• Journal of Welding and Joining
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• v.23 no.5
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• pp.55-60
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• 2005

A precise bonding technique, transmission laser bonding using energy transfer, for polymer micro devices is presented. The irradiated IR laser beam passes through the transparent part and absorbed on the opaque part. The absorbed energy is converted into heat and bonding takes place. In order to optimize the bonding quality, the temperature profile on the interface must be obtained. Using optical measurements of the both plates, the absorbed energy can be calculated. At the wavelength of 1100nm $87.5\%$ of incident laser energy was used for bonding process from the calculation. A heat transfer model was applied for obtaining the transient temperature profile. It was found that with the power of 29.5 mW, the interface begins to melt and bond each other in 3 sec and it is in a good agreement with experiment results. The transmission IR laser bonding has a potential in the local precise bonding in MEMS or Lab-on-a-chip applications.

• Earthquakes and Structures
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• v.5 no.4
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• pp.477-497
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• 2013

This paper reports extensive experimental study done to compare workability and bond strength of five different types of polymer-based bonding agents for reinforcing bars in pinning retrofit. In pinning retrofit, steel pins of 6 to 10 mm diameters are inserted into holes drilled diagonally from mortar joints. This technique is superior to other techniques especially in retrofitting historic masonry constructions because it does not change the appearance of constructions. With an ordinary cement paste as bonding agent, it is very difficult to insert reinforcing bars at larger open times due to poor workability and very thin clearance available. Here, open time represents the time interval between the injection of bonding agent and the insertion of reinforcing bars. Use of polymer-cement paste (PCP), as bonding agent, is proposed in this study, with investigation on workability and bond strengths of various PCPs in brick masonry, at open times up to 10 minutes, which is unavoidable in practice. Corresponding nonlinear finite element models are developed to simulate the experimental observations. From the experimental and analytical study, the Styrene-Butadiene Rubber polymer-cement paste (SBR-PCP) with prior pretreatments of drilled holes showed strong bond with minimum strength variation at larger open times.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.1
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• pp.27-31
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• 2009

In this paper, the polymer adhesive bonding technology using wafer-level technology was investigated and warpage results were analyzed. Si and glass wafer was bonded after adhesive polymer layer and dam pattern for uniform state was patterned on glass wafer. In this study, warpage result decreased as the low of bonding temperature of Si wafer, bonding pressure and height of adhesive bonding layer. The availability of adhesive polymer bonding was confirmed by TC, HTC, Humidity soak test after dicing. The result is that defect has not found without reference to warpage.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.20 no.8
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• pp.18-24
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• 2021

Polymers, polymer compounds, are very moldable at low temperatures and have good strength against weight, and hence, are often used in the interior and exterior materials of cars. Owing to the increasing environmental problems, emission regulations have become stricter, which has increased the use of lightweight polymers as substitutes for metal materials. Therefore, as the use of polymer increases, extensive research is being conducted on the bonding technology of polymers, such as polyurethane and epoxy. However, the increased cost and environmental pollution by adhesives caused by the polymer manufacturing plant depend on the chemical composition or the manufacturer's mix ratio. To compensate for this issue, a laser beam is irradiated through a highly permeable polymer (PC) placed on top of an absorbent polymer (ABS) to transfer the laser output to the ABS polymer and fuse them at the interface. Moreover, enabling laser penetrating bonding by placing a stainless steel wire mesh between the two polymers can achieve improved bonding strength compared to conventional heterogeneous polymer bonding.

• Proceedings of the KIEE Conference
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• 2011.07a
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• pp.1702-1703
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• 2011

MEMS 소자의 Wafer level Package 관련하여 Deep cavity를 가진 Cap Wafer와 Polymer bonding 중 cavity 단차로 인한 Polymer Patterning 및 접합 불량의 어려움을 극복할 수 있는 새로운 공정 flow를 제안하였다. Cavity를 형성할 때 사용하는 Si deep etching Mask인 기존의 Photoresist를 접합용 감광성 Polymer로 대체하고, cavity 형성 후, 별도의 추가 공정 없이 이 Polymer를 이용해 Wafer bonding을 진행하였다. 이를 통해 cavity 단차에 따른 문제를 해결함과 동시에 공정이 단순하고 제작 비용이 저렴하며, 신뢰성 있는 Wafer level Package를 구현하였다.

• Proceedings of the KWS Conference
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• 2005.06a
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• pp.43-45
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• 2005

A precise bonding technique, transmission laser bonding using energy transfer, for polymer micro devices is presented. The irradiated IR laser beam passes through the transparent part and absorbed on the opaque part. The absorbed energy is converted to heat and bonding takes place. In order to optimize the bonding quality, the temperature profile on the interface must be obtained. Using optical measurements of the both plates, the absorbed energy can be calculated and heat transfer model was applied for obtaining the transient temperature profile. The transmission laser bonding has a potential in the local precise bonding in MEMS or Lab-on-a-chip.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.89-94
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• 2021

The mechanical reliability of flexible devices has become a major concern on their commercialization, where the importance of reliable bonding is highlighted. In terms of component materials' properties, it is important to consider thermal damage of polymer substrates that occupy large area of the flexible device. Therefore, room temperature bonding process is highly advantageous for implementing flexible device assemblies with mechanical reliability. Conventional epoxy resins for the bonding still require curing at high temperatures. Even after the curing procedure, the bonding joint loses flexibility and exhibits poor fatigue durability. To solve this problems, low-temperature and adhesive-free bonding are required. In this work, we develop a room temperature bonding process for polymer substrates using carbon nanotube heated by microwave irradiations. After depositing multiple-wall carbon nanotubes (MWNTs) on PET polymer substrates, they are heated locally with by microwave while the entire bonding specimen maintains room temperature and the heating induces mechanical entanglement of CNT-PET. The room temperature bonding was conducted for a PET/CNT/PET specimen at 600 watt of microwave power for 10 seconds. Thickness of the CNT bonding joint was very thin that it obtains flexibility as well. In order to evaluate the mechanical reliability of the joint specimen, we performed lap shear test, three-point bending test, and dynamic bending test, and confirmed excellent joint strength, flexibility, and bending durability from each test.

• Proceedings of the Korean Fiber Society Conference
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• 2003.10b
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• pp.181-182
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• 2003

Poly(vinyl alcohol) (PVA) is a semicrystalline polymer whose hydroxyl groups produce inter-and intramolecular hydrogen bonding. The extent of hydrogen bonding is greatly affected by stereoregularity of hydroxyl groups, so-called tacticity, of PVA[1-3]. Hydrogen bonding has a profound effect on the rheological and mechanical properties of the polymer, which is largely determined by the density and spatial arrangement of hydroxyl groups. (omitted)

• 한국신재생에너지학회:학술대회논문집
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• 2007.11a
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• pp.309-311
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• 2007

Supramolecules containing double hydrogen bonding sites at their both chain ends were self-polymerized to become solid state polymer and were utilized to improve the efficiency of solid state DSSCs. Hydrogen bonding sites were attached at the chain ends of PEG of Mw=2000, such as pyrimethamine and glutaric acid. The solar cell with the solid state supramolecular polymer electrolyte resulted in the overall energy conversion efficiency of 4.63 % with a short circuit current density $(J_{sc})$ of 10.41 $mAcm^{-2}$, an open circuit voltage $V_{oc}$, of 0.71 V and a fill factor (FF) of 0.62 at one sun condition ([oligomer]:[1-methyl-3-propyl imidazolium iodide (MPII)]:$[I_2]$ = 20 : 1 : 0.19, active area = 0.16 $cm^2$, $TiO_2$ layer thickness = 10 ${\mu}m$). The ionic conductivity of the sol id state electrolyte was $5.11{\times}10^{-4}$ (S/cm). The cell performance was characterized by electrochemical impedance spectroscopy and ionic conductivity.

• Macromolecular Research
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• v.16 no.5
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• pp.446-456
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• 2008

A recent theoretical approach based on the coupling of both the Flory-Huggins (FH) and the Association Equilibria thermodynamic (AET) theories was modified and adapted to study the miscibility properties of a multi-component system formed by two polymers (a proton-donor and a proton-acceptor) and a proton-acceptor solvent, named copolymer(A)/solvent(B)/polymer(C). Compatibility between polymers was mainly attained by hydrogen-bonding between the hydroxyl group on the phenol unit of the poly(styrene-co-vinyl phenol) (PSVPh) and the carbonyl group of the biodegradable and environmentally friendly poly(3-hydroxybutyrate) (PHB). However, the self-association of PSVPh and specific interactions between the PSVPh and the H-acceptor group (an ether oxygen atom) of the epichlorohydrin (ECH) solvent were also established in a lower extension, which competed with the polymer-polymer association. All the binary specific interactions and their dependence with the system composition as well as with the copolymer content were evaluated and quantified by means of two excess functions of the Gibbs tree energy, ${\Delta}g_{AB}$ and ${\Delta}g_{AC}$. Experimental results from fluorescence spectroscopy were consistent with the theoretical simulations derived with the model, which could also be applied and extended to predict the miscibility in solution of any polymer blend with specific interactions.