• Title/Summary/Keyword: plating solution

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Plating Solution Composition Control of Tin-Cobalt Alloy Electroplating Process (Tin-Cobalt 합금 도금공정에서 도금물성 향상을 위한 최적 용액조성 디자인)

  • Lee, Seung-Bum;Hong, In-Kwon
    • Applied Chemistry for Engineering
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    • v.17 no.2
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    • pp.150-157
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    • 2006
  • The alternate plating method was suggested by a tin-cobalt alloy plating process which has excellent mechanical characteristics and also favorable to environment. Tin-cobalt alloy plating has many advantages such as nontoxicity, variable color-tone, and no post-treatment process. In this study, the plating conditions such as temperature, pH, current density, plating time, and amount of additive (glycine) were determined in the tin-cobalt alloy plating process through Hull-cell test and surface analysis. As the result of Hull-cell analysis, brightness became superior as the amount of glycine increased. It was found that the optimum alloy ratio was 0.03 M of $SnCl_{2}{\cdot}2H_{2}O$ and 0.05 M of $CoSO_{4}{\cdot}7H_{2}O$ at $50^{\circ}C$, pH 8.5, and $0.5A/dm^2$. The optimum amount of additive was 15 g/L of glycine and 0.1 g/L of organic acid. Then, the solution including glycine was recommended as an optimum plating solution for a chromium plating process.

Studies on Control of Gilding Liquid (도금액 관리에 관한 조사연구)

  • Shin, Jong-Chul;Park, Kwang-Ja;Lee, Sung-Joo;Lee, Jong-Yong
    • Journal of the Korean institute of surface engineering
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    • v.10 no.1
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    • pp.1-18
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    • 1977
  • To support the domestic plating industry concerning localized products, survey was conducted in with chemicals and properties of plating solution. Collected samples from 55 factories throughout the country were investigated by spectigated by spectrograph, Hull cell test chemical analysis method to find major chemical components of the plating solution.

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Electroless Ni-P layer Characteristics in accordance with the plating process conditions (무전해 Ni-P 도금의 공정조건에 따른 도금피막 특성변화)

  • Lee Hong-Kee;Jeon Jun-Mi;Park Hae-Duck
    • Journal of the Korean institute of surface engineering
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    • v.36 no.3
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    • pp.263-271
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    • 2003
  • Optimal conditions of electroless nickel plating in acid baths has been studied for industrial applications of a developed EN solution. The phosphorus content in the deposition ranges from 8 to $12\;wt.\%$. The investigated EN plating parameters are ion concentrations of nickel and hypophosphite, concentration of reducing and complexing agent, temperature, and pH. The average plating rate of Ni-P deposition was ca. $14{\mu}m/h$. The EN solution used shows a deposition rate of $10{\mu}m/h$ up to seven metal turnovers.

Design of Fast Acting Fuse Characteristics Using a Precision Multi-layer Thin Film Plating (정밀 다층 박막 도금을 이용한 빠른 동작 퓨즈 특성 설계)

  • Kim, Eun-Min;Kang, Chang-Yong
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.65 no.3
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    • pp.445-451
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    • 2016
  • General fuse elements of solution for fast acting operation characteristics made using silver or silver alloy, those are not able to dominate cost competition to the advanced global leaders that have not only high technology but competitive price. In this study, the method that compose the fuse elements manufactured solution of fast acting operation characteristics by using precision multi-layer thin film plating and helical cutting process from low-priced copper metal. Furthermore, in order to move rated current line of fuse due to the heat loses, the manufacture construction method of fixed resistor is introduced, and then Ni-P plating layer and Sn plating layer are introduced multiply for controling fine opening time characteristics. So this study can establish the high productive and low-priced production method.

Effect of Added Supercritical CO2 on the Characteristics of Copper Electroless Plating on PET Film Substrate (PET 필름기재의 구리 무전해도금에 있어서 초임계 CO2 유체가 도금 특성에 미치는 영향)

  • Lee, Hee-Dai;Kim, Moon-Sun;Kim, Chul kyung
    • Korean Chemical Engineering Research
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    • v.45 no.4
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    • pp.384-390
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    • 2007
  • In this study, electroless plating of copper was performed on PET film by using the blend of supercritical $CO_2$ and plating solution. The optimum volumetric ratio of supercritical fluid and plating solution was found to be 1:9 and dispersion property was poor at $CO_2$ vol% langer than 10%. Electroless plating of copper was best at $25^{\circ}C$ and 15 MPa. Role of added supercritical $CO_2$ is not to increase solubility but to disperse and maintain Cu-particles as the 1st particles.

Excellent Seam Weldable Nano-Composite Coated Zn-Ni Plating Steels for Automotive Fuel Tank

  • Jo, Du-Hwan;Yun, Sang-Man;Park, Kee-Cheol;Kim, Myung-Soo;Kim, Jong-Sang
    • Corrosion Science and Technology
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    • v.18 no.1
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    • pp.16-23
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    • 2019
  • Steels for automotive fuel tank require unique properties such as corrosion resistance for fuel, welding for joining, forming for press, and painting for exterior. Recently, automakers have been requiring excellent seam weldable steels to enhance manufacturing productivity of fuel tank. Thus, POSCO developed a new type of functional steels coated with nano-composite thin layer on Zn-Ni plating steels. The nano-composite coating solution was prepared by mechanical fine dispersion of solutions consisting of polymeric resin and nano-composite materials in aqueous media. The composite solution was coated on the plating steel surface by using roll coater and cured through induction furnace. These new developed plating steels were evaluated for quality performances such as seam and spot weldability, press formability, and corrosion resistance. These new functional steels coated with nano-composite layer exhibited excellent seam weldability and press formability. Detailed discussion of coating solution and experimental results suggest that nano-sized composite dispersion as coating layer plays a key role in enhancing the quality performance.

A Study on Composite Electroless Nikel Plating with Ceramic Dispersive (비금속 분체를 이용한 무전해 니켈 복합도금에 관한 연구)

  • 김용규;박수훈
    • Journal of the Korean institute of surface engineering
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    • v.22 no.1
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    • pp.43-51
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    • 1989
  • The characteristion of composite electroless Nikel palting on the condition of adding 3kinds ceramic dispersives, Al2O3, Si3O4 and artificial diamond powder were studied. Decreasing solution temperature for composite plating was required to depress the spontaneous decomposition caused by dispersive including enlargement of reaction surface. The rate of composite plating was faster than that of general electroless-Nickel plating without dispersive. this increasing tendency of plating rate was remarkable for the active catalysis, like diamond powder.

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A Study on the Low Temperature Preparation and the Practical Application of Ferrite Films by New Techniques. (신 기술에 의한 페라이트 막의 저온 제작과 그 응용에 관한 연구)

  • 최동진
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.11 no.8
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    • pp.658-663
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    • 1998
  • Ferrite plating enables were grown by ferrite by plating method in solution at low temperature(<10$0^{\circ}C$). This faciltates the fabrication of new ferrite thin film devices using non- heat-resistant materials(plastic, GaAs ect) as substrates. Combining the ferrite plating with sonochemistry, application of power ultrasonic waves to stimulate chemical reactions, the crystallinity and qualities of films were improved. Modifying the reactions cell and plating conditions further improved the film quality.

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DISCOLORATION AND CORROSION RESISTANCE OF TiN-COATED ORTHODONTIC APPLIANCES PRODUCED BY ION-PLATING METHOD (Ion-plating법에 의하여 TiN 피막처리된 교정용 장치물의 변색성 및 내식성)

  • Kim, Jin-Hee;Kwon, Oh-Won;Choi, Young-Yun
    • The korean journal of orthodontics
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    • v.23 no.3 s.42
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    • pp.327-340
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    • 1993
  • The purpose of this study was to estimate the possibility of practical application of TiN ion-plating method on orthodontic appliances. TiN was coated on the surface of orthodontic stainless steel roll band by means of ion-plating method, and colorimetric properties of its obtained TiN film were investigated by using color analyzer. Also its corrosion and discoloration properties were compared with those of non ion-plated stainless steel roll band by using immersion test, which was done in 1N HCl solution for 10 days. Both weight changes and surface corrosion appearances of specimens for each day were respectively investigated by using electronic weighing machine and SEM(Scanning Electron Microscope). The discoloration degress of TiN-coated specimens immersed in 1N HCl solution were investigated by using color analyzer and then judged by N.B.S.(National Bureau of Standard) Unit. The results of this study were summarized as follows. o TiN ion-plated films showed the hue of 5Y, the value of 7, and the chroma of 3 by Munsell notations. o The weight losses and surface changes of TiN ion-plated specimens immersed in 1N HCl solution were less than those of non ion-plated specimens. It was shown, therefore, that the corrosion resistance was significantly improved by TiN ion-plating. o The discoloration degrees of non ion-plated specimens were too significant to be examined by color analyzer, while those of TiN ion-plated specimens were slight when judged by N.B.S. Unit. It was also apparent, therefore, that the anti-discoloration property was significantly improved by TiN ion-plating.

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Effects of Bath Compositions and Plating Conditions on Electroless Copper Plating Rate with Sodium Hypophosphite as Reducing Agent (환원제로 차아인산나트륨을 사용한 무전해 동도금속도에 미치는 도금액 조성과 도금조건의 영향)

  • Oh, I.S;Park, J.D.;Bai, Y.H.
    • Journal of Power System Engineering
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    • v.5 no.2
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    • pp.71-78
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    • 2001
  • Using sodium hypophosphite as reducing agent, bath composition and plating condition of electroless copper plating on plating rate have been studied. The followings were determined as optimum, bath composition; $CuSO_4\;0.025M,\;NiSO_4\;0.002M,\;NaH_2PO_2\;0.4M$, sodium citrate 0.06M, $H_3BO_3$ 0.6M, thiourea or 2-MBT $0.2mg/{\ell}$, and operation conditions; pH $9{\sim}10$ at bath temperature rage of $60{\sim}70^{\circ}C$. A small amount of nickel ion($Ni^{2+}/Cu^{2+}$=0.002/0.025) to the hypophosphite reduced solution promotes autocatalysis and continuous plating. An additive such as thiourea or 2-MBT of a small amount($0.2mg/{\ell}$) can be used to stabilize the solution without changing plating rate much. The attivation energy between $20^{\circ}C\;and\;70^{\circ}C$ were calculated to be 11.3kcal/mol for deposition weight. Plating reaction had been ceased by the adjustment of pH above 13, temperature higher than $90^{\circ}C\;and\;under\;20^{\circ}C$. Deposited surface became worse in the case of increment of bath temperature above $80^{\circ}C$.

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