• The Research Journal of the Costume Culture
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• v.22 no.6
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• pp.890-898
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• 2014

This study focuses on the effects of dyeing conditions and mordanting conditions, changes of colorfastness, antibacterial properties and UV protective of silk fabric dyed with Laminaria japonica extracts. A natural colorant was extracted from Laminaria japonica using distilled water as extractants. According to the results, maximum dye uptake (K/S) were obtained at 100% V/V colorant concentration, $80^{\circ}C$, 60 min and pH 2. Silk fabric was dyed with Laminaria japonica extract at $80^{\circ}C$ for 60 min with pre-treatment or post-treatment of various metal salts as mordants. The Laminaria japonica extracts produced yellow hue on silk fabric in pre-mordanting and manifested green yellow hue mordanted with $CuSO_4$ in post-mordanting method. Mordant $CuSO_4$ for silk fabric was found to give good light fastness (rating 4). UV protection property did not increase significantly upon mordanting.

• Journal of the Korean institute of surface engineering
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• v.36 no.1
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• pp.59-68
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• 2003

Zinc phosphating for cold forming of steel was studied with emphasis on decreasing phosphating temperature. To lower phosphating temperature, some techniques, such as adding Cu ion into bath, using activator in the form of pre-dip, and aeration in bath, instead of using conventional accelerator, namely oxidizing agent, have been tried. It was revealed that phosphating, leading to coatings of improved uniformity and fine crystal size, can be carried out using above techniques at lower temperature (55$^{\circ}C$) compared to conventional phosphating temperature ($80∼90^{\circ}C$). Under present condition, it was seen that optimum concentrations of Cu ion in phosphating bath and activator in pre-dip are 0.015 % (w/w) and 2.0 g/1, respectively. The coating weight was within the range of $\15∼20 g/m^2$. When lubricant was applied into phosphating coatings, the amount of lubricating component (total soap) was found to be$ 6∼10 g/\m^2$ and the lubricated panel revealed excellent lubricating properties.

• Journal of the Korean Applied Science and Technology
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• v.27 no.4
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• pp.445-451
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• 2010

To prepare very stable acrylic type emulsion having a visible ray absorption property, in-situ preparation technique of $Cu_xS$ nanoparticle was adopted. Firstly, the acylic emulsions of methyl methacrylate(MMA), butyl acrylate(BA), and acrylonitrile(AN) were synthesized by pre-emulsion polymerization at $60^{\circ}C$ in the presence of anionic surfactant. Secondly, $Cu_xS$ nanocomposited emulsions were directly prepared in the prepolymerized acrylic emulsion with $CuSO_4$ at $50^{\circ}C$. The presnce of $Cu_xS$ nanoparticle in emulsion was confirmed by SEM and EDS. The final $Cu_xS$ nanocomposited emulsion showed an olive-green colour and good emulsion stability up to 1 month. In addition the PET films coated with our $Cu_xS$ nanocomposited emulsion absorbed effectively the visible ray.

• Journal of the Korean Vacuum Society
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• v.9 no.2
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• pp.144-149
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• 2000

Variables affecting the passivation capability of Cu(Mg) alloy films, which were sputter deposited from a Cu (4.5 at. %) target, have been investigated. The results show that the passivation capability of a Cu(Mg) alloy film is a function of annealing temperature, $O_2$ pressure, and Mg content in the film. Increasing the annealing temperature up to $500^{\circ}C$ favors formation of a dense MgO layer on the surface which has a growth limited thickness of 150 $\AA$. Decreasing the $O_2$ pressure enhances the preferential oxidation of Mg over Cu. Furthermore, increasing the Mg content in the Cu(Mg) film promotes formation of a dense MgO layer. Vacuum pre-annealing was found to be very effective in segregating Mg to the surface, facilitating the passivation capability of the Cu(Mg) alloy film even when the Mg content is low. In the current study, self-aligned MgO layers with low resistivity and an effective passivation capability over the Cu surface, have been obtained by manipulating these factors when Cu(Mg) thin films are annealed.

• Korean Journal of Materials Research
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• v.22 no.9
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• pp.459-464
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• 2012

We investigated cleaning effects using $NH_4OH$ solution on the surface of Cu film. A 20 nm Cu film was deposited on Ti / p-Si (100) by sputter deposition and was exposed to air for growth of the native Cu oxide. In order to remove the Cu native oxide, an $NH_4OH$ cleaning process with and without TS-40A pre-treatment was carried out. After the $NH_4OH$ cleaning without TS-40A pretreatment, the sheet resistance Rs of the Cu film and the surface morphology changed slightly(${\Delta}Rs:{\sim}10m{\Omega}/sq.$). On the other hand, after $NH_4OH$ cleaning with TS-40A pretreatment, the Rs of the Cu film changed abruptly (${\Delta}Rs:till{\sim}700m{\Omega}/sq.$); in addition, cracks showed on the surface of the Cu film. According to XPS results, Si ingredient was detected on the surface of all Cu films pretreated with TS-40A. This Si ingredient(a kind of silicate) may result from the TS-40A solution, because sodium metasilicate is included in TS-40A as an alkaline degreasing agent. Finally, we found that the $NH_4OH$ cleaning process without pretreatment using an alkaline cleanser containing a silicate ingredient is more useful at removing Cu oxides on Cu film. In addition, we found that in the $NH_4OH$ cleaning process, an alkaline cleanser like Metex TS-40A, containing sodium metasilicate, can cause cracks on the surface of Cu film.

• Journal of the Korean Electrochemical Society
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• v.25 no.2
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• pp.81-87
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• 2022

In this study, the effect of alkylamine on copper electroplating was analyzed using cyclic voltammetry. When water-soluble alkylamines were added to the plating solution, the reduction reaction of Cu²⁺ was inhibited. The inhibition effect of 1,12-diaminododecane has been investigated at various concentrations and conditions of the plating solution. 1,12-diaminododecane was protonated in the acidic plating solution, and therefore, it did not act as a complexing agent for Cu²⁺. Accordingly, it was confirmed that the inhibiton effect of 1,12-diaminododecane was attributed to adsorption on the Cu surface. The adsorption of 1,12-diaminododecane exhibits two characteristics: (i) protonation and subsequent electrostatic attraction with anions pre-adsorbed on Cu surface, and (ii) direct adsorption on Cu surface via amine functional group. The adsorbed 1,12-diaminododecane caused three-dimensional growth and grain refining, as well as the inhibition effect, during Cu electroplating.

• Journal of the Korean Magnetics Society
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• v.5 no.5
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• pp.507-510
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• 1995

A heat-treatment method of pre-annealing and then flash annealing(FA) has been used to improve the soft magnetic properties of nanocrystalline $Fe_{76}CuSi_{13}B_{10}$ and $Fe_{74}CuNb_{3}Si_{12}B_{10}$ alloys. Outstanding magnetic properties of nanocrystalline $Fe_{74}CuNb_{3}Si_{12}B_{10}$ alloy were attained by flash-annealing in air after annealed at $500^{\circ}C$ for 0.5hr below the crystallization temperature. The same results were obtained for $Fe_{74}CuSi_{13}B_{10}$ alloy. The measurment of relief of stress and X-ray diffraction were used to analyze the effect of flashannealing.

• Nano
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• v.13 no.10
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• pp.1850114.1-1850114.7
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• 2018

Here we report an optimized hot-injection method and a phase transfer strategy for the synthesis of water-soluble $CuInS_2$ QDs with desired properties. The structure and morphology studies demonstrate that the resulting QDs are $CuInS_2$ tetragonal phase with well-defined facets. It is also found that the crystal size gradually increases with the increase of reaction temperature, while the surface of QDs with pre- and post-phase transfer is functionalized with hydrophobic and hydrophilic ligands, respectively. Spectroscopy measurements reveal the size-dependent optical properties of $CuInS_2$ QDs, demonstrating the quantum confinement effect in this system.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.1
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• pp.47-53
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• 2012

Bonding strength of Sn-3.0Ag-0.5Cu solder joint due to degradation characteristic of OSP surface finish was investigated, compared with SnPb finish. The thickness variation and degradation mechanism of organic solderability preservative(OSP) coating were also analyzed with the number of reflow process. To analyze the degradation degree of solder joint strength, FR-4 PCB coated with OSP and SnPb were experienced preheat treatment as a function of reflow number from 1st to 6th pass, respectively. After 2012 chip resistors were soldered with Sn-3.0Ag-0.5Cu on the pre-heated PCB, the shear strength of solder joints was measured. The thickness of OSP increased with increase of the number of reflow pass by thermal degradation during the reflow process. It was also observed that the preservation effect of OSP decreased due to OSP degradation which led Cu pad oxidation. The mean shear strength of solder joints formed on the Cu pads finished with OSP and SnPb were 58.1 N and 62.2 N, respectively, through the pre-heating of 6 times. Although OSP was degraded with reflow process, the feasibility of its application was proven.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.3
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• pp.31-37
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• 2009

Cu-Cu thermo-compression bonding process was successfully developed as functions of the $N_2+H_2$ forming gas annealing conditions before and after bonding step in order to find the low temperature bonding conditions of 3-D integrated technology where the quantitative interfacial adhesion energy was measured by 4-point bending test. While the pre-annealing with $N_2+H_2$ gas below $200^{\circ}C$ is not effective to improve the interfacial adhesion energy at bonding temperature of $300^{\circ}C$, the interfacial adhesion energy increased over 3 times due to post-annealing over $250^{\circ}C$ after bonding at $300^{\circ}C$, which is ascribed to the effective removal of native surface oxide after post-annealing treatment.