• 제목/요약/키워드: polymer bonding

검색결과 402건 처리시간 0.059초

폴리머 마이크로 장치에 대한 레이저 투과 마이크로 접합 (Analysis of Transmission Infrared Laser Bonding for Polymer Micro Devices)

  • 김주한;신기훈
    • Journal of Welding and Joining
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    • 제23권5호
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    • pp.55-60
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    • 2005
  • A precise bonding technique, transmission laser bonding using energy transfer, for polymer micro devices is presented. The irradiated IR laser beam passes through the transparent part and absorbed on the opaque part. The absorbed energy is converted into heat and bonding takes place. In order to optimize the bonding quality, the temperature profile on the interface must be obtained. Using optical measurements of the both plates, the absorbed energy can be calculated. At the wavelength of 1100nm $87.5\%$ of incident laser energy was used for bonding process from the calculation. A heat transfer model was applied for obtaining the transient temperature profile. It was found that with the power of 29.5 mW, the interface begins to melt and bond each other in 3 sec and it is in a good agreement with experiment results. The transmission IR laser bonding has a potential in the local precise bonding in MEMS or Lab-on-a-chip applications.

Pinning retrofit technique in masonry with application of polymer-cement pastes as bonding agents

  • Shrestha, Kshitij C.;Pareek, Sanjay;Suzuki, Yusuke;Araki, Yoshikazu
    • Earthquakes and Structures
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    • 제5권4호
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    • pp.477-497
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    • 2013
  • This paper reports extensive experimental study done to compare workability and bond strength of five different types of polymer-based bonding agents for reinforcing bars in pinning retrofit. In pinning retrofit, steel pins of 6 to 10 mm diameters are inserted into holes drilled diagonally from mortar joints. This technique is superior to other techniques especially in retrofitting historic masonry constructions because it does not change the appearance of constructions. With an ordinary cement paste as bonding agent, it is very difficult to insert reinforcing bars at larger open times due to poor workability and very thin clearance available. Here, open time represents the time interval between the injection of bonding agent and the insertion of reinforcing bars. Use of polymer-cement paste (PCP), as bonding agent, is proposed in this study, with investigation on workability and bond strengths of various PCPs in brick masonry, at open times up to 10 minutes, which is unavoidable in practice. Corresponding nonlinear finite element models are developed to simulate the experimental observations. From the experimental and analytical study, the Styrene-Butadiene Rubber polymer-cement paste (SBR-PCP) with prior pretreatments of drilled holes showed strong bond with minimum strength variation at larger open times.

폴리머를 이용한 CIS(CMOS Image Sensor) 디바이스용 웨이퍼 레벨 접합의 warpage와 신뢰성 (A Reliability and warpage of wafer level bonding for CIS device using polymer)

  • 박재현;구영모;김은경;김구성
    • 마이크로전자및패키징학회지
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    • 제16권1호
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    • pp.27-31
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    • 2009
  • 본 논문에서는 웨이퍼 레벨 기술을 이용한 CIS용 폴리머 접합 기술을 연구하고 접합 후의 warpage 분석과 개별 패키지의 신뢰성 테스트를 수행하였다. 균일한 접합 높이를 유지하기 위하여 glass 웨이퍼 상에 dam을 형성하고 접합용 폴리머 층을 patterning하여 Si과 glass 웨이퍼의 접합 테스트를 수행하였다. Si 웨이퍼의 접합온도, 접합 압력 그리고 접합 층이 낮을수록 warpage 결과가 감소하였으며 접합시간과 승온 시간이 짧을수록 warpage 결과가 증가하는 것을 확인하였다. 접합 된 웨이퍼를 dicing 하여 각 개별 칩 단위로 TC, HTC, Humidity soak의 신뢰성 테스트를 수행하였으며 warpage 결과가 패키지의 신뢰성 결과에 미치는 영향은 미비한 것으로 확인되었다.

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다중적층 소재 레이저용접 인자별 열영향 해석 (Parametric Analysis of Thermal Effects on Multi Layered Laser Welding)

  • 최세훈;최해운
    • 한국기계가공학회지
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    • 제20권8호
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    • pp.18-24
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    • 2021
  • Polymers, polymer compounds, are very moldable at low temperatures and have good strength against weight, and hence, are often used in the interior and exterior materials of cars. Owing to the increasing environmental problems, emission regulations have become stricter, which has increased the use of lightweight polymers as substitutes for metal materials. Therefore, as the use of polymer increases, extensive research is being conducted on the bonding technology of polymers, such as polyurethane and epoxy. However, the increased cost and environmental pollution by adhesives caused by the polymer manufacturing plant depend on the chemical composition or the manufacturer's mix ratio. To compensate for this issue, a laser beam is irradiated through a highly permeable polymer (PC) placed on top of an absorbent polymer (ABS) to transfer the laser output to the ABS polymer and fuse them at the interface. Moreover, enabling laser penetrating bonding by placing a stainless steel wire mesh between the two polymers can achieve improved bonding strength compared to conventional heterogeneous polymer bonding.

Deep cavity를 가진 Cap Wafer와 MEMS 소자의 Polymer Wafer bonding (Polymer Wafer bonding of MEMS device and Cap Wafer with deep cavity)

  • 이현기;박태준;윤상기;박남수;박형재;민종환;이영규
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2011년도 제42회 하계학술대회
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    • pp.1702-1703
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    • 2011
  • MEMS 소자의 Wafer level Package 관련하여 Deep cavity를 가진 Cap Wafer와 Polymer bonding 중 cavity 단차로 인한 Polymer Patterning 및 접합 불량의 어려움을 극복할 수 있는 새로운 공정 flow를 제안하였다. Cavity를 형성할 때 사용하는 Si deep etching Mask인 기존의 Photoresist를 접합용 감광성 Polymer로 대체하고, cavity 형성 후, 별도의 추가 공정 없이 이 Polymer를 이용해 Wafer bonding을 진행하였다. 이를 통해 cavity 단차에 따른 문제를 해결함과 동시에 공정이 단순하고 제작 비용이 저렴하며, 신뢰성 있는 Wafer level Package를 구현하였다.

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폴리머 마이크로 칩에 대한 레이저 투과 마이크로 접합 (Analysis of Transmission Infrared Laser Bonding for Micro Polymer Devices)

  • 김주한;신기훈
    • 대한용접접합학회:학술대회논문집
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    • 대한용접접합학회 2005년도 춘계학술발표대회 개요집
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    • pp.43-45
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    • 2005
  • A precise bonding technique, transmission laser bonding using energy transfer, for polymer micro devices is presented. The irradiated IR laser beam passes through the transparent part and absorbed on the opaque part. The absorbed energy is converted to heat and bonding takes place. In order to optimize the bonding quality, the temperature profile on the interface must be obtained. Using optical measurements of the both plates, the absorbed energy can be calculated and heat transfer model was applied for obtaining the transient temperature profile. The transmission laser bonding has a potential in the local precise bonding in MEMS or Lab-on-a-chip.

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CNT 마이크로파 가열을 이용한 고분자 기판의 상온 접합 및 기계적 특성평가 (Room-temperature Bonding and Mechanical Characterization of Polymer Substrates using Microwave Heating of Carbon Nanotubes)

  • 손민정;김민수;주병권;이태익
    • 마이크로전자및패키징학회지
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    • 제28권2호
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    • pp.89-94
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    • 2021
  • 최근 플렉시블 기기의 상용화를 위하여 기계적 신뢰성 연구가 활발히 진행되고 있으며 이를 고려하여 신뢰성 높은 다양한 접합부의 구현이 중요하다. 기기의 많은 부피를 차지하는 고분자 기판 또는 필름을 접합할 때에는 재료의 약한 내열성으로 접합공정 중 열 손상이 발생할 수 있으므로 신뢰성을 확보를 위해 상온 접합공정이 필요하다는 제약이 있다. 기존의 기판 접합을 위해 사용되는 에폭시 또한 고온 경화가 요구되는 경우가 많고, 특히 경화 접합 후 에폭시는 접합부 유연성 및 피로 내구성에서 한계를 보인다. 이를 해결하기 위하여 접착제 사용이 없는 저온 접합 공정의 개발이 필요한 상황이다. 본 연구에서는 마이크로파에 의한 탄소나노튜브 가열을 이용한 고분자 기판의 저온 접합공정을 개발하였다. PET 고분자 기판에 다중벽 탄소나노튜브 (MWNT)를 박막 코팅한 뒤 이를 마이크로파로 국부 가열함으로써 접합 기판 전체는 저온을 유지하며 CNT-PET 기계적 얽힘을 유도하는 방식이다. PET/CNT/PET 접합시편에 600 Watt 출력의 마이크로파를 10초간 조사함으로써 유연기판 접합에 성공하였고 매우 얇은 CNT 접합부를 구현하였다. 접합 시편의 기계적 신뢰성을 평가하기 위해 중첩 전단 강도 시험, 삼점 굽힘 시험, 반복 굽힘 시험을 수행하였으며 각 시험으로부터 우수한 접합강도, 유연성, 굽힘 내구성이 확인되었다.

Characteristic rheological responses of PVA solutions in water-containing solvents

  • Song, Song-Ie;Kim, Byoung-Chul
    • 한국섬유공학회:학술대회논문집
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    • 한국섬유공학회 2003년도 가을 학술발표회 논문집
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    • pp.181-182
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    • 2003
  • Poly(vinyl alcohol) (PVA) is a semicrystalline polymer whose hydroxyl groups produce inter-and intramolecular hydrogen bonding. The extent of hydrogen bonding is greatly affected by stereoregularity of hydroxyl groups, so-called tacticity, of PVA[1-3]. Hydrogen bonding has a profound effect on the rheological and mechanical properties of the polymer, which is largely determined by the density and spatial arrangement of hydroxyl groups. (omitted)

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초분자 고체전해질을 이용한 고효율 염료감응형 태양전지 (Solid-state Supramolecular polymer electrolytes containing double hydrogen bonding sites for high efficiency dye-sensitized solar cells(DSSCs))

  • 김선영;전라선;이용건;강용수
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2007년도 추계학술대회 논문집
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    • pp.309-311
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    • 2007
  • Supramolecules containing double hydrogen bonding sites at their both chain ends were self-polymerized to become solid state polymer and were utilized to improve the efficiency of solid state DSSCs. Hydrogen bonding sites were attached at the chain ends of PEG of Mw=2000, such as pyrimethamine and glutaric acid. The solar cell with the solid state supramolecular polymer electrolyte resulted in the overall energy conversion efficiency of 4.63 % with a short circuit current density $(J_{sc})$ of 10.41 $mAcm^{-2}$, an open circuit voltage $V_{oc}$, of 0.71 V and a fill factor (FF) of 0.62 at one sun condition ([oligomer]:[1-methyl-3-propyl imidazolium iodide (MPII)]:$[I_2]$ = 20 : 1 : 0.19, active area = 0.16 $cm^2$, $TiO_2$ layer thickness = 10 ${\mu}m$). The ionic conductivity of the sol id state electrolyte was $5.11{\times}10^{-4}$ (S/cm). The cell performance was characterized by electrochemical impedance spectroscopy and ionic conductivity.

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Modelling the Hydrogen-Bonding Interactions in a Copolymer/Biodegradable Homopolymer Blend through Excess Functions

  • Garcia-Lopera, Rosa;Monzo, Isidro S.;Campos, Agustin;Abad, Concepcion
    • Macromolecular Research
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    • 제16권5호
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    • pp.446-456
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    • 2008
  • A recent theoretical approach based on the coupling of both the Flory-Huggins (FH) and the Association Equilibria thermodynamic (AET) theories was modified and adapted to study the miscibility properties of a multi-component system formed by two polymers (a proton-donor and a proton-acceptor) and a proton-acceptor solvent, named copolymer(A)/solvent(B)/polymer(C). Compatibility between polymers was mainly attained by hydrogen-bonding between the hydroxyl group on the phenol unit of the poly(styrene-co-vinyl phenol) (PSVPh) and the carbonyl group of the biodegradable and environmentally friendly poly(3-hydroxybutyrate) (PHB). However, the self-association of PSVPh and specific interactions between the PSVPh and the H-acceptor group (an ether oxygen atom) of the epichlorohydrin (ECH) solvent were also established in a lower extension, which competed with the polymer-polymer association. All the binary specific interactions and their dependence with the system composition as well as with the copolymer content were evaluated and quantified by means of two excess functions of the Gibbs tree energy, ${\Delta}g_{AB}$ and ${\Delta}g_{AC}$. Experimental results from fluorescence spectroscopy were consistent with the theoretical simulations derived with the model, which could also be applied and extended to predict the miscibility in solution of any polymer blend with specific interactions.