• Polymer(Korea)
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• v.32 no.1
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• pp.77-84
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• 2008

The thermal properties, morphology, mechanical properties and gas permeability of the blends of poly (amic acid) (PAA) and poly (o-hydroxyamides) (PHAs) having pendant group was investigated. The 5% weight loss and major weight loss of the b)ends occurred in the ranges of $348{\sim}407^{\circ}C$ and $589{\sim}615^{\circ}C$ upon a heating process. After a thermical annealing, the tensile strength and initial modulus of blends increased $3.7{\sim}52.9%$ and $34.4{\sim}70%$ from the value of pure PAA, respectively. Especially the tensile strength and modulus of the PAA/MP-PHA=9/1 showed the highest values (97.5 MPa and 2.67 GPa, respectively), which were 53 and 70% higher than those of pure PAA. The fine PHA domains were found to be uniformly dispersed. The interfacial adhesion between PAA and PHA was identified to be good. The gas permeabilities of PAA/M-PHA blend increased with M-PHA contents.

• Polymer(Korea)
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• v.25 no.2
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• pp.254-262
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• 2001

Epoxy resin based upon the N,N'-diglycidylaniline which is widely used in optic, electronic and composite material. We modified this epoxy resin with poly(amic acid) (PAA) that is a precursor of polyimide. To improve the mechanical property we controlled PAA content and imidization ratio. PI-modified epoxy blends were prepared for the formation of IPN structure. The possible reaction in the epoxy resin/PAA blends were investigated by FT-IR and inherent viscosity techniques. Thermal properties are measured by TGA, DSC, and TMA. Mechanical properties are measured by UTM and impact test machine. Morphology is investigated by SEM. Thermal stability improved with increasing the content of PAA in blends. As the content of PAA increases in blend, the glass transition temperature and thermal expansion coefficient decreases. Increasing impact strengths in J/m in the range of 920∼2412 were observed in blends. The PAA segment may act as a toughening agent in the epoxy networks, thus contributing the impact strength improvement of the blends.

• Polymer(Korea)
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• v.34 no.4
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• pp.326-332
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• 2010

Nanocomposite films were prepared by blending poly(amic acid)(PAA), poly(o-hydroxyamide)( PHA) and organically modified montmorillonite (OMMT) that has a layered structure. XRD, SEM and TEM were used to study the morphology of PAA/PHA nanocomposites, and DMA, TGA, UTM, LOI and PCFC techniques were used to characterize the mechanical and thermal properties, and flame retardancy of the nanocomposites. TEM images revealed that OMMT layers were well dispersed in the PAA/PHA matrix and showed exfoliation and intercalation behavior. The addition of 3 wt% OMMT to the PAA/PHA blend increased the initial modulus of PAA/ PHA blend to 3.68 GPa that was ca. 48% higher than that of the control PAA/PHA blend. Above 4 wt%, however, both the initial modulus and the tensile strength were found to decrease, which might be due to the aggregation of OMMT in PAA/PHA matrix. When the OMMT content was below 3 wt%, the thermal stability and flame retardancy of the PAA/PHA nanocomposites increased with increasing OMMT content.

• Proceedings of the Korean Fiber Society Conference
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• 2003.10b
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• pp.130-133
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• 2003

폴리이미드(poly(imide), PI)는 반복 단위 내에 이미드 그룹을 함유하고 있는 고분자로 매우 강한 물리적인 특성을 지니며 열적 및 화학적 안정성이 매우 큰 고분자이다[1-4]. 그러나 이는 대부분이 불용ㆍ불융하기 때문에 프리커서인 poly(amic acid) (PAA) 용액 상태에서 어느 특정한 형태로 가공한 후 열적 혹은 화학적 방법에 의해 이미드 구조로 전환시켜준다. PAA 용액에 사용되는 용매로는 N,N-dimethylacetamide (DMAc), N-methyl-2-pyrrolidone (NMP), N,N-dimethyl-formamide(DMF) 등과 같이 비등점이 높은 극성 용매들이 사용되어진다. (중략)

• Bulletin of the Korean Chemical Society
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• v.24 no.3
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• pp.357-362
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• 2003

The pathway producing imide ring closure during the thermal imidization of poly(amic acid) (PAA) was investigated in detail using a new analytical method, two-dimensional (2D) Raman correlation spectroscopy. The signs of the cross peaks in synchronous spectra provided evidence of the thermal imidization of PAA into PI as the heating temperature increased. The signs of the cross peaks in asynchronous spectra suggested that the imide-related modes changed prior to the amide or carboxylic mode, which indicates that cyclization occurred before the amide proton was abstracted.

• Polymer(Korea)
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• v.30 no.2
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• pp.162-167
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• 2006

Polyamic acid (PAA) was prepared from cyclobutane-1,2,3,4-tetracarboxylic dianhydride (CBDA) and 4,4'-fiaminodiphenyl ether (DDE). In order to impart a photosensitivity to the PAA, diazonaphthoquinone (DNQ) derivative (DI) was added. However, the addition of the DI was not enough to inhibit the dissolution of the PAA for a aqueous alkal solution. Therefore, we had synthesized poly(amic acid ester)s by an adding 1,2-epoxy-3-phenoxypropane to the PAA. That is, an acidity of the PAA could be controlled by an esterification reaction of 1,2-epoxy-3-phenoxypropane with the PAA. Significant difference of a dissolution rate of the poly(amic acid ester) between an o(posed and unexposed area was observed at an acid content of 60% and less. Resolution of the positively patterned film showed about $25{\mu}m$ at the exposure dose of $200mJ/cm^2$.

• Macromolecular Research
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• v.16 no.8
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• pp.725-733
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• 2008

Polyimide (PI) multilayer thin films were prepared by spin-coating from a poly(amic acid) (PAA) and poly(amic acid) ammonium salt (PAAS). PI was prepared from pyromellitic dianhydride (PMDA) and 4,4'-oxydianiline (ODA) PAA. Different compositions of PAAS were prepared by incorporating triethylamine (TEA) into PMDA-ODA PAA in dimethylacetamide. PI multilayer thin films were spin-coated from PMDA-ODA PAA and PAAS. The PAAS comprising cationic and anionic moieties were spherical with a particle size of $20{\sim}40\;nm$. Some particles showed layers with ammonium salts, despite poor ordering. Too much salt obstructed the interaction between the polymer chains and caused phase separation. A small amount of salt did not affect the interactions of the interlayer structure but did interrupt the stacking between chains. Thermogravimetric analysis (TGA) showed that the average decomposition temperature of the thin films was $611^{\circ}C$. All the films showed almost single-step, thermal decomposition behavior. The nanostructure of the multilayer thin films was confirmed by X -ray reflectivity (XRR). The LF 43 film, which was prepared with a 4:3 molar ratio of PMDA and ODA, was comprised of uniformly spherical PAAS particles that influenced the nanostructure of the interlayer by increasing the interaction forces. This result was supported by the atomic force microscopy (AFM) data. It was concluded that the relationship between the uniformity of the PAAS particle shapes and the interaction between the layers affected the optical and thermal properties of PI layered films.

• Polymer(Korea)
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• v.25 no.2
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• pp.160-167
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• 2001

The various compositions of polyimide (PI)/polyamideimide (PAI) composites were prepared by heat treatment of the solvent cast PI precursors/PAI blends. The optical micrographs showed that a good compatibility was observed between poly(amic acid) (PAA) and PAI, but in the case of PAME/PAI mixtures, a phase separation apparently occurred due to the absence of ionic and/or H-bonding forces. Regardless of PI precursors, the similar tensile properties were observed. The tensile modulus of the composites were higher than that of the neat polyimide. The X-ray diffraction patterns of the composites showed that the chain rearrangement of PI was increased due to the plasticizing effect of PAI, which has lower glass transition temperature than that of PI, during thermal imidization process.

• Polymer(Korea)
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• v.37 no.4
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• pp.420-430
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• 2013

Polymer blends were prepared by solution blending poly(amic acid) (PAA) and poly(o-hydroxy amide) (PHA) having imide groups in the main chain. The polymers and their blends were characterized by using FTIR, FT NMR, DSC, TGA, SEM, XRD, UTM, and LOI. The solubility study revealed that the blends were readily soluble in aprotic solvents such as DMF, DMAc, DMSO, and NMP. The maximum weight loss of the blends occurred in the range of $578-645^{\circ}C$, and the maximum weight loss temperature increased with increasing the PHA content. The PBO/PI blends showed relatively high char yields (i.e. 56-69 wt%). The LOI values of the blends were in the range of 24.5-28.1% and increased with increasing the PHA content. The initial modulus and tensile strength of the blends increased by 57 to 121% and by 67 to 107%, respectively, compared to the values of PAA. Especially the initial modulus and tensile strength of the PHA/PAA=2/8(wt/wt) showed the highest values of 4.87 GPa and 108 MPa, respectively. The PHA domains of $0.03-0.1{\mu}m$ in their size were more or less uniformly dispersed. The interfacial adhesion between PAA and PHA was found to be good.

• Polymer(Korea)
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• v.34 no.6
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• pp.495-500
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• 2010

Crosslinked PI films were synthesized from 4,4'-(hexafluoro isopropylidene)diphthalic anhydride (6FDA) and bis[4-(3-aminophenoxy) phenyl] sulfone(BAPS) with various ratios of the reactive monomer cis-4-cyclohexene-1,2-dicarboxylic anhydride(CDBA). We prepared crosslinked poly(amic acid) (PAA) using a 0.1 wt% Grubbs catalyst as a crosslinking agent. The crosslinked PAA was heat-treated at different temperatures to give PI films. The thermo-mechanical properties and optical transparency of the PI films were investigated. The thermal properties of the PI films were examined using Fourier transform infrared (FTIR) spectroscopy, differential scanning calorimetry(DSC), thermogravimetric analysis(TGA), thermo-mechanical analysis(TMA), and universal tensile machine(UTM), and their optical transparencies were investigated using UV-vis. spectrophotometry. The thermomechanical properties of the PI films improved with increasing CDBA content. However, the optical transparency of the PI films decreased slightly with increasing CDBA content.