• 제목/요약/키워드: polishing characteristics

검색결과 387건 처리시간 0.043초

Nano-precision Polishing of CVD SiC Using MCF (Magnetic Compound Fluid) Slurry

  • Wu, Yongbo;Wang, Youliang;Fujimoto, Masakazu;Nomura, Mitsuyoshi
    • 한국생산제조학회지
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    • 제23권6호
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    • pp.547-554
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    • 2014
  • CVD SiC is a perfect material used for molds/dies in hot press molding of glass lens. In its fabrication process, nano-precision polishing is essential finally. For this purpose, a novel polishing method using MCF (Magnetic Compound Fluid) slurry is proposed. In this method, MCF slurry is supplied into a given gap between the workpiece and a MCF slurry carrier, and constrained within the polishing zone by magnetic forces from permanent magnet. In this paper, after an experimental rig used to actually realize the proposed method has been constructed, the fundamental polishing characteristics of CVD SiC such as the effects of process parameters including MCF slurry composition on work-surface roughness were experimentally investigated. As a result, nano-precision surface finish of CVD SiC was successfully attained with MCF slurry and the optimum process parameters for obtaining the smoothest work-surface were determined.

남녀 대학생의 캠퍼스웨어 이미지 평가와 선호도에 관한 연구 (The Image Evaluation and Preference of the Campus Wear of College Males and Females)

  • 황미선;이명희
    • 복식
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    • 제55권1호
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    • pp.139-150
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    • 2005
  • The purpose of this study was to find out differences of image evaluation according to perceiver's gender and clothing style, and to investigate the clothing preference according to the style of campus wear. Subjects were 340 college males and females in Seoul. The image of campus wear was divided into four dimensions: neatness, polishing, potency, and activity. Gender had significant influences on the perception of neatness, polishing, and potency. Males perceived the campus wear to be neater, more polished and potent than females. There were significant differences in evaluating neatness, polishing, potency, and activity according to campus wear style. The sweatshirt was estimated low in polishing and potency but high in activity. The T-shirt${\cdot}$short pants was estimated low in polishing and neatness but high in activity. The jumper was rated high in activity, and pants suit high in neatness, polishing, and potency, but it was estimated low in activity. The skirt suit was rated high in neatness and low in activity. The knit cardigan was perceived as polished image. College students preferred knit cardigan, one-piece dress, jumper, and pants suit, however, T-shirt${\cdot}$short pants was comparatively less preferred. Males estimated the knit cardigan to be more favorable than females. Characteristics of clothing image which influenced on preference of campus wear were different between males and females.

슬러리와 패드변화에 따른 텅스텐 플러그 CMP 공정의 최적화 (An Optimization of Tungsten Plug Chemical Mechanical Polishing(CMP) using the Different Sets of Slurry and Pad)

  • 김상용;서용진;이우선;이강현;장의구
    • 한국전기전자재료학회논문지
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    • 제13권7호
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    • pp.568-574
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    • 2000
  • We have been optimized tungsten(W) plug CMP(chemical mechanical polishing) characteristics using two different kinds of component of slurry and two different kinds of pad which have different hardness. The comparison of oxide film roughness on around W plug after polishing has been carried out. And W plug recess for consumable sets and dishing effect at dense area according to the rate of over-polishing has been investigated. Also the analysis of residue on surface after cleaning have been performed. As a experimental result we have concluded that the consumable set of slurry A and hard pad was good for W plug CMP process. After decreasing the rate of chemical reaction of silica slurry and adding two step buffering we could reduce the expanding of W plug void however we are still recognizing to need a more development for those kinds of CMP consumables.

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졸겔법에 의해 제작된 강유전체 BST막의 기계.화학적인 연마 특성 (Chemical Mechanical Polishing (CMP) Characteristics of BST Ferroelectric Film by Sol-Gel Method)

  • 서용진;박성우
    • 대한전기학회논문지:전기물성ㆍ응용부문C
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    • 제53권3호
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    • pp.128-132
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    • 2004
  • The perovskite ferroelectric materials of the PZT, SBT and BST series will attract much attention for application to ULSI devices. Among these materials, the BST ($Ba_0.6$$Sr_0.4$/$TiO_3$) is widely considered the most promising for use as an insulator in the capacitors of DRAMS beyond 1 Gbit and high density FRAMS. Especially, BST thin films have a good thermal-chemical stability, insulating effect and variety of Phases. However, BST thin films have problems of the aging effect and mismatch between the BST thin film and electrode. Also, due to the high defect density and surface roughness at grain boundarys and in the grains, which degrades the device performances. In order to overcome these weakness, we first applied the chemical mechanical polishing (CMP) process to the polishing of ferroelectric film in order to obtain a good planarity of electrode/ferroelectric film interface. BST ferroelectric film was fabricated by the sol-gel method. And then, we compared the surface characteristics before and after CMP process of BST films. We expect that our results will be useful promise of global planarization for FRAM application in the near future.

산화제 및 연마제 첨가를 통한 Nickel CMP 특성 개선 연구 (Improvement of Chemical Mechanical Polishing (CMP) Performance of Nickel by Additions of Abrasive and Various Oxidizers)

  • 최권우;김남훈;서용진;이우선
    • 한국전기전자재료학회논문지
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    • 제18권7호
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    • pp.605-609
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    • 2005
  • Chemical mechanical polishing (CMP) of Ni was performed by the various ratios of four kinds of oxidizers and an addition of alumina powders as an abrasive in each slurry with the different oxidizers. Moreover, the interaction between the Ni and the each oxidizer was discussed by potentiodynamic polarization measurement, in order to compare the effects of Ni-CMP and electrochemical characteristics on the Ni with the different oxidizers. As an experimental result, the removal rate of Ni reached a maximum at 1 $vol\%$ of $H_2O_2$. Also the removal rates of Ni increased with the audition of alumina abrasives in each slurry. The potentiodynamic polarization of Ni under dynamic condition showed a significant difference in electrochemical behavior by addition of $H_2O_2$ in solutions. Ni showed the perfect passivation behavior in solution without $H_2O_2$ under potentiodynamic polarization condition, while active dissolution dominates in solution with the addition of $H_2O_2$. The results indicate that the surface chemistry and electrochemical characteristics of Ni play an important role in controlling the polishing behavior of Ni.