• Applied Chemistry for Engineering
• /
• v.22 no.6
• /
• pp.623-626
• /
• 2011

Various poly(amic acid)s were synthesized from PMDA/BPDA/p-PDA/ODA with different mole ratios and effectively converted into 4-component polyimide films by thermal imidization. The chemical structures and thermo-mechanical properties of polyimide films were examined using Fourier transform infrared spectroscopy (FT-IR), thermo-gravimetric analyzer (TGA), thermo-mechanical analyzer (TMA), dynamic mechanical analyzer (DMA) and universal tensile machine (UTM). The tensile strength, modulus, and thermal properties of polyimides films increased with the amount of rigid PMDA and p-PDA, while the elongation and moisture absorption of polyimide films increased with the amount of flexible BPDA and ODA. One of 4-component polyimide films exhibited a similar coefficient of thermal expansion (CTE) value to that of copper when it was composed of PMDA : BPDA : p-PDA : ODA with the ratio of 5 : 5 : 4 : 6. Thus, this polyimide film could be useful for a base film for flexible copper clad laminates (FCCL) of flexible printed circuit boards.

• Korean Chemical Engineering Research
• /
• v.58 no.4
• /
• pp.651-657
• /
• 2020

Fluidization processes in which solid particles vividly move like gas or liquid have been widely used in various industrial sectors, such as thermochemical energy conversion and polymerization processes for general purpose polymer resins. One of the general purpose polymer resins, LLDPE(Linear low-density polyethylene) resins have been produced in bubbling fluidized bed processes in the world. In a bubbling fluidization polymerization reactors, LLDPE particles with relatively larger particle size and low density are fluidized by hydrogen gas for polymerization reaction. Though LLDPE polymerization reactors are one of bubbling fluidization processes, slugs that have negative impact for reaction exist or occur in these processes. Therefore, the fluidization state of LLDPE particles was investigated in a simulation model similar to a pilot-scale polymerization reactor (0.38 m l.D., 4.4 m High). In particular, the effect of gas velocity (0.45-1.2 m/s), solid density (900-199 kg/㎥), solid sphericity (0.5-1.0), and average particle size (120-1230 ㎛), on bed height and fluidization state were measured by using a CPFD(Computational particle-fluid dynamics) method. With CPFD analysis, the occurrence of a flat slug was visualized. Also, the change in particle properties, such as particle density, sphericity, and size, could reduce the occurrence of slug and bed expansion.

• Journal of the Korea institute for structural maintenance and inspection
• /
• v.17 no.6
• /
• pp.21-30
• /
• 2013

As increasing number of large-size earthquake, the social interest of seismic retrofitting of RC structure is growing. Especially, the RC columns that are not reflected seismic design can not resist lateral loads by the earthquake. The brittle fracture of Non-seismic designed columns lead to full collapse of the building. Thus, the emergency columns reinforcement method is needed. That have a fast construction time, do not cause damage to the column. In the past, cross-sectional expansion method, a steel plate reinforcing method is applied mainly, but in recent years, carbon fiber sheet taking advantage of FRP (Fiber Reinforced Polymer) is widely used. In this study, retrofitting effect of seismic performance of FRP seismic reinforcement, which is possible to emergency construction, was examined. Reinforced concrete specimens were constructed to experimental study. The seismic performence of specimes retrifitted with FRP seismic reinforcement were evaluated. As a result, the seismic performance of specimen reinforced with FRP seismic reinforcement has been improved.

• Journal of the Korean Geotechnical Society
• /
• v.20 no.3
• /
• pp.23-31
• /
• 2004

Normally, coating is used for protecting reinforced concrete. For this purpose, both organic and inorganic coatings are used. The advantages of inorganic coatings are lower absorption of UV, non-burning etc. On the other hand, organic coatings have the advantage of low permeability of $CO_2, SO_2$ and water. Organic coatings provide better protection for reinforced concrete. However, organic coatings such as epoxy, urethane and acryl reduce long-term adhesive strength by the difference of their thermal expansion coefficients and elastic modules from those of concrete, and the formed coating cover of these is blistered by poor breathing. Also, when organic coatings are applied to the wet surface of concrete, they have a problem with adhesion. In this study, a new coating material for protecting concrete was hybridized with polymer and ceramics. And tests were carried out on its physical and durable characteristics, and safety characteristic on elution. All results were compared with organic coating materials and epoxies and showed that the performance of the developed coating material was not inferior to that of other organic coatings in protecting concrete. On the other hand, safety characteristic on elution was superior to epoxies which were used in this study. So, the developed coating material was considered as a suitable protecting coating material which have advantages of inorganic and organic coatings for protecting underground concrete structures, especially in contact with water.

• Journal of Adhesion and Interface
• /
• v.25 no.1
• /
• pp.169-274
• /
• 2024

Recent attention has been drawn to materials that undergo reversible expansion and contraction in response to external stimuli, leading to morphological changes. These materials hold potential applications in various fields including soft robotics, sensors, and artificial muscles. In this study, a novel material capable of responding to high temperatures for protection or encapsulation is proposed. To achieve this, liquid crystal elastomer (LCE) with nematic-isotropic transition properties and polyimide (PI) with high mechanical strength and thermal stability were utilized. To utilize a solution process, a dope solution was synthesized and introduced into micro-printing techniques to develop a two-dimensional pattern of LCE/PI bilayer structures with sub-millimeter widths. The honeycomb-patterned LCE/PI bilayer mesh combined the mechanical strength of PI with the high-temperature contraction behavior of LCE, and selective printing of LCE facilitated deformation in desired directions at high temperatures. Consequently, the functionality of selectively and reversibly encapsulating specific high-temperature materials was achieved. This study suggests potential applications in various actuator fields where functionalities can be implemented across different temperature ranges without the need for electrical energy input, contingent upon molecular changes in LCE.

• Transactions on Electrical and Electronic Materials
• /
• v.14 no.3
• /
• pp.133-138
• /
• 2013

Acrylonitrile-butadiene-styrene (ABS) plastic is a polymer material extensively used in electrical and electronic applications. Nickel (Ni) thin film was deposited on ABS by electroless plating, after its surface was treated and modified with atmospheric plasma generated by means of dielectric barrier discharges (DBDs) in air. The method in this study was developed as a pre-treatment for electroless plating using DBDs, and is a dry process featuring fewer processing steps and more environmentally friendliness than the chemical method. After ABS surfaces were modified, surface morphologies were observed using a scanning electron microscope (SEM) to check for any physical changes of the surfaces. Cross-sectional SEM images were taken to observe the binding characteristics between metallic films and ABS after metal plating. According to the SEM images, the depths of ABS by plasma are shallow compared to those modified by chemically treatment. The static contact angles were measured with deionized (DI) water droplets on the modified surfaces in order to observe for any changes in chemical activities and wettability. The surfaces modified by plasma showed smaller contact angles, and their modified states lasted longer than those modified by chemical etching. Adhesion strengths were measured using 3M tape (3M 810D standard) and by 90° peel-off tests. The peel-off test revealed the stronger adhesion of the Ni films on the plasma-modified surfaces than on the chemically modified surfaces. Thermal shock test was performed by changing the temperature drastically to see if any detachment of Ni film from ABS would occur due to the differences in thermal expansion coefficients between them. Only for the plasma-treated samples showed no separation of the Ni films from the ABS surfaces in tests. The adhesion strengths of metallic films on the ABS processed by the method developed in this study are better than those of the chemically processed films.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2000.04a
• /
• pp.43-55
• /
• 2000

In traditional electronic packages the die and the substrate are interconnected with fine wire. Wire bonding technology is limited to bond pads around the peripheral of the die. As the demand for I/O increases, there will be limitations with wire bonding technology. Flip chip technology eliminates the need for wire bonding by redistributing the bond pads over the entire surface of the die. Instead of wires, the die is attached to the substrate utilizing a direct solder connection. Although several steps and processes are eliminated when utilizing flip chip technology, there are several new problems that must be overcome. The main issue is the mismatch in the coefficient of thermal expansion (CTE) of the silicon die and the substrate. This mismatch will cause premature solder Joint failure. This issue can be compensated for by the use of an underfill material between the die and the substrate. Underfill helps to extend the working life of the device by providing environmental protection and structural integrity. Flux residues may interfere with the flow of underfill encapsulants causing gross solder voids and premature failure of the solder connection. Furthermore, flux residues may chemically react with the underfill polymer causing a change in its mechanical and thermal properties. As flip chip packages decrease in size, cleaning becomes more challenging. While package size continues to decrease, the total number of 1/0 continue to increase. As the I/O increases, the array density of the package increases and as the array density increases, the pitch decreases. If the pitch is decreasing, the standoff is also decreasing. This paper will present the keys to successful flip chip cleaning processes. Process parameters such as time, temperature, solvency, and impingement energy required for successful cleaning will be addressed. Flip chip packages will be cleaned and subjected to JEDEC level 3 testing, followed by accelerated stress testing. The devices will then be analyzed using acoustic microscopy and the results and conclusions reported.

• Journal of the Microelectronics and Packaging Society
• /
• v.13 no.3 s.40
• /
• pp.39-45
• /
• 2006

This study was investigated the thermal properties of underfill with various epoxy resins using thermal analysis methods such as differential scanning calorimetry (DSC), thermo gravimetry analysis (TGA), dynamic mechanical analysis (DMA) and thermo-mechanical analysis (TMA). And, the adhesion strength of the underfills/FR-4 substrate was evaluated. The glass transition temperature (Tg) of underfill which was composed the cycolaliphatic epoxy resin was lower than that of underfill which was not composed the cycolaliphatic epoxy resin. The thermal degradation of underfill was composed of two processes, which involved chemical reactions between the degrading polymer and oxygen from the air atmosphere. The coefficient of thermal expansion (CTE) of underfill which was composed the cycolaliphatic epoxy resin was higher than that of underfill which was not composed the cycolaliphatic epoxy resin. The excessive curing temperatures caused a weak boundary layer of epoxy resin, which resulted in a deterioration of mechanical properties in the epoxy resin and thus led to poor adhesion property between the underfill/FR-4 substrate.

• Composites Research
• /
• v.30 no.6
• /
• pp.371-378
• /
• 2017

In this study, hygroelastic behavior of thermosetting epoxy is predicted by molecular dynamics simulations. Since consistent exposures to humid environments lead to macroscopic degradation of polymer composite, computational simulation study of the hygroscopically aged epoxy cell is essential for long-time durability. Therefore, we modeled amorphous epoxy molecular unit cell structures at a crosslinking ratio of 30, 90% and with the moisture weight fraction of 0, 4 wt% respectively. Diglycidyl ether of bisphenol F (EPON862) and triethylenetetramine (TETA) are chosen as resin and curing agent respectively. Incorporating equilibrium and non-equilibrium ensemble simulation with a classical interatomic potential, various hygroelastic properties including diffusion coefficient of water, coefficient of moisture expansion (CME), stress-strain curve and elastic modulus are predicted. To establish the structural property relationship of pure epoxy, free volume and internal non-bond potential energy of epoxy are examined.

• Korea-Australia Rheology Journal
• /
• v.13 no.4
• /
• pp.169-177
• /
• 2001

Morphological, thermal, rheological, and mechanical properties of reactive compatabilized blends of poly(butylene terephthalate) (PBT) and Polyamide-6 (PA) containing EGMA copolymer were investigated using scanning electron microscopy (SEM), differential scanning calorimetry (DSC), advanced rheometric expansion system (ARES), and universal testing machine (UTM). From the results of thermal analysis by DSC, the melting point of the 30/70 PBT-PA blend was broadened after EGMA was added in the blends, since the enthalpy of melting of the PBT-PA somewhat decreased with the increase of EGMA content. From this result, it is suggested that the EGMA affected to the crystallization behavior and crystallinity of the PBT-PA blends. From SEM micrographs of the 70/30, 50/50, and 30/70 PBT-PA blends, the droplet size of the 30/70 PBT-PA blend was about 0.8 ${\mu}{\textrm}{m}$ which was smaller than that of the 50/50 and 70/30 PBT-PA blends. The complex viscosity of the 30/70 PBT-PA blend observed to be higher than that of the 50/50 and 70/30 PBT-PA blends. From the results of the morphology and rheological properties for the PBT-PA blends, it is suggested that the compatibility is increased in the 30/70 PBT-PA blend than the 50/50 and 70/30 PBT-PA blends. From the results of mechanical properties, it was found that the tensile strength of the 30/70 PBT-PA blend increased with the increase of EGMA up to 2 phr, while tensile strength of the blend in which EGMA content was higher than 2 phr decreased with the increase of EGMA content. From the results of morphological, thermal, rheological, and mechanical properties for the PBT-PA-EGMA blends, it is suggested that the EGMA could be used as a compatibilization role in the blends.