• 센서학회지
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• 제2권1호
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• pp.3-10
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• 1993

Chemical bath deposition 방법으로 다결정 CdS 박막을 세라믹 기판 위에 성장시킨 다음 온도를 변화시켜 열처리하고 X-선 회절무늬를 측정하여 결정구조를 밝혔다. $550^{\circ}C$로 열처리한 시료의 경우 X-선 회절무늬로부터 외삽법에 의해 $a_{o}$와 $c_{o}$는 각각 $4.1364{\AA}$과 $6.7129{\AA}$인 육방정계임을 알았다. 이 때 낱알크기는 약 $0.35{\mu}m$이었다. Van der Pauw 방법으로 Hall 효과를 측정하여 운반자 농도와 이동도의 온도의존성을 연구하였다. 이동도는 33 K에서 150 K까지는 압전산란에 의하여, 150 K에서 293 K 까지는 곽성광학산란에 의하여 감소하는 경향을 나타냈다. 광전도 셀의 특성으로 스펙트럼 응답, 감도(${\gamma}$), 최대허용소비전력 및 응답 시간을 측정하였다.

• 센서학회지
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• 제6권4호
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• pp.316-327
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• 1997

높은 큐리온도를 가진 다결정 세라믹스 $Sr_{2}Nb_{2}O_{7}$ 및 $La_{2}Ti_{2}O_{7}$을 화학적공침법으로 제조하고 하소분말의 입도분포와 상구조 및 소결특성 등을 조사하였으며, 소결온도에 따른 입자배향도와 전기적 특성을 선행연구 고상반응법 및 용융염합성법과 비교하였다. 화학적공침법을 이용함으로써 고상반응법에 비해 $100{\sim}150^{\circ}C$ 낮은 하소온도에서 단일상을 얻을 수 있었고, 특히 $Sr_{2}Nb_{2}O_{7}$의 경우, $700^{\circ}C$에서 중간 생성물 $Sr_{5}Nb_{4}O_{15}$가 생성된 후 $800^{\circ}C$의 낮은 하소온도에서 단일상이 나타났으며 얻어진 하소분말도 미세하고 균일하였다. 화학적공침법에 의해 $1500^{\circ}C$에서 소결한 $Sr_{2}Nb_{2}O_{7}$ 세라믹스는 이론밀도의 97%에 달하는 우수한 소결성을 보였을 뿐만 아니라 (0k0) 방향의 입자배향도가 현저히 컸으며, 결과적으로 절단방향에 따른 유전특성의 이방성을 나타내어 a-cut 방향의 유전율은 단결정에 비해 손색이 없었다.

• 센서학회지
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• 제5권3호
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• pp.93-100
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• 1996

높은 큐리온도를 가진 다결정 세라믹스 $Sr_{2}(Ta_{1-x}Nbx)_{2}O_{7}$ 및 $La_{2}Ti_{2}O_{7}$을 고상반응법과 용융염합성법으로 제조하고 조성과 하소 및 소결조건에 따른 분말특성, 상구조, 소결특성, 입자배향도 및 전기적 특성을 조사하였다. 용융염합성법에 의해 합성된 하소분말의 단일상은 고상반응법에 의한 것보다 100 - $150^{\circ}C$ 낮은 하소온도에서 나타났다. 한편 $Sr_{2}(Ta_{1-x}Nbx)_{2}O_{7}$ 소결체에서 Nb의 조성이 커질수록 입자배향도가 커지고 소결성 및 고온에서의 유전특성이 좋아졌다. 또 용융염합성법으로 $A_{2}B_{2}O_{7}$ 세라믹스를 제조할 경우 고상반응법에 비해 소결온도를 낮출 수 있고 비유전율도 다소 높일 수 있으나 압전특성이나 입자배향도는 향상되지 않았다.

• 센서학회지
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• 제2권1호
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• pp.81-86
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• 1993

Chemical bath deposition 방법으로 다결정 CdSe 박막을 세라믹 기판 위에 성장시킨 다음 온도를 변화시켜 열처리하고 X-선 회절무늬를 측정하여 결정구조를 밝혔다. $450^{\circ}C$로 열처리한 시료가 X-선 회절무늬로 부터 외삽법에 의해 $a_{o}$와 $c_{o}$는 각각 $4.302{\AA}$과 $7.014{\AA}$인 육방정계임을 알았다. 이 때 낱알크기는 약 $0.3{\mu}m$이었다. Van der Pauw 방법으로 Hall 효과를 측정하여 운반자 농도와 이동도의 온도의존성을 연구하였다. 이동도는 33 K에서 200 K까지는 압전산란에 의하여, 200K에서 293 K까지는 극성광학산란에 의하여 감소하는 경향을 나타냈다. 광전도 셀의 특성으로 스텍트럼 응답, 감도(${\gamma}$), 최대허용소비전력 및 응답 시간을 측정하였다.

• 한국산학기술학회논문지
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• 제8권1호
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• pp.25-32
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• 2007

코발트 니켈 합금형 실리사이드 공정에서 단결정실리콘과 다결정실리콘 기판에 자연산화막이 있는 경우 나노급 두께의 코발트 니켈 합금 금속을 증착하고 실리사이드화하는 경우의 반응 안정성을 확인하였다. 4인치 P-type(100)Si 기판 전면에 poly silicon을 입힌 기판과 single silicon 상태의 두 종류 기판을 준비하고 두께 4 nm의 자연산화막이 있는 상태에서 10 nm 코발트 니켈 합금을 니켈의 상대조성을 $10{\sim}90%$로 달리하며 열증착하였다. 통상의 600, 700, 800, 900, 1000, $1100^{\circ}C$ 각 온도에서 실리사이드화 열처리를 시행 후 잔류 합금층을 제거하고, XRD(X-ray diffraction)및 FE-SEM(Field emission scanning electron microscopy), AES(Auger electron spectroscopy)를 사용하여 실리사이드가 생겼는지 확인하였다. 마이크로라만 분석기로 실리사이드 반응시의 실리콘 층의 잔류 스트레스도 확인하였다. 자연산화막이 존재하는 경우 실리사이드 반응이 진행되지 않았고, 폴리실리콘 기판과 고온에서는 금속과 산화층의 반응잔류물이 생성되었다. 단결정 기판의 고온열처리에서는 실리사이드 반응이 없더라도 핀홀이 발생할 수 있는 정도의 열스트레스가 존재하였다. 코발트 니켈 복합실리사이드 공정에서는 자연산화막을 제거하는 공정이 필수적이었다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2000년도 제18회 학술발표회 논문개요집
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• pp.77-77
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• 2000

Titanium oxide (TiO2) thin films have valuable properties such as a high refractive index, excellent transmittance in the visible and near-IR frequency, and high chemical stability. Therefore it is extensively used in anti-reflection coating, sensor, and photocatalysis as electrical and optical applications. Specially, TiO2 have a high dielectric constant of 180 along the c axis and 90 along the a axis, so it is highlighted in fabricating dielectric capacitors in micro electronic devices. A variety of methods have been used to produce patterned self-assembled monolayers (SAMs), including microcontact printing ($\mu$CP), UV-photolithotgraphy, e-beam lithography, scanned-probe based micro-machining, and atom-lithography. Above all, thin film fabrication on $\mu$CP modified surface is a potentially low-cost, high-throughput method, because it does not require expensive photolithographic equipment, and it produce micrometer scale patterns in thin film materials. The patterned SAMs were used as thin resists, to transfer patterns onto thin films either by chemical etching or by selective deposition. In this study, we deposited TiO2 thin films on Si (1000 substrateds using titanium (IV) isopropoxide ([Ti(O(C3H7)4)] ; TIP as a single molecular precursor at deposition temperature in the range of 300-$700^{\circ}C$ without any carrier and bubbler gas. Crack-free, highly oriented TiO2 polycrystalline thin films with anatase phase and stoichimetric ratio of Ti and O were successfully deposited on Si(100) at temperature as low as 50$0^{\circ}C$. XRD and TED data showed that below 50$0^{\circ}C$, the TiO2 thin films were dominantly grown on Si(100) surfaces in the [211] direction, whereas with increasing the deposition temperature to $700^{\circ}C$, the main films growth direction was changed to be [200]. Two distinct growth behaviors were observed from the Arhenius plots. In addition to deposition of THe TiO2 thin films on Si(100) substrates, patterning of TiO2 thin films was also performed at grown temperature in the range of 300-50$0^{\circ}C$ by MOCVD onto the Si(100) substrates of which surface was modified by organic thin film template. The organic thin film of SAm is obtained by the $\mu$CP method. Alpha-step profile and optical microscope images showed that the boundaries between SAMs areas and selectively deposited TiO2 thin film areas are very definite and sharp. Capacitance - Voltage measurements made on TiO2 films gave a dielectric constant of 29, suggesting a possibility of electronic material applications.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2000년도 제18회 학술발표회 논문개요집
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• pp.186-186
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• 2000

After LeComber et al. reported the first amorphous hydrogenated silicon (a-Si: H) TFT, many laboratories started the development of an active matrix LCDs using a-Si:H TFTs formed on glass substrate. With increasing the display area and pixel density of TFT-LCD, however, high mobility TFTs are required for pixel driver of TF-LCD in order to shorten the charging time of the pixel electrodes. The most important of these drawbacks is a-Si's electron mobiliy, which is the speed at which electrons can move through each transistor. The problem of low carier mobility for the a-Si:H TFTs can be overcome by introducing polycrystalline silicon (poly-Si) thin film instead of a-Si:H as a semiconductor layer of TFTs. Therefore, poly-Si has gained increasing interest and has been investigated by many researchers. Recnetly, fabrication of such poly-Si TFT-LCD panels with VGA pixel size and monolithic drivers has been reported, . Especially, fabricating poly-Si TFTs at a temperature mach lower than the strain point of glass is needed in order to have high mobility TFTs on large-size glass substrate, and the monolithic drivers will reduce the cost of TFT-LCDs. The conventional methods to fabricate poly-Si films are low pressure chemical vapor deposition (LPCVD0 as well as solid phase crystallization (SPC), pulsed rapid thermal annealing(PRTA), and eximer laser annealing (ELA). However, these methods have some disadvantages such as high deposition temperature over $600^{\circ}C$, small grain size (<50nm), poor crystallinity, and high grain boundary states. Therefore the low temperature and large area processes using a cheap glass substrate are impossible because of high temperature process. In this study, therefore, we have deposited poly-Si thin films on si(100) and glass substrates at growth temperature of below 40$0^{\circ}C$ using newly developed high rate magnetron sputtering method. To improve the sputtering yield and the growth rate, a high power (10~30 W/cm2) sputtering source with unbalanced magnetron and Si ion extraction grid was designed and constructed based on the results of computer simulation. The maximum deposition rate could be reached to be 0.35$\mu$m/min due to a high ion bombardment. This is 5 times higher than that of conventional sputtering method, and the sputtering yield was also increased up to 80%. The best film was obtained on Si(100) using Si ion extraction grid under 9.0$\times$10-3Torr of working pressure and 11 W/cm2 of the target power density. The electron mobility of the poly-si film grown on Si(100) at 40$0^{\circ}C$ with ion extraction grid shows 96 cm2/V sec. During sputtering, moreover, the characteristics of si source were also analyzed with in situ Langmuir probe method and optical emission spectroscopy.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2009년도 제38회 동계학술대회 초록집
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• pp.59-59
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• 2010

Graphene is a 2-D sheet of $sp^2$-bonded carbon arranged in a honeycomb lattice. This material has attracted major interest, and there are many ongoing efforts in developing graphene devices because of its high charge mobility and crystal quality. Therefore clear understanding of the substrate effect and mechanism of synthesis of graphene is important for potential applications and device fabrication of graphene. In a published paper in J. Phys. Chem. C (2008), the effect of substrate on the atomic/electronic structures of graphene is negligible for graphene made by mechanical cleavage. However, nobody shows the interaction between Ni substrate and graphene. Therefore, we have studied this interaction. In order to studying these effect between graphene and Ni substrate, We have observed graphene synthesized on Ni substrate and graphene transferred on $SiO_2$/Si substrate through Raman spectroscopy. Because Raman spectroscopy has historically been used to probe structural and electronic characteristics of graphite materials, providing useful information on the defects (D-band), in-plane vibration of sp2 carbon atoms (G-band), as well as the stacking orders (2D-band), we selected this as analysis tool. In our study, we could not observe the doping effect between graphene and Ni substrate or between graphene and $SiO_2$/Si substrate because the shift of G band in Raman spectrum was not occurred by charge transfer. We could noticed that the bonding force between graphene and Ni substrate is more strong than Van de Waals force which is the interaction between graphene and $SiO_2$/Si. Furthermore, the synthesized graphene on Ni substrate was in compressive strain. This phenomenon was observed by 2D band blue-shift in Raman spectrum. And, we consider that the graphene is incommensurate growth with Ni polycrystalline substrate.

• Bulletin of the Korean Chemical Society
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• 제21권10호
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• pp.1041-1043
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• 2000

We present the effects of temperature (between 10 K and 298 K) and of hole concentration on the frequency and intensity of characteristic phonons in polycrystalline $La_2CuO_4-related$ compounds using FT-IR spectros-copy. The influences of the concentration of carrier doped on the phonon modes are prominent in the IR spectra of $La_2CuO_4-related$ compounds. For $La_2-xSrxCuO_4({\chi}=$ 0.00, 0.03, 0.07, 0.10, and 0.15) and electrochemically (or chemically) oxidized $La_2CuO_4$, the intensities of the transverse oxygen mode around 680cm $-^1$ which cor-responds mainly to Cu-O(1) stretching vibration in the basal plane of CuO6 octahedron, are decreased and dis-appeared depending on the Sr-substitution rate and the amount of excess oxygen, while the longitudinal oxygen mode around 510 cm $-^1$ corresponding to the Cu-O(2) stretching in the basal plane of CuO6 octahedron are near-ly invariable. In particular, after two cycles of cooling-heating between 10 K and 298 K for these sample, the phonons around 680 cm $-^1$ are blue shif 13-15 cm $-^1$, while the phonons around 510 cm $-^1$ are nearly constant. The introduction of the charge carrier by doping would give rise to the small contraction of CuO6 oc-tahedron as Cu $^3+$ requires a smaller site than Cu $^2+$, which results in the shortening of the Cu-O(1) bond length and Cu-O(2) bond length with the increased La-O(2) bond length. These results in the frequency shift of the characteristic phonons. The IR spectra of $La_2Li0.5Cu0.5O_4$ which exhibits an insulator behavior despite the $Cu^3+$ of nearly 100%, corroborate our IR interpretations. The mode around 710 cm $-^1$ corresponding to Cu-O(1) stretching vibration is still strongly remained even at low temperature (10 K). Thus, we conclude that the con-duction electrons formed within $CuO_2$ planes of $La_2CuO_4-related$ superconductors screen more effectively the transverse oxygen breathing mode around 680 $cm-^1$ depending on the concentration of the doped charge carrier in $La_2CuO_4-related$ compounds, which might use as a superconductivity probe.

• 한국자기학회지
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• 제4권1호
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• pp.39-43
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• 1994

열분해법을 이용하여, 양이온 비가 Bi:Y:Fe=1.5+u:1.5:5 및 Bi:Y:Fe=1.5:1.5+v:5 ($-0.7{\leq}u{\leq}1.0,\;-0.7{\leq}v{\leq}1.3$)인, 비화학양혼조성을 갖는 비스머스 치환 이트리움 철 가네트 다결정 박막을 제조했다. 각 열처리 온도에서 생성된 이 박막들내의 결정상들을 고출력 X-선 최절 분석기를 이용하여 분석했다. 또한, u, v에 따른 이 박막들의 포화자화, 큐리온도 및 파장 633nm에서의 훼러데이 회전각을 측정했다. 비스머스 및 이트리움을 화학양론조성보다 소량 투여한 박막들에서는, 가네트상과 함께 불순물상이 관찰되었다. 한편, 비스머스 및 이트리움을 과량 투여한 박막들에서는 불순물상에 의한 회절 라인은 검출되지 않고, 가네트상에 의한 최절 라인만이 넓은 조성 영역($0{\leq}u{\leq}0.5,\;0{\leq}v{\leq}0.7$)에서 관찰되었다. 그러나, 이 과량 투여한 박막들의 자기적 및 자기광학적 특성은, X-선 분석으로는 검출되지 않는 미량의 불순물상이 존재한다고 가정하는 것에 의해서만 설명할 수 있었다.