• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2007년도 SMT/PCB 기술세미나
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• pp.37-47
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• 2007

Factor : Structure Metal pad & SMO size Board level TC test : - Large SMO size better Board level Drop test : - Large SMO size better Factor : Structure Substrate thickness Board level TC test : - Thick substrate better Board level Drop test : - Substrate thickness is not a significant factor for drop test Factor : Material Solder alloy Board level TC test : - Not so big differences over Pb-free solder and NiAu, OSP finish Board level Drop test : - Ni/Au+SAC105, CuOSP+LF35 are better Factor : Material Pad finish Board level TC test : - NiAu/NiAu is best Board livel Drop test : - CuOSP is best Factor : Material Underfill Board level TC test - Several underfills (reworkable) are passed TCG x500 cycles Board level Drop test : - Underfill lots have better performance than non-underfill lots Factor : Process Multiple reflow Board level TC test : - Multiple reflow is not a significant actor for TC test Board level Drop test : N/A Factor : Process Peak temp Board level TC test : - Higher peak temperature is worse than STD Board level Drop test : N/A Factor : Process Stack method Board level TC test : - No big difference between pre-stack and SMT stack Board level Drop test : - Flux dipping is better than paste dipping but failure rate is more faster

• Transactions on Electrical and Electronic Materials
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• 제10권3호
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• pp.71-74
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• 2009

Electroplated Cu is a cost efficient metallization method in microelectronic packaging applications. Typically in 3-D chip staking technology, utilizing through silicon via (TSV), electroplated Cu metallization is inevitable for the throughput as well as reducing the cost of ownership (COO).To achieve a comparable film quality to sputtering or CVD, a pre-cleaning process as well as plating process is crucial. In this research, atmospheric plasma is employed to reduce the usage of chemicals, such as trichloroethylene (TCE) and sodium hydroxide (NaHO), by substituting the chemical assisted organic cleaning process with plasma surface treatment for Cu electroplating. By employing atmospheric plasma treatment, marginally acceptable electroplating and cleaning results are achieved without the use of hazardous chemicals. The experimental results show that the substitution of the chemical process with plasma treatment is plausible from an environmentally friendly aspect. In addition, plasma treatment on immersion Sn/Cu was also performed to find out the solderability of plasma treated Sn/Cu for practical industrial applications.

• 마이크로전자및패키징학회지
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• 제20권4호
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• pp.7-11
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• 2013

As thermosonic ball bonding is developed for more and more advanced applications in the electronic packaging industry, the control of process stresses induced on the integrated circuits becomes more important. If Cu bonding wire is used instead of Au wire, larger ultrasonic levels are common during bonding. For advanced microchips the use of Cu based wire is risky because the ultrasonic stresses can cause chip damage. This risk needs to be managed by e.g. the use of ultrasound during the impact stage of the ball on the pad ("pre-bleed") as it can reduce the strain hardening effect, which leads to a softer deformed ball that can be bonded with less ultrasound. To find the best profiles of ultrasound during impact, a numerical model is reported for ultrasonic bonding with capillary dynamics combined with a geometrical model describing ball deformation based on volume conservation and stress balance. This leads to an efficient procedure of ball bond modelling bypassing plasticity and contact pairs. The ultrasonic force and average stress at the bond zone are extracted from the numerical experiments for a $50{\mu}m$ diameter free air ball deformed by a capillary with a hole diameter of $35{\mu}m$ at the tip, a chamfer diameter of $51{\mu}m$, a chamfer angle of $90^{\circ}$, and a face angle of $1^{\circ}$. An upper limit of the ultrasonic amplitude during impact is derived below which the ultrasonic shear stress at the interface is not higher than 120 MPa, which can be recommended for low stress bonding.

• 대한한방소아과학회지
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• 제27권1호
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• pp.50-58
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• 2013

Objectives The purpose of this study is to know the present uses of pre-packed herbal medicine and their usefulness in Korean University Oriental Medicine Hospitals. Methods We selected 29 university hospitals to survey by using telephone and by mail. Results 1. The kind of packages that 29 hospitals uses were 2 layers, 3 layers and 3 layers with aluminum as the component layer, standing or non-standing pouch. 2. Total 24.1% hospitals are using 3 layers patch with aluminum because of their merits. The merits are preserving the quality of packaged drugs, blocking sun lights and beautiful looking, gas barrier properties and an opening convenience. 3. However, the 3 layers with aluminum packages were little bit more expensive and it can't be used in the microwaves. Conclusions This study revealed that 3 layers with aluminum packages were superior to any other packages because it can keep original flavor and properties, block sun light, and an easy opening convenience. Thus, aluminum contained 3 layer packages are better to preserve herbal medicines.

• 생명과학회지
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• 제17권3호통권83호
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• pp.362-367
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• 2007

본 연구는 포장방법에 따른 사슴고기의 냉장저장 중 이화화적 성질의 변화에 대해 알아 보기 위하여 실시하였다. 생체중 220 $kg{\pm}10$ kg내외의 Elk 암컷 5마리를 도축하여 24시간 냉각한 후 발골하였고, 배최장근과 대퇴 근을 채취 하여 냉장온도로 25일간 유지하면서 비교 분석하였다. 보수성은 저장기간이 경과함에 따라 감소하는 경향이었고, 진공포장저장구가 보수성이 가장 낮았다. 저장기간이 경과함에 따라 TBARS가는 증가하였고, 진공포장저장구가 가장 낮은 TBARS가를 나타내었다. 저장기간이 경과함에 따라 VBN가는 증가하였고, 진공포장저 장구가 가장 낮은 VBN가를 나타내었다. pH는 저장기간이 경과함에 따라 증가하였고, 진공포장한 처리구가 가장 낮았다. 저장기간이 경과함에 따라 함기포장 처리구는 증가하였으나, 진공 포장처리구와 가스치환 포장처리구는 연도가 감소하였다. 대퇴근의 밝기는 포장방법에 따른 차이가 나타나지 않았고, 배최장근은 진공포장 처리구가 함기포장 처리구와 가스치환 포장처리구보다 유의적으로 밝았다. 대체적으로 진공포장 처리구가 함기포장 처리구와 가스치환 처리구보다 적색도가 높게 나타났다. 황색도는 저장기간 경과에 따라 증가 후 감소하는 경향을 나타내었고, 진공포장 처리구가 대체적으로 황색도 높았다.

• 대한전자공학회논문지SD
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• 제47권7호
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• pp.37-43
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• 2010

영상데이터의 용량이 늘어남에 따라, 시리얼 링크의 전송속도는 점점 빨라지고 있다. 따라서 기존에 제시되었던 상용화규격도 계속해서 전송속도를 상향시킨 차기 버전을 제안하고 있다. 차기 버전은 기존 버전과 호환성을 갖춰야 하므로 두 가지 이상의 전송속도로 동작할 수 있는 송수신기 회로가 필요하다. 본 논문에서는 4개의 채널을 가지며, 3.2 Gb/s 또는 6.4 Gb/s의 전송속도로 동작하는 송신기를 설계하였다. 이 송신기는 1, 1.5, 2, 3배의 pre-emphasis를 선택적으로 사용할 수 있으며, 출력 스윙을 200, 300, 400, 600 mVdiff,p2p로 선택할 수 있다. 설계된 송신기는 $0.13{\mu}m$ CMOS 공정을 이용하여 제작되었으며, COB 패키징을 이용하여 PCB에 실장되어 검증되었다.

• Human Ecology Research
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• 제55권6호
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• pp.593-607
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• 2017

Cosmetics market information is important due to advances in information communication technology and the growth of cosmetics market. This study analyzed the relationship between the pre-purchase utilization of information (commercial, neutral, personal and experiential) and the post-purchase satisfaction of skin care cosmetics, categorized as functionality, safety, economic feasibility, information reliability, purchase convenience, condition of purchase place, packaging/design of product and service. This study analyzed reliability, frequency, differences, correlation and regression analysis using SPSS ver. 24.0. The study results are summarized as follows. First, gender was a significant variable in the level of information source utilization. Women used commercial, neutral, and experiential information sources more actively than men. However, women had lower post-purchase satisfaction that could be understood through expectation disconfirmation theory. Women have very high expectations that can lower post-purchase satisfaction. Second, information source utilization can improve post-purchase satisfaction for cosmetics. The consumer post-purchase satisfact the lowest in the commercial information source; however, consumers were satisfied when the commercial informationinformation sourceenon and regre. Third, the consumeried itnformation sourceenon and regression analysis ial, neutral,source and reflected the characteristics of experiential goods. Therefore, companies should provide accurate commercial, personal and experiential information to increase consumervide accurate commercial, per as well as conduct experiential marketing.

• 한국식품과학회지
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• 제31권6호
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• pp.1557-1562
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• 1999

건멸치의 저장법 개발을 위한 일련의 연구로써 건멸치의 흡습특성을 조사하고, 선택된 포장조건에서 위생화에 필요한 5 kGy의 감마선을 처리한 다음 저장성 예측시험을 수행하였다. 건멸치의 등온흡습곡선으로부터 구한 BET 단분자층 수분함량은 5.47%, 이에 해당되는 수분활성은 0.15로써 품질안정성을 유지하기 위해서는 낮은 수분활성의 유지와 방습 포장이 필요한 것으로 나타났다. 폴리에틸렌필름(0.1 mm)과 접합필름(nylon/polyethylene, NY/PE)으로 포장된 건멸치에 5 kGy의 감마선을 조사한 다음 $15^{\circ}C/68%\;RH,\;25^{\circ}C/75%RH$ 및 $35^{\circ}C/84%$ RH의 조건에 각각 저장하면서 품질변화를 측정하였다. 건멸치 품질지표성분으로 확인된 갈변반응과 관능적 기호도 변화의 속도상수는 저장온도에 비례하여 포장재와 감마선 조사에 따라 $2.17{\sim}2.40$범위의 온도계수$(Q_{10})$를 나타내었다. 그리고 25℃에서의 shelf-life는 비조사구의 PE와 NY/PE 포장이 각각 84일과 125일, 감마선 조사구(5 kGy)의 PE와 NY/PE 포장은 각각 126일과 138일로 나타나, 적정선량의 감마선 조사와 접합포장재의 사용은 건멸치의 위생적 품질개선은 물론 저장성 향상에도 효과적으로 나타났다.

• 한국정보통신학회:학술대회논문집
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• 한국정보통신학회 2015년도 추계학술대회
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• pp.603-606
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• 2015

The post-production of smart farming defines the stage that the final products are delivered from producer to consumers via market on ICT network. It deals with the process of product packaging and distribution from producer to consumer with marketing strategy. This focus on reference model for post-production service including specialization, centralization of product delivery, and just-in-time delivery, and marketing system on the network. It defines a significant function component on post-production stage. The producer plays a significant role in economy being one of the main contributors to the many customers. This articles suggest the effective product distribution service which requires delivering the right product, in the right quantity, in the right condition, to the right place, at the right time, for the right cost, and encompassing global marketing based on ICT network, will be provided[1].

• 한국식품영양과학회지
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• 제28권2호
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• pp.371-377
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• 1999

In order to evaluate the antimicrobial function of natural herb extracts as antimicrobial agent or packaging material for the preservation of foods and greenhouse produce, the water extract of chopi (Zanthoxylum piperitum DC.) was prepared and its antimicobial activity was determined. In the paper disk test its antimicrobial activity was increased in proportion to its concentraion. The growth of microorganisms was completely inhibited above 500ppm of its concentration. It showed wide spectrum of thermal(40 to 180oC) and pH(4 to 10) stabilities. In the electronic microscopic observation(TEM and SEM) of microbial morphological change it showed to decrease the activation of physiological enzymes and to lose the function of cell membranes. Even in the activation test of galactosidase, it seemed to weaken the osmotic function of cell membranes remarkably in comparison with chloroform and its activation corresponded to 40~50% of toluene. Zanthoxylum piperitum DC. extract seemed to be an excellent antimicrobial for the inhibition of food borne microorganisms as well as the pre servation of greenhouse produces.