• 한국표면공학회지
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• 제1권1호
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• pp.5-13
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• 1967

Up to this date, numerous methods of analysis of electropling solutions are published. Some, however, need lots of works before reaching final results, or require high technique and special instruments, and also some are unaccurate due to unclearnes of end point. Like our undevelop countries, technicians of electroplating shops are most high school graduates or under, and have not much knowledge on chemistry. Furthermore, those technicians have to control their plating solutions by themselves without having enough analytical laboratory equipment . Therefore, in this paper the simplest, besides accurate method is investigated after comparing numerous methods published. Among the methods of copper determinations from acid and alkaline copper plating baths, EDTA titration method are chosen, due to these methods are the simpest and fastest for the evaluation of metal content, without requirng any special instrument. For acid copper solutions, chelate titrations were accurate enough. Since the end point of titration of chelate method is variable according to the kind of indicators and other metal's coexisitence as well as solution component, many difficulties were encountered from cyanide copper, on the contrary of acid copper bath. PAN , PV, and MX indicators were tried , but it is found that MX is the best. In chyanide solution ,due to cyanide is the masking reagent , elimination of this component is essential , and finally found that elimination CN-by precipitation with AgNO$_3$ solution was the simplest and the most accurate way among others. This method was very accurate for the new plating solutions even coexistence with organic brightners. However used solutions for long months running have to be predetermined the accurate copper value by thiosulfate method form time to time, before chelate titration by means of AgNO$_3$ precipitation. Always some constant deviations will be seen according to the solutions nature. Therefore those deviation values have to be compensated each time.

• 한국산학기술학회논문지
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• 제17권7호
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• pp.273-279
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• 2016

본 논문은 니켈-텅스텐 합금 도금 공정액에 대해 혼합 상태에서 각 공정액에 대한 농도를 정확하게 측정할 수 있는 센서 및 이를 기반으로 정밀한 농도 제어를 수행할 수 있는 제어 시스템 대한 논문이다. 최근 인쇄회로기판 시장은 전자산업의 발달로 커지고 있으며, 이에 따라 금 소비도 급격하게 증가되고 있다. 하지만 금은 비싼 원자재로 금을 대체하거나 줄이기 위한 다양한 복합 도금 공정액 개발이 이루어지고 있다. 이에 비해 복합도금 공정액을 실시간으로 측정할 수 있는 센서 개발은 아직 미진한 상태이다. 더군다나 실시간으로 도금 품질을 극대화 할 수 있도록 복합 도금 공정액 농도를 측정하고 이를 토대로 농도를 제어하기 위한 시스템은 전무한 실정이다. 이에 본 논문에서는 이러한 복합 도금 공정액에 대한 농도를 정확하게 측정할 수 있는 센서 및 농도 제어를 수행하기 위한 시스템을 개발하고자 한다. 이를 위해 분광광도법을 기반으로 복합도금 공정액 농도를 정밀하게 측정할 수 있는 센서를 개발하며 센서 농도에 대한 피드백 제어를 통해 농도를 정확하게 유지할 수 있는 시스템을 개발한다.

• 한국표면공학회지
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• 제40권3호
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• pp.125-130
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• 2007

Many fundamental studies have been carried out regarding waste water and hazardous gas treatment technology using the photolysis effect of $TiO_2$. However, photolysis of both organic and organic-inorganic binders immobilizing $TiO_2$ makes permanent use impossible. In this study we manufactured a catalytic electrode by nickel-$TiO_2$ composite plating in order to immobilize $TiO_2$. The surface properties according to the current density changes of cathode and concentration changes of $TiO_2$ powder in nickel plating bath has been analysed with EDX, XRF, SEM, Raman spectrometer etc. The characterization of the catalytic electrode in decomposition of organic compound has been obtained by using UV-Visible spectrophotometer through analysing concentration changes of methyl orange solution containing the catalytic electrode vs. time with projecting UV-light in the solution. The study shows that a catalytic electrode of nickel-$TiO_2$ composite plating with high-efficiency in decompostion of organic compound has been formed under high concentration of $TiO_2$ powder and low current density of cathode.

• 한국표면공학회지
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• 제30권5호
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• pp.347-354
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• 1997

Composite plating is a method of co-depositing fine particles of metallic, non-metallic compound or polymers in the plated layer to improve material properties such as were-resistance, lubrication, or corrosion resistance. Graded Ni-Sic composite coating were produced in this research. Prior to produce Graded Ni-SiC composite coatings, effects of particle size, particle content, pH of electrolyte, temperature, current density, stirring rate on the amount of SiC deposited in the Ni layer were investigated. By manipulating current density and plating time properties of these coating were evaluated by micro-indentation hardness test.

• 한국표면공학회지
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• 제35권1호
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• pp.17-32
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• 2002

Electroplating methods by molten salts and non-aqueous melts were employed for aluminium coating on STS 316L stainless steel. After coated with Ni or non-coated surface on stainless steel, Al pulse plating was carried out in two different types of electrolytes at room temperature. The Al layer from $AlCl_3$-TMPAC melts could not obtain appreciable thickness for engineering application due to chemical reactions between deposits and moisture of air. However, The Al coating by pulse plating in the Ethylbenzene-Toluene-$AlBr_3$ systems was found to be solid coating layer with a few $\mu\textrm{m}$ scale. The conductivity of Ethylbenzene-Toluene-$AlBr_3$ electrolyte was as functions of time and agitation. By seven days exposure after mixing of the electrolyte, Al-deposited layer shows uniform and near by pore-free with high current density (higher than 30mA/$\textrm{cm}^2$). The roughness and imperfection of coating layer were decreased with a increasing agitation speed. It was found that the optimum condition for the Al pulse plating on the 316L stainless steel was a 400mA peak current, duty cycle, $t_{on}$ $t_{ off}$=3ms/1ms, and a current density of 30mA/$\textrm{cm}^2$.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2009년도 추계학술대회 논문집
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• pp.342-345
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• 2009

Electro galvanized steel is electroplated cold roller steel for improving corrosion resistance and paintability, and is widely used in automobiles and home appliances. In the electroplating line for manufacturing electro galvanized steel if plating process is carried out with impurity on conductor roll surface, the defects in manufacturing process occurs because of steel fault. For quality, polishing is always required to separate impurity on surface of conductor roll. In this study, finite element analysis of wear for polisher brush is carried out for replaced time of it.

• 한국표면공학회지
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• 제28권1호
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• pp.23-33
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• 1995

AISI 304 stainless steel has high resistance to corrosion due to the presence of a self-healing chromium oxide film on the surface, which also accounts for the difficulty in plating. Surface cleaning of this alloy is of fundamental importance in gold plating since its effectiveness puts an upper limit on the quality of the final coating. The cleaning of AISI 304 stainless steel was investigated with elimination of artificial passive oxide film and degreasing of remaining buffing wax as stearic acid. The familiar cleaning methods i.e. ultrasonic cleaning, electro-cleaning and activation treatment were fabricated in this study. Activation treatment showed best cleaning efficiency for elimination of passive oxide film among these methods, which was also confirmed by AES (Auger electron spectrometer) analysis. However, the best condition of cleaning was obtained by combining these methods. Electrocleaning time, for degreasing the stearic acid layer, was decreased with increasing amount of added KCN.

• Bulletin of the Korean Chemical Society
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• 제33권5호
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• pp.1603-1607
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• 2012

The effects of plating process on the surface coverage of the accelerator were investigated in terms of Cu superfilling for device metallization. When a substrate having 500 nm-wide trench patterns on it was immersed in an electrolyte containing poly (ethylene glycol) (PEG)-chloride ion ($Cl^-$)-bis(3-sulfopropyl) disulfide (SPS) additives without applying deposition potential for such a time of about 100s, voids were generated inside of the electrodeposit. In time-evolved electrochemical analyses, it was observed that the process (immersion without applying potential) in the electrolyte led to the build-up of high initial coverage of SPS-Cl on the surface, resulting in the fast saturation of the coverage. Repeated experiments suggested that the fast saturation of SPS-Cl failed in superfilling while a gradual increase in the SPS-Cl coverage through competition with initially adsorbed PEG-Cl enabled it. Consequently, superfilling was achievable only in the case of applying the plating potential as soon as the substrate is dipped in an electrolyte to prevent rapid accumulation of SPS-Cl on the surface.

• 한국재료학회지
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• 제24권11호
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• pp.617-624
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• 2014

To elucidate the effects of a pretreatment process on the uniformity of Ag electroless plating on Cu flakes, pretreatment time was mainly considered with a mixed solution of 0.15 M ammonium hydroxide and 0.0375 M ammonium sulphate. Optical inspection of Ag-coated Cu flakes determined that the optimal pretreatment time is 120 s. Repetition of the sequence in which Ag plating was done immediately after the pretreatment of 120 s clearly enhanced the plating uniformity. Scanning electron microscopy revealed that holes were formed irregularly on some Cu flakes during the period from the asdropping of an Ag precursor solution to 5 min. The hole formation was judged to be due to continuous removal of Cu on the local surfaces by the repetitive formation and elimination of $Cu_2O$ or $Cu(OH)_2$ layers. However, the increase of the amount of Ag coating suppressed the hole creation and increasingly enhanced the antioxidant property.

• 한국수소및신에너지학회논문집
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• 제27권3호
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• pp.306-310
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• 2016

In Na-base Battery for ESS, ${\alpha}-Al_2O_3$ and metal bonding was used to prevent direct reaction between electrolyte and electrode. The hard metal was metalized at $1600^{\circ}C$ in a flowing hydrogen gas for high bonding strength. In this study, instead of hard metal metalizing, Ni was plated on ${\alpha}-Al_2O_3$ by electroless Ni plating technique and then bonded with metal. To enhance the bonding strength, surface of ${\alpha}-Al_2O_3$ was treated with $H_3PO_4$. The effects of strength and leakage of joining as a function of acid treatment time on ${\alpha}-Al_2O_3$ are described.