• Carbon letters
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• v.13 no.4
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• pp.230-235
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• 2012

In this study, reduced graphene oxide/polyimide (r-GO/PI) composite films, which showed significant enhancement in their electrical conductivity, were successfully fabricated. GO was prepared from graphite using a modified Hummers method. The GO was used as a nanofiller material for the preparation of r-GO/PI composites by in-situ polymerization. An addition of 20 wt% of GO led to a significant decrease in the volume resistivity of composite films by less than nine orders of magnitude compared to that of pure PI films due to the electrical percolation networks of reduced GO created during imidization within the films. A tensile test indicated that the Young's modulus of the r-GO/PI composite film containing 20 wt% GO increased drastically from 2.3 GPa to 4.4 GPa, which was an improvement of approximately 84% compared to that of pure PI film. In addition, the corresponding tensile strength was found to have decreased only by 12%, from 113 MPa to 99 MPa.

• Macromolecular Research
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• v.15 no.2
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• pp.114-128
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• 2007

Polyimides are one of the most important classes of polymers used in the microelectronics and photoelectronics industries. Because of their high thermal stability, chemical resistance, and good mechanical and electric properties, polyimides are often applied in photoresists, passivation and dielectric films, soft print circuit boards, and alignment films within displays. Recently, fully aliphatic and alicyclic polyimides have found applications as optoelectronics and inter layer dielectric materials, due to their good transparencies and low dielectric constants $(\varepsilon)$. The low molecular density, polarity and rare probability of forming inter- or intra-molecular charge transfers, resulting in lowering of the dielectric constant and high transparency, are the most striking characteristics of aliphatic polyimide. However, the ultimate end use of polyimides derived from aliphatic monomers is in their targeted applications that need less stringent thermal requirements. Much research effort has been exerted in the development of aliphatic polyimide with increased thermal and mechanical stabilities, while maintaining their transparencies and low dielectric constants, by the incorporation of rigid moieties. In this article, the recent research process in synthesizing fully aliphatic polyimides, with improved dimensional stability, high transparency and low $\delta$values, as well as the characterizations and future scope for their application in micro electric and photo-electronic industries, is reviewed.

• Macromolecular Research
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• v.15 no.2
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• pp.160-166
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• 2007

Novel multiblock copolymers, based on segmented sulfonated hydrophilic-hydrophobic blocks, were synthesized and investigated for their application as proton exchange membranes. A series of segmented sulfonated poly(arylene ether sulfone)-b-polyimide multiblock copolymers, with various block lengths, were synthesized via the coupling reaction between the terminal amine moieties on the hydrophilic blocks and naphthalene anhydride functionalized hydrophobic blocks. Successful imidization reactions required a mixed solvent system, comprised of NMP and m-cresol, in the presence of catalysts. Proton conductivity measurements revealed that the proton conductivity improved with increasing hydrophilic and hydrophobic block lengths. The morphological structure of the multiblock copolymers was investigated using tapping mode atomic force microscopy (TM-AFM). The AFM images of the copolymers demonstrated well-defined nanophase separated morphologies, with the changes in the block length having a pronounced effect on the phase separated morphologies of the system. The self diffusion coefficient of water, as measured by $^1H$ NMR, provided a better understanding of the transport process. Thus, the block copolymers showed higher values than Nafion, and comparable proton conductivities in liquid water, as well as under partially hydrated conditions at $80^{\circ}C$. The new materials are strong candidates for use in PEM systems.

• Macromolecular Research
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• v.16 no.6
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• pp.503-509
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• 2008

A series of colorless polyimide (PI) nanocomposite films were synthesized from 2,2'-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA) and 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl (TFDB) with various organoclay contents by solution intercalation polymerization to poly(amic acid)s, followed by thermal imidization. The variation with the organoclay content of the thermomechanical properties, morphology, and optical transparency of the hybrids was examined at organoclay loadings ranging from 0 to 1.0 wt%. The hybrid films showed high optical transparency and almost no color, with cut-off wavelengths ranging from 352 and 356 nm and very low $b^*$ values of 1.19-1.77. The hybrid PI films showed good thermal properties with a glass transition temperature of $280-287^{\circ}C$. Most films did not show any significant thermal decomposition below $490^{\circ}C$. The addition of only a small amount of organoclay was sufficient to improve the tensile properties of the PI films with maximum enhancement being observed at 0.25 wt% organoclay. Moreover, these PI hybrids also had low coefficients of thermal expansion (CTE).

• Macromolecular Research
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• v.9 no.5
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• pp.247-252
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• 2001

Tricyclic aliphatic dianhydride monomer, tricycle[4.2.2.0]dec-9-ene exo, endo-3,4: 7,8-tetra-carboxylicdianhydride (TCDDA), was synthesized by photochemical reaction and poly(amic acid)s from TCDDA and diamines such as 1,4-bis-(4-aminophenoxy)benzene (BAB), 2,2-bis(4-(4-aminophenoxy) phenyl) propane (BAPP), 2,2-bis(4-(4-aminophenoxy)phenyl)hexafluoropropane (BAPHF), bis(4-(4-ami-nophenoxy) phenyl)sulfone (BAPS), and 1,4-bis-(4-aminophenoxy)biphenyl (BABP) were prepared. The inherent viscosities of the poly(amic acid)s were between 0.39 and 0.50 dL/g. The poly(amic acid)s were converted to polyimide films by thermal imidization. The glass transition temperatures (T$\_$g/) of the polyimides were in the range of 201-263$\^{C}$. The thermogravimetric analysis (TGA) thermogram of these polyimides showed the temperatures of 5% weight losses between 375 and 393$\^{C}$ in nitrogen atmosphere. To show their utility for image generation, degradations of these polyimides in UV exposure were investigated by UV spectroscopy.

• Applied Chemistry for Engineering
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• v.22 no.6
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• pp.623-626
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• 2011

Various poly(amic acid)s were synthesized from PMDA/BPDA/p-PDA/ODA with different mole ratios and effectively converted into 4-component polyimide films by thermal imidization. The chemical structures and thermo-mechanical properties of polyimide films were examined using Fourier transform infrared spectroscopy (FT-IR), thermo-gravimetric analyzer (TGA), thermo-mechanical analyzer (TMA), dynamic mechanical analyzer (DMA) and universal tensile machine (UTM). The tensile strength, modulus, and thermal properties of polyimides films increased with the amount of rigid PMDA and p-PDA, while the elongation and moisture absorption of polyimide films increased with the amount of flexible BPDA and ODA. One of 4-component polyimide films exhibited a similar coefficient of thermal expansion (CTE) value to that of copper when it was composed of PMDA : BPDA : p-PDA : ODA with the ratio of 5 : 5 : 4 : 6. Thus, this polyimide film could be useful for a base film for flexible copper clad laminates (FCCL) of flexible printed circuit boards.

• Journal of Adhesion and Interface
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• v.10 no.2
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• pp.98-105
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• 2009

Poly(amic acid) was synthesized from the reaction of p-PDA/ODA and PMDA/BPDA and silane oligomer containing epoxy group was also synthesized from the reaction of tetramethylorthosilicate (TMOS) and glycidol. After hybridizing poly (amic acid) and silane oligomer, they were effectively converted into polyimide/silica hybrid films by thermal imidization process. As the silica contents in hybrid films increased, CTE values decreased from 17 ppm/K to 10 ppm/K and the tensile modulus increased, in spite of decreasing tensile strength. In addition, the peel test showed that the adhesion strength of hybrid film was enhanced from $0.43kg_f/cm$ to $1.02kg_f/cm$. Therefore, it could be concluded that the polyimide/silica hybrid film is effective to enhance adhesion strength for FCCL films.

• Elastomers and Composites
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• v.43 no.2
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• pp.82-87
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• 2008

In this study, nine kinds of polyimides were synthesized from 1,2,4,5-benzenetetracarboxylic dianhydride (PMDA), 4,4'-(4,4'-isopropylidenediphenoxy)bis(phthalic anhydride) (BPADA), m-pheny lenediamine (m-PDA) and 4,4'-oxydianiline (ODA) by controlling molar ratio of monomers. Synthesized polyimides were used as insulator films for 2-layer Flexible Copper Clad Laminate(FCCL) which were manufactured by the casting method. Glass transition temperature and thermal degradation temperature for 5% weight loss of the polyimide film were improved by increasing contents of m-PDA and PMDA, respectively. Water absorption of polyimide film was reduced by increasing contents of ODA and BPADA which have relatively long structure, respectively. Peel strength of 2-layer FCCL was improved by increasing contents of ODA and BPADA.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.816-819
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• 2008

A negative photoresist formulation was developed utilizing synthesized UV monomers containing imide linkage, photoinitiator, UV oligomer, and alkali developable polymer matrix. It was found that via-holes with good resolution, high transmittance and thermal resistance could be obtained by photolithographic process utilizing the negative-type photoresist formulations.

• 한국정보디스플레이학회:학술대회논문집
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• 2003.07a
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• pp.600-603
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• 2003

VA-LCDs is widely used for recent LCD productions owing to wide viewing angle characteristics with an unusually high contrast ratio. To apply for VA-LCDs, the novel homeotropic alignment materials were synthesized, which have the liquid crystal molecule as a side chain at aromatic diamine in a polyimide structure. These polyimides generated a high pretilt angle $90^{\circ}C$. In this paper, the synthesis and alignment properties of new homeotropic alignment materials will be discussed..