지고 있다. 본 연구에서는 스크린 프린팅 방법들 이용하여 절연층을 코팅하고 도체 패턴을 형성하여 MCPCB(Metal-Core Printed Circuit Board) 기판을 제작하였다. 또한, 이 방법으로 제작된 MCPCB 기판의 방열 특성을 기존 상용 MCPCB와 비교 평가하였다.

• 한국정보처리학회:학술대회논문집
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• 한국정보처리학회 2001년도 춘계학술발표논문집 (하)
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• pp.1209-1212
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• 2001

본 논문에서는 PCB(Printed Circuit Board)회로에서 고속 신호들을 전달하는 배선의 특성 및 배선의 요구사항에 의한 설계 규칙과 이론화된 공식은 이용하여 PCB상에 배치되는 부품들간의 배선경로를 추적하여 해당 배선의 특성을 분석하고, 흐르는 신호의 특성 및 해당 신호의 전기/전자적인 시뮬레이션을 수행할 수 있도록 하는 PCB회로의 신호통합 시뮬레이터에 대하여 언급하고 실험을 통하여 시뮬레이션의 타당성을 검증하였다.

• 세라미스트
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• 제21권2호
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• pp.83-88
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• 2018

There is close relation between the heat generation and the performance of electronic device. The durability and efficiency of the device are degraded due to heat generation. It is necessary to release the generated heat from an electronic device. Based on demands of the printed circuit board (PCB) manufacturing, the robust and reliable plating technique of PCB is necessary. In this study, we review various methods for improving the heat sink property. These methods were considered to enhance the adhesion between ceramic substrate as heat sink and metal layer as electrode.