• Journal of Korean Society of Occupational and Environmental Hygiene
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• v.16 no.1
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• pp.68-80
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• 2006

This study aimed to prepare the fundamental data and assess the status and trend of exposure level for 5 chemical substances such as sulfuric acid, hydrogen chloride, ammonia, formaldehyde and phenol in manufacturing industry by type of industry, working process, and size of factory, chronological change. Subjects related to this study consist of 146 factories, 12 industries and 17 working processes located in Busan area from Jan. 1997 to Dec. 2001. 1. All 5 kinds of chemical substances by type of industry, working process were generated in chemical manufacturing industry. There were founded in 8 types of industries and 13 types of working processes for ammonia, which is the highest number of in all 5 chemical substances. 2. In terms of the exposure level for 5 chemical substances by type of industry, working process, geometric mean concentration for sulfuric acid was $0.40mg/m^3$ in manufacture of chemicals and chemical products, $0.30mg/m^3$ in compounding process, for hydrogen chloride was 0.57 ppm in manufacture of basic metal, 0.48 ppm in dyeing process, for ammonia was 1.11 ppm in manufacture of rubber and plastic products, 0.94 ppm in buffing process, for formaldehyde was 0.49 ppm in manufacture of wood and of products of wood and cork, except furniture; manufacture of articles straw and plating materials, 0.53 ppm in mixing process, and for phenol were 0.53 ppm in manufacture of chemical and chemical products, 0.55 ppm in compounding process, respectively. Results for 5 chemical substances by type of industry and working process were significantly higher than those of the others(p<0.05). 3. The exposure level for hydrogen chloride, formaldehyde were significantly increased by size of industry (p<0.01). ammonia was significantly decreased by size of industry (p<0.01). 4. In trend of the concentration difference of five chemical substances by chronology, geometric mean concentration for sulfuric acid was significantly increased (p<0.01), hydrogen chloride and ammonia were significantly decreased by year (p<0.05) and for formaldehyde and phenol were decreased in chronological change. According to the above results 5 chemical substances were founded together in a way mixed in the same places one another and concentrations of chemical substances by industry, working process, size of industry and year appeared markedly. The authors recommend more systemic and effective work environmental management should be conducted in workplaces generating five chemical substances.

• Resources Recycling
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• v.22 no.3
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• pp.91-99
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• 2013

Steel industry which has been accomplishes the base of our country economy, automobile and electronic industry are taking charge of the role, whose electroplating is important. Large amount of wastewater and various metal salts, including hazardous materials was generated from the electroplating pre-treatment, plating, washing and post-plating. Currently, the general wastewater follows in the environmental law and neutralization after controlling, sludge where the various metal is mixed reclaims below multiple regulative and trust it is controlling. The sludge which includes the gas price metal reclaims in the field and trust it controls. a reclamation price of land it is insufficient but and the control expense holds plentifully and it loses the gas price metal which is valuable. Consequently, The research regarding to recover a gas price metal actively from this waste water, it is advanced. A new method to recover valuable metals from electroplating wastewater synthesis of metal sulfides using topical methods utilizing iron oxidizing bacteria, reagent of sulfides and solvent extraction using an organic solvent, such as the development of the law to recover these metals and metal sulfides of wastewater using selective recovery have been studied. By using these wastewater treatment method under frequency above 95%, it has been obtained the valuable metal from the wastewater, where the metal ion of Fe, Cu, Zn and Ni complexes was mixed. As we discuss the wastewater, which has been discharged from electroplating process, it is important and will be applied to the resources of metal in the urban mine.

• Clean Technology
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• v.3 no.2
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• pp.57-73
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• 1997

Metal cleaning process is a technology which removes oil, dust and soil etc. on the surface of metal utilizing cleaning agents. These contaminants disturb the following processes such as plating and painting etc. if they are not removed. Thus, metal cleaning is typically an environmentally hazardous activity. Until recently, vapor degreasers as utilizing chlorinated solvents have been relatively cheap, extraordinarily versatile and waste disposal costs have been perceived as insignificant. Today, however, it is readily apparent that Industry's reliance upon chlorinated solvents as metal cleaners have resulted in a myriad of environmental, health and safety concerns. Therefore, this paper studies on a parameter and a sort of the alternative cleaning agents for the optimum cleaners. Also, a great deal of effort has been devoted to developing alternative metal cleaning technologies in advanced countries and some processes are being commercialized among them. We are going to consider alternative aqueous cleaning agents replacing organic chlorinated solvents and to pursue a domain application through a successful improvement case.

• Transactions on Electrical and Electronic Materials
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• v.10 no.3
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• pp.71-74
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• 2009

Electroplated Cu is a cost efficient metallization method in microelectronic packaging applications. Typically in 3-D chip staking technology, utilizing through silicon via (TSV), electroplated Cu metallization is inevitable for the throughput as well as reducing the cost of ownership (COO).To achieve a comparable film quality to sputtering or CVD, a pre-cleaning process as well as plating process is crucial. In this research, atmospheric plasma is employed to reduce the usage of chemicals, such as trichloroethylene (TCE) and sodium hydroxide (NaHO), by substituting the chemical assisted organic cleaning process with plasma surface treatment for Cu electroplating. By employing atmospheric plasma treatment, marginally acceptable electroplating and cleaning results are achieved without the use of hazardous chemicals. The experimental results show that the substitution of the chemical process with plasma treatment is plausible from an environmentally friendly aspect. In addition, plasma treatment on immersion Sn/Cu was also performed to find out the solderability of plasma treated Sn/Cu for practical industrial applications.

• Journal of the Semiconductor & Display Technology
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• v.20 no.2
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• pp.6-13
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• 2021

Cases and studies on the selection method of CTQ are relatively active, but there are few cases or studies on the selection method of CTP which is important in the device industry. In fact, many companies simply select and manage CTP from the point of contact based on their experience and intuition. The purpose of this study is to present an evaluation model and a mathematical decision model for rational and systematic CTP selection to improve the process quality of semiconductor equipment lines. In the evaluation model, AHP (Analytic Hierarchy Process) analysis technique was applied to show objective and quantitative figures, and Fuzzy decision-making model was used to solve the ambiguity and uncertainty in the decision-making process. Decision Value (DV) was presented. The subjects were 22 process factors managed in the Plating Process that the representative equipment line can do. As a result, the evaluation model proposed in this study can support more efficient and effective decision-making for process quality improvement by more objectively measuring the problem of subjective CTP selection in manufacturing sites.

• Journal of Advanced Marine Engineering and Technology
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• v.40 no.9
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• pp.774-779
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• 2016

This study was performed to study the possibility of TMCP's application for side shell plating curved structures through mechanical property testing to understand if the rules and regulations of DNV and the quality standard of IACS after line heating for TMCP steel and normalizing DH32 material steel could be satisfied. Experimental results showed that TMCP's strength was measured to YS = 385 MPa, 18% higher than the required 315 MPa and TS = 525 MPa, complying with the required range of between 440 and 570 MPa. The minus 20 degree impact test for the Charpy V-Notch complied with the required standard and in addition the hardness test satisfied the requirement of 'Hv10 = 130 ~ 320' by reaching an average of T : 216 and L : 275 respectively.

• Journal of Radiation Industry
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• v.8 no.3
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• pp.141-146
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• 2014

Nickel (Ni) electroplating was implemented by using a metal Ni powder in order to establish a $^{63}Ni$ plating condition on the PN junction semiconductor needed for production of beta-voltaic battery. PN junction semiconductors with a Ni seed layer of 500 and $1000{\AA}$ were coated with Ni at current density from 10 to $50mA\;cm^{-2}$. The surface roughness and average grain size of Ni deposits were investigated by XRD and SEM techniques. The roughness of Ni deposit was increased as the current density was increased, and decreased as the thickness of Ni seed layer was increased. The results showed that the optimum surface shape was obtained at a current density of $10mA\;cm^{-2}$ in seed layer with thickness of $500{\AA}$, $20mA\;cm^{-2}$ of $1000{\AA}$. Also, pure Ni deposit was well coated on a PN junction semiconductor without any oxide forms. Using the line width of (111) in XRD peak, the average grain size of the Ni thick firm was measured. The results showed that the average grain size was increased as the thickness of seed layer was increased.

• Journal of Radiation Industry
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• v.6 no.3
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• pp.223-229
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• 2012

In this study, we investigated the biological damage and stress responses induced by ion beam (proton beam) irradiation as a basis for the development of protective measures against space radiation. We examined the biological effects of proton beam produced by MC-50 cyclotron at KIRAMS on the cultured cells and mice. The proton beam energy used in this study was 34.9 MeV and the absorption dose rate for cells and mice were $0.509Gy\;sec^{-1}$ and $0.65Gy\;sec^{-1}$, respectively. The cell survival rates measured by plating efficiency showed the different sensitivity and dose-relationship between CHO cells and Balb/3T3 cells. HGPRT gene mutation frequency in Balb/3T3 was $15{\times}10^{-6}Gy^{-1}$, which was similar to the reported value of X-ray. When stress signaling proteins were examined in Balb/3T3 cells, $I{\kappa}B-{\alpha}$ decreased markedly whereas p53, phospho-p53, and Rb increased after proton beam irradiation, which implied that the stress signaling pathways were activated by proton beam irradiation. In addition, cellular senescence was induced in IMR-90 cells. In the experiments with C57BL/6 mouse, the immune cells (white blood cells, lymphocytes) in the peripheral blood were greatly reduced following proton beam irradiation whereas red blood cells and platelets showed relatively little change. These results can be utilized as basic data for studying the biological effects of proton beam using MC-50 cyclotron with respect to proton therapy research as well as space radiation research.

• Journal of the Korean Society of Industry Convergence
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• v.26 no.5
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• pp.875-884
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• 2023

Hydrogen infiltration into metals has been reported to induce alterations in their mechanical properties under load. In this study, we conducted CTOD (Crack Tip Opening Displacement) tests on steel specimens designed for use in liquid hydrogen storage systems. Electrochemical hydrogen charging was performed using both FCC series austenitic stainless steel and BCC series structural steel specimens, while CTOD testing was carried out using a 500kN-class material testing machine. Results indicate a notable divergence in behavior: SS400 test samples exhibited a higher susceptibility to failure compared to austenitic stainless steel counterparts, whereas SUS 316L test samples displayed minimal changes in displacement and maximum load due to hydrogen charging. However, SEM (Scanning Electron Microscopy) analysis results presented challenges in clearly explaining the mechanical degradation phenomenon in the tested materials. This study's resultant database holds significant promise for enhancing the safety design of liquid hydrogen storage systems, providing invaluable insights into the performance of various steel alloys under the influence of hydrogen embrittlement.

• Journal of Radiation Industry
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• v.17 no.4
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• pp.543-549
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• 2023

Thallium-201 (²⁰¹Tl) is a medical radioisotope which emits gamma rays when it decays and used in myocardial perfusion scans in single-photon emission tomography due to its similar properties to potassium. Currently, the Korea Institute of Radiological & Medical Sciences is the only institution producing ²⁰¹Tl in Korea, and optimization of ²⁰¹Tl production research is necessary to meet supply compared to domestic demand. To this end, technical analysis of plating target production and chemical separation methods essential for ²⁰¹Tl production research is conducted. It deals with the process of generating and separating ²⁰¹Tl radioisotope and target production, It can be generated through a nuclear reaction such as ^natHg(p,xn)²⁰¹Tl, ²⁰¹Hg(p,n)²⁰¹Tl, ^natPb(p,xn)²⁰¹Bi → ²⁰¹Pb → ²⁰¹Tl, ²⁰⁵Tl(p,5n)²⁰¹Pb → ²⁰¹Tl, and considering impure nuclide generated simultaneously with the use of proton beam energy of 35 MeV or less, it is intended to be produced using the ²⁰³Tl(p,3n)²⁰¹Pb→²⁰¹Tl nuclear reaction. In particular, the chemical separation of Tl is a very important element, and the chemical separation methods that can separate it is broadly divided into four types, including solid phase extraction, liquid-liquid, electrochemical, and ion exchange membrane separation. Some chemical separations require additional separation steps, such as methods using selective adsorption. Therefore, this technical report describes four chemical separation methods and seeks to separate high-purity ²⁰¹Tl using a method without additional separation steps