• Korean Journal of Heritage: History & Science
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• v.52 no.1
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• pp.4-21
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• 2019

In this paper, 23 Silla gold earrings from the sixth and seventhand centuries, excavated from the Yeongnam region, were analyzed. Based on the silver content of the gold plate, they were classified into three types. The classifications included type I(20-50wt%), type II(10-20wt%) and type III (less than 10wt%). In the analysis process, the composition and morphological differences were identified on the surface of the gold plate. In the case of type I and II earrings, it was observed that the fine holes were concentrated in a relatively higher part of the gold content. The causes of the difference in the surface composition of the gold plate were divided into four categories: 1) surface treatment, 2) thermal diffusivity in the manufacturing process, 3) differences in composition of alluvial gold, and 4) the refining method of gold. It is possible that depletion gilding was attempted to increase the gold content while intentionally removing the other metals from the surface of the gold alloy in the portion where the gold deposit is relatively concentrated on the surface of the gold plating. The highest copper content was detected in the earring with the highest gold content of the analyzed earrings, and it was assumed that thermal diffusion had occurred between the gold plate and the metal rod during the manufacturing process rather than intentional addition. Copper was detected only in the thin ring earring type, and copper was not detected in the thick ring earring type or pendant type. It also proves that this earring has a high degree of tightness at higher temperatures, as there was an invisible edge finish on other earrings and horizontal wrinkles on the gold plate surface. In terms of the material of the gold plate, we examined whether the silver content of the gold plate was natural gold or added by alloy through analyzing the alluvial gold collected in the region. As a result of the analysis, it was found that on average about 13wt% of silver is included. This suggests that type II is natural gold, type III is refined gold, and type I seems to have been alloyed with natural gold. Here, we investigated the refining method introduced in the ancient literature, both at home and abroad, about the possibility of alloying silver after the refining process of type III earrings and then making pure gold. It was found that from ancient refining methods, silver which had been present in the natural gold was removed by reacting and combining with silver chloride or silver sulfide, and long-term efforts and techniques were required to obtain pure gold through this method. Therefore, it was concluded that the possibility of adding a small amount of silver in order to increase strength after making pure gold through a refining process is low.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.3 s.32
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• pp.37-45
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• 2004

Electroless Ni(P) has been widely used for under bump metallization (UBM) of flip chip and surface finish layer in microelectronic packaging because of its excellent solderability, corrosion resistance, uniformity, selective deposition without photo-lithography, and also good diffusion barrier. However, the brittle fracture at solder joints and the spatting of intermetallic compound (IMC) associated with electroless Ni(P) are critical issues for its successful applications. In the present study, the mechanism of IMC spatting and microstructure change of the Ni(P) film were investigated with varying P content in the Ni(P) film (4.6,9, and $13 wt.\%$P). A reaction between Sn penetrated through the channels among $Ni_3Sn_4$ IMCs and the P-rich layer ($Ni_3P$) of the Ni(P) film formed a $Ni_3SnP$ layer. Thickening of the $Ni_3SnP$ layer led to $Ni_3Sn_4$ spatting. After $Ni_3Sn_4$ spatting, the Ni(P) film directly contacted the molten solder and the $Ni_3P$ phase further transformed into a $Ni_2P$ phase. During the crystallization process, some cracks formed in the Ni(P) film to release tensile stress accumulated from volume shrinkage of the film.

• Composites Research
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• v.33 no.5
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• pp.235-240
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• 2020

In this study, in order to improve the impact resistance of the B₄C tile-inserted B₄C_p/Al7075 hybrid composite, a control method of the B₄C/Al7075 interface was developed and the characteristics of the controlled interface were analyzed. B₂O₃, Ni, and Si were coated on the B₄C tile surface using additional thermal oxidation, electroless plating, and plasma spraying. The coated B₄C tile is inserted into the B₄C_p/Al7075 composite material using the liquid pressurization method. Interfacial energy, bonding strength, and impact resistance were measured to analyze the effect of the coating. All coatings enhanced interfacial energy, bonding strength, and impact resistance, and in particular, it was confirmed that the impact resistance increased by 86.8% when B₂O₃ coating was used. This study is significant in developing and analyzing a core surface treatment method that improves the performance of B₄C/Al series composites, which are attracting attention as next-generation lightweight amour and bulletproof materials.

• Journal of Energy Engineering
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• v.5 no.2
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• pp.108-114
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• 1996

It is one of the most important factors to enhance the efficiency of the solar collectors by in-creasing collecting efficiency and decreasing heat loss. The pulse electrodeposition method has been involved in this study to improve characteristics of the solar selective coating on 230cm${\times}$60cm substrates and electrical efficiency of the process. The composition of the electrolyte was 280 g/$\ell$ chromic acid, 15 g/$\ell$ propionic acid, and 10 g/$\ell$ appropriate additive. 230cm${\times}$60cm copper and aluminium sheets were utilized as the substrates. It has been observed that the black chrome coatings exhibited reasonable optical properties for commercialization when the plating parameters were properly controlled; the absorptance was 0.98 and 0.97 and omittance was 0.17 and 0.23 for copper and aluminium substrate, respectively. This study implies that the pulse current electrolysis method could be applied to the large scale substrates, and the various products can be avilable after the consideration of the thermal conductivity, heat transfer efficiency and cost problems of the substrates.

• Journal of Advanced Marine Engineering and Technology
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• v.39 no.3
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• pp.223-229
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• 2015

Surface modification is a technology to form a new surface layer and overcome the intrinsic properties of the base material by applying thermal energy or stress onto the surface of the material. The purpose of this technique is to achieve anti-corrosion, beautiful appearance, wear resistance, insulation and conductance for base materials. Surface modification techniques may include plating, chemical conversion treatment, painting, lining and surface hardening. Among which, a surface modification process using electrolytes has been investigated for a long time in connection with research on its industrial application. The technology is highly favoured by various fields because it provides not only high productivity and cost reduction opportunities, but also application availability for components with complex geometry. In this study, an electrochemical experiment was performed on the surface of 5083-O Al alloy to determine an optimal electrolyte temperature, which produces surface with excellent corrosion resistance under marine environment than the initial surface. The experiment result, the modified surface presented a significantly lower corrosion current density with increasing electrolyte temperature, except for $5^{\circ}C$ of electrolyte temperature at which premature pores was created.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.7
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• pp.334-341
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• 2016

In this paper, the study of a waveguide aperture-coupled feed-structured antenna has been conducted for the purpose of applying it to a wireless back-haul system sufficient for high-capacity gigabits-per-second data rates. For this study, a $32{\times}32$ waveguide slot sub-array antenna with a corporate-feed structure was designed and produced. Also, this antenna is used at 57 GHz to 66 GHz in the V-band. The construction of the antenna is a laminated form with radiating parts (outer groove and slot, cavity), a coupled aperture, and feeds in each. The antenna was designed with HFSS, which is based on 3D-FEM, produced with aluminum processed by a precision-controlled milling machine, and assembled after a silver-plating process. The measurement result from analysis of the characteristics of the antenna shows that return loss is less than -12 dB, VSWR < 2.0, and a wide bandwidth ranges up to 16%. An overall first side lobe level is less than -12.3 dB, and a 3 dB beam width is narrow at about $1.85^{\circ}$. Also, antenna gain is 38.5 dBi, offering high efficiency exceeding 90%.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.450-455
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• 2002

Cu-cored Sn-Ag solder balls were fabricated by coating pure Sn and Ag on Cu balls. The melting behavior and the solderability of the BGA joint with the Ni/Au coated Cu pad were investigated and were compared with those of the commercial Sn-Ag and Sn-Ag-Cu balls. DSC analyses clarified the melting of Cu-cored solders to start at a rather low temperature, the eutectic temperature of Sn-Ag-Cu. It was ascribed to the diffusion of Cu and Ag into Sn plating during the heating process. After reflow soldering the microstructures of the solder and of the interfacial layer between the solder and the Cu pad were analyzed with SEM and EPMA. By EDX analysis, formation of a eutectic microstructure composing of $\beta$-Sn, Ag$_3$Sn, ad Cu$_{6}$Sn$_{5}$ phases was confirmed in the solder, and the η'-(Au, Co, Cu, Ni)$_{6}$Sn$_{5}$ reaction layer was found to form at the interface between the solder and the Cu pad. By conducting shear tests, it was found that the BGA joint using Cu-cored solder ball could prevent the degradation of joint strength during aging at 423K because of the slower growth me of η'-(Au, Co, Cu, Ni)$_{6}$Sn$_{5}$ reaction layer formed at the solder, pad interface. Furthermore, Cu-cored multi-component Sn-Ag-Bi balls were fabricated by sequentially coating the binary Sn-Ag and Sn-Bi solders on Cu balls. The reflow property of these solder balls was investigated. Melting of these solder balls was clarified to start at the almost same temperature as that of Sn-2Ag-0.75Cu-3Bi solder. A microstructure composing of (Sn), Ag$_3$Sn, Bi and Cu$_{6}$Sn$_{5}$ phases was found to form in the solder ball, and a reaction layer containing primarily η'-(Au, Co, Cu, Ni)$_{6}$Sn$_{5}$ was found at the interface with Ni/Au coated Cu pad after reflow soldering. By conducting shear test, it was found that the BGA joints using this Cu-core solder balls hardly degraded their joint shear strength during aging at 423K due to the slower growth rate of the η'-(Au, Cu, Ni)$_{6}$Sn$_{5}$ reaction layer at the solder/pad interface.he solder/pad interface.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.40 no.10
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• pp.629-636
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• 2016

This study presents the development of an acid resistance velocity sensor that is used for measuring velocity inside a copper sulfate plating bath. First, researchers investigated the acid resistance coating to confirm the suitability of the anti-acid sensor in a very corrosive environment. Then, researchers applied signal processing methods to reduce noise and amplify the signal. Next, researchers applied a pressure-resistive sensor with an operation amplifier (Op Amp) and low-pass filter with high impedance to match the output voltage of a commercial flowmeter. Lastly, this study compared three low-pass filters (Bessel, Butterworth and Chebyshev) to select the appropriate signal process circuit. The results show 0.0128, 0.0023, and 5.06％ of the mean square error, respectively. The Butterworth filter yielded more precise results when compared to a commercial flowmeter. The acid resistive sensor is capable of measuring velocities ranging from 2 to 6 m/s with a 2.7％ margin of error.

• Resources Recycling
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• v.13 no.1
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• pp.28-38
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• 2004

The characteristics of cyanide decomposition in aqueous phase by electric oxidization have been explored in an effort to develop a process to recycle waste water. Considering current efficiency and voltage, the free cyanide decomposition experiment by electric oxidization indicated that 5 V of voltage and copper catalytic Cu/CN mole ratio 0.05 was the most appropriate condition, where current efficiency was 26%, and decomposition speed was 5.6 mM/min. High voltage and excess copper addition increased decomposition speed a little bit but not current efficiency. The experiment of free cyanide density change proves that high density cyanide is preferred because speed and current efficiency increase with density. Also, the overall decomposition reaction could be represented by the first order with respcect to cyanide with the rate constant of $1.6∼7.3${\times}$10^{-3}$ $min^{-1}$ The mass transfer coefficient of electric oxidization of cyanide came out as $2.42${\times}$10^{-5}$ $min^{-1}$ Furthermore, the Damkohler number was calculated as 5.7 in case of 7 V and it was found that the mass transfer stage was the rate determining step.

• Resources Recycling
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• v.11 no.2
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• pp.3-13
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• 2002

The characteristics of cyanide decomposition in aqueous phase by hydrogen peroxide have been explored in an effort to develop a process to recycle waste water. The self-decomposition of $H_2O$$_2$at pH 10 or below was minimal even in 90 min., with keeping about 90% of $H_2O$$_2$undissociated. On the contrary, at pH 12 only 9% of it remained during the same time. In the presence of copper catalyst at 5 g Cu/L, complete decomposition of $H_2$O$_2$was accomplished at pH 12 even in a shorter time of 40 min. The volatility of free cyanide was decisively dependent on the solution pH: the majority of free cyanide was volatilized at pH 8 or below, however, only 10% of it was volatilized at pH 10 or above. In non-catalytic cyanide decomposition, the free cyanide removal was incomplete in 300 min. even in an excessive addition of $H_2$$O_2$at a $H_2$$O_2$/CN molar ratio of 4, with leaving behind about 8% of free cyanide. On the other hand, in the presence of copper catalyst at a Cu/CN molar ratio of 0.2, the free cyanide was mostly decomposed in only 16 min. at a reducedH202/CN molar ratio of 2. Ihe efnciency of HBO2 in cyanide decomposition decreased with increasing addition of H2O2 since the seu-decomposition rate of $H_2$$O_2$increased. At the optimum $H_2$$O_2$/mo1ar ratio 0.2 of and Cu/CN molar ratio of 0.05, the free cyanide could be completely decomposed in 70 min., having a self-decomposition rate of 22 mM/min and a H$_2$$O_2$ efficiency of 57%.