• Journal of Korea Foundry Society
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• v.15 no.6
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• pp.566-573
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• 1995

In this study, the microstructural characteristics such as primary silicon, eutectic silicon, $SiC_p$ dispersion behavior, compound amount and Si solubility in $Al/SiC_p$ composite fabricated by the squeeze casting under various conditions were investigated systematically. As applied pressure(MPa) increases, cooling rate and compound amount are increased. In gravity casting, the cooling rate of hypereutectic composite is slower than of hypoeutectic composite by exothermic reaction of primary Si crystallization. But the cooling rate of hypereutectic composite is faster than that of hypoeutectic composite fabricated by same applied pressure, because amount of primary Si crystallization in hypereutectic composite was decreased, on the contrary, primary ${\alpha}-Al$ in hypoeutetic composite was increased due to increase of Si solubility in matrix by applied pressure. The crystalized primary silicon in hypereutectic composite fabricated by squeeze casting become more fine than that in non-pressure casting This is because mush zone became narrow due to increase of Si content of eutectic composition by pressure and time for growth of primary silicon got shorter according to applied pressure. It is turned out that eutectic temperature and liquidus are decreased by the increasing of squeeze pressure in all the composite due to thermal unstability of matrix owing to increasing of Si solubility in matrix by the increasing of applied pressure, as indicated in thermal anaiysis(DSC) results.

• Journal of the Korean Society for Heat Treatment
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• v.18 no.3
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• pp.157-163
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• 2005

Effects of refinement of primary Si and residual stress on the mechanical properties of Aluminum B.390 alloy have been examined. Calcium was found to have an effect on the size of primary silicon particles. Primary silicon particle was refined as Ca content decreased. Refinement of primary Si particles led to an improvement in mechanical properties of the alloy; increase of elongation was prominent, above all. By the increase of compressive residual stress in the matrix alloy, tensile strength increased but elongation decreased.

• Journal of the Korean Society of Industry Convergence
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• v.17 no.3
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• pp.122-135
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• 2014

This paper was studied on the horizontal continuous casting of Al-xSi(x=10~15%) aluminum alloy. The experiments of the horizontal continuous casting was carried out by the horizontal continuous casting machine for various casting conditions and investigated on fracture types and mechanisms. Surface defect types for the horizontal continuous casting is also investigated. And the study was carried out that the horizontal continuous casting conditions such as casting temperature, cooling rate, and drawing speed affect the hardness and primary silicon size of Al-xSi(x=10~15%) aluminum rod bar. Casting temperature within this experiment conditions don't affect on the hardness of rod bar but the higher casting temperature is the smaller primary silicon size. The higher cooling rate and drawing speed have the higher hardness and the smaller primary silicon size.

• Korean Journal of Metals and Materials
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• v.49 no.11
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• pp.874-881
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• 2011

The present study describes a new technique to extract the primary silicon from an Al-Si alloy melt using centrifugal force during its solidification. The primary silicon was separated from an Al-50 wt.%Si alloy by centrifugal force in the form of a foam, which facilitated subsequent acid leaching to extract the pure silicon due to its wide surface area. The foam recovery after centrifugal separation was decreased as centrifugal acceleration was increased. The final recovery after acid leaching became closer to the solid fraction of the alloy, which was calculated from the Al-Si binary phase diagram, with increasing centrifugal acceleration due to the effective removal of the attached Al on the foam. The purity of the primary silicon obtained by the centrifugal separation method was over 99.99%, with only aluminum being also present.

• Journal of the Korean Vacuum Society
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• v.1 no.1
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• pp.153-161
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• 1992

A plasma has been used in a high vaccum, cold wall reactor for low temperature deposition of C54 TiSi2 and for in-situ surface cleaning prior to silicide deposition. SiH4 and TiCl4 were used as the silicon and titanium sources, respectively. The deposited films had low resistivities in the range of 15~25 uohm-cm. The investigation of the experimental variables' effects on the growth of silicide and its concomitant silicon consumption revealed that and were the dominant species for silicide formation and the primary factors in silicon consumption were gas composition ratio and temperature. Increasing silane flow rate from 6 to 9 sccm decreased silicon consumption from 1500 A/min to less than 30 A/min. Furthermore, decreasing the temperature from 650 to $590^{\circ}C$ achieved blanket silicide deposition with no silicon consumption. A kinetic model of silicon consumption is proposed to understand the fundamental mechanism responsible for the dependence of silicon consumption on SiH4 flow rate.

• Transactions of Materials Processing
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• v.14 no.4 s.76
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• pp.319-326
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• 2005

In this study, the nano-deformation behavior of semi-solid Al-Si alloy was investigated using a molecular dynamics simulation as a part of the research on the surface crack behavior in thixoformed automobile parts. The microstructure of the grain-size controlled Al-Si alloy consists of primary and eutectic regions. In eutectic regions the crack initiation begins with initial fracture of the eutectic silicon particles and inside other intermetallic phases. Nano-deformation characteristics in the eutectic and primary phase of the grain-size controlled Al-Si alloy were investigated through the molecular dynamics simulation. The primary phase was assumed to be single crystal aluminum. It was shown that the vacancy occurred at the zone where silicon molecules were.

• Journal of the Korean Vacuum Society
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• v.11 no.4
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• pp.249-255
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• 2002

For a formation of membrane structures, single crystal silicon wafers have been anisotropically etched with solutions of KOH and KOH-IPA. The etching rate was observed to be strongly dependent upon the etchant temperature and concentration. Mask patterns for the etching experiment was aligned to incline $45^{\circ}$on the primary flat of the silicon wafer. The different etching characteristics were observed according to pattern directions and etchant concentration. When the KOH concentration was fixed to 20 wt%, the U-groove etching shape was observed for the etching temperature of above $80^{\circ}C$, and V-groove shapes observed at below $80^{\circ}C$. Hillocks, which were generated at the etched silicon surfaces, has been decreased as the increasing of the etchant temperature and concentration.

• Journal of the Korean Electrochemical Society
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• v.13 no.1
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• pp.70-74
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• 2010

The immobilization of proteins on silicon surfaces using electrochemical reaction has been studied. Chemical deposition of nitrobenzendiazonium (NiBD) cations is employed to modify silicon surfaces. Electrochemical reduction of nitro-group to primary amine-group have been conducted on the modified surfaces to activate silicon surfaces for the protein immobilization. Attachment of gold nanoparticles was used to prove the reduction. The current method was applied to selective activation of a silicon nanowire and immobilize proteins on the selected nanowire. It has been demonstrated that the use of chemical and electrochemical reaction NiBD is efficient for the selective immobilization of proteins on silicon nanowire surfaces.

• Bulletin of the Korean Chemical Society
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• v.20 no.10
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• pp.1136-1144
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• 1999

The collision-induced reaction of gas-phase atomic hydrogen with hydrogen atoms chemisorbed on a silicon (001)-(2×1) surface is studied by use of the classical trajectory approach. The model is based on reaction zone atoms interacting with a finite number of primary system silicon atoms, which then are coupled to the heat bath, i.e., the bulk solid phase. The potential energy of the Hads‥Hgas interaction is the primary driver of the reaction, and in all reactive collisions, there is an efficient flow of energy from this interaction to the Hads-Si bond. All reactive events occur on a subpicosecond scale, following the Eley-Rideal mechanism. These events occur in a localized region around the adatom site on the surface. The reaction probability shows the maximum near 700K as the gas temperature increases, but it is nearly independent of the surface temperature up to 700 K. Over the surface temperature range of 0-700 K and gas temperature range of 300 to 2500 K, the reaction probability lies at about 0.1. The reaction energy available for the product states is small, and most of this energy is carried away by the desorbing H2 in its translational and vibrational motions. The Langevin equation is used to consider energy exchange between the reaction zone and the bulk solid phase.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.2
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• pp.70-77
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• 2007

The application of focused ion beam(FIB) technology has been broadened in the fabrication of nanoscale regime. The extended application of FIB is dependent on complicated reciprocal relation of operating parameters. It is necessary for successful and efficient modifications on the surface of silicon substrate. The primary effect by Gaussian beam intensity is significantly shown from various aperture size, accelerating voltage, and beam current. Also, the secondary effect of other process factors - dwell time, pixel interval, scan mode, and pattern size has affected to etching results. For the process analysis, influence of the secondary factors on FIB micromilling process is examined with respect to sputtering depth during the milling process in silicon material. The results are analyzed by the ratio of signal to noise obtained using design of experiment in each parameter.