• 한국전자파학회논문지
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• 제25권7호
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• pp.791-794
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• 2014

본 논문에서는 65-nm CMOS 공정을 이용하여 300 GHz 주파수 대역의 영상 검출기를 제작하고, 이에 기반하여 영상을 획득하였다. 검출기 회로 구조는 square-law 동작에 기초를 두고 있다. 제작된 검출기는 285 GHz에서 2,270 V/W의 최대 반응도(responsivity)와 $38pW/Hz^{1/2}$의 최소 NEP(Noise Equivalent Power)를 보였으며, 250~305 GHz의 범위에서 NEP< ${\sim}200pW/Hz^{1/2}$를 보였다. 측정용 패드와 밸룬(Balun)을 포함한 제작된 칩의 크기는 $400{\mu}m{\times}450{\mu}m$이며, 측정용 요소들을 제외한 주요 칩의 크기는 $150{\mu}m{\times}100{\mu}m$이다.

• 전기학회논문지
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• 제62권12호
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• pp.1678-1687
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• 2013

This paper describes a prototype of 3-phase 3.3kV/220V 6kVA modular semiconductor transformer developed in the lab for feasibility study. The developed prototype is composed of three single-phase units coupled in Y-connection. Each single-phase unit with a rating of 1.9kV/127V 2kVA consists of a high-voltage high-frequency resonant AC-DC converter, a low-voltage hybrid-switching DC-DC converter, and a low-voltage hybrid-switching DC-AC converter. Also each single-phase unit has two DSP controllers to control converter operation and to acquire monitoring data. Monitoring system was developed based on LabView by using CAN communication link between the DSP controller and PC. Through various experimental analyses it was verified that the prototype operates with proper performance under normal and sag condition. The system efficiency can be improved by adopting optimal design and replacing the IGBT switch with the SiC MOSFET switch. The developed prototype confirms a possibility to build a commercial high-voltage high-power semiconductor transformer by increasing the number of series-connected converter modules in high-voltage side and improving the performance of switching element.

• JSTS:Journal of Semiconductor Technology and Science
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• 제14권4호
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• pp.427-435
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• 2014

Segmented-channel MOSFETs (SegFETs) can achieve both good performance and variation robustness through the use of $HfO_2$ (a high-k material) to create the shallow trench isolation (STI) region and the very shallow trench isolation (VSTI) region in them. SegFETs with both an HTI region and a VSTI region (i.e., the STI region is filled with $HfO_2$, and the VSTI region is filled with $SiO_2$) can meet the device specifications for high-performance (HP) applications, whereas SegFETs with both an STI region and a VHTI region (i.e., the VSTI region is filled with $HfO_2$, and the STI region is filled with $SiO_2$) are best suited to low-standby power applications. AC analysis shows that the total capacitance of the gate ($C_{gg}$) is strongly affected by the materials in the STI and VSTI regions because of the fringing electric-field effect. This implies that the highest $C_{gg}$ value can be obtained in an HTI/VHTI SegFET. Lastly, the three-dimensional TCAD simulation results with three different random variation sources [e.g., line-edge roughness (LER), random dopant fluctuation (RDF), and work-function variation (WFV)] show that there is no significant dependence on the materials used in the STI or VSTI regions, because of the predominance of the WFV.

• 대한전자공학회논문지SD
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• 제45권10호
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• pp.7-14
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• 2008

본 논문에서는 $1.0{\mu}m$ BCD 650V 공정을 이용하여 향상된 잡음 내성과 높은 전류 구동 능력을 갖는 고전압 구동 IC를 설계하였다. 설계된 고전압 구동 IC는 500kHz의 고속 동작이 가능하고, 입력 전압의 범위가 최대 650V이다. 설계된 IC에 내장된 상단 레벨 쉬프터는 잡음 보호회로와 슈미트 트리거를 포함하고 있으며 최대 50V/ns의 높은 dv/dt 잡음 내성을 가지고 있다. 또한 설계된 숏-펄스 생성회로가 있는 상단 레벨 쉬프터의 전력 소모는 기존 회로 대비 40% 이상 감소하였다. 이외에도 상 하단 파워 스위치의 동시 도통을 방지하는 보호회로와 구동부의 전원 전압을 감지하는 UVLO(Under Voltage Lock-Out) 회로를 내장하여 시스템의 안정도를 향상시켰다. 설계된 고전압 구동 IC의 특성 검증에는 Cadence사의 spectre 및 PSpice를 이용하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 추계학술대회 논문집
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• pp.55-55
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• 2009

Silicon Carbide (SiC) is a material with a wide bandgap (3.26eV), a high critical electric field (~2.3MV/cm), a and a high bulk electron mobility (${\sim}900cm^2/Vs$). These electronic properties allow high breakdown voltage, high frequency, and high temperature operation compared to Silicon devices. Although various SiC DMOSFET structures have been reported so far for optimizing performances. the effect of channel dimension on the switching performance of SiC DMOSFETs has not been extensively examined. In this paper, we report the effect of the interface states ($Q_s$) on the transient characteristics of SiC DMOSFETs. The key design parameters for SiC DMOSFETs have been optimized and a physics-based two-dimensional (2-D) mixed device and circuit simulator by Silvaco Inc. has been used to understand the relationship with the switching characteristics. To investigate transient characteristic of the device, mixed-mode simulation has been performed, where the solution of the basic transport equations for the 2-D device structures is directly embedded into the solution procedure for the circuit equations. The result is a low-loss transient characteristic at low $Q_s$. Based on the simulation results, the DMOSFETs exhibit the turn-on time of 10ns at short channel and 9ns at without the interface charges. By reducing $SiO_2/SiC$ interface charge, power losses and switching time also decreases, primarily due to the lowered channel mobilities. As high density interface states can result in increased carrier trapping, or recombination centers or scattering sites. Therefore, the quality of $SiO_2/SiC$ interfaces is important for both static and transient properties of SiC MOSFET devices.