• 한국표면공학회지
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• 제32권3호
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• pp.253-256
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• 1999

Wet plating has been initiated and developed as a major surface finishing technology as of the long customized and highly productive process until now. As the external compression by virtue of the environmental preservation becomes stricter, there has been new move to adapt dry plating line instead of conventional wet plating one in domestic surface finishing industry. Dry plating, so-called, plasma surface technology has been developed in semiconducting industry and becomes a key technology to be useful as an alternative to wet plating in surface finishing industry. The historical progress of domestic surface finishing industry was outlined with the background on the adaptation of three dry plating processes-plasma spraying, plasma nitriding and ion plating. The present status of domestic industrial activity was covered on major alternative to wet plating.

• 한국표면공학회지
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• 제19권3호
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• pp.121-127
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• 1986

There are many plating methods already commercially employed in te surface technology. One of the plating methods is electroless (chemical) plating, which is deposited by auto-catalytic reduction of metallic ion with the reducing agent in the plating bath. And it has many advantages comparing with electrolytic plating in respect of properties of deposit, such as corrosion resistance, wear resistance, uniformity, hardness, adhesion and so on. So, electroless plating is the fatest growing process in metallization of plastic and electronic industry. The properties and numerous applications of electroless deposits are attracting more and more attention from finish specifies. Many metal finishers are considering set-up of new electroless line in their shops. This review will be beneficial to domestic metal finishers to understand the real status of present electroless plating technology. It will also provide some knowledge on the economic aspect of electroless plating for the commercial application of specific parts.

• 한국산업보건학회지
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• 제34권1호
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• pp.98-105
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• 2024

Objectives: The purpose of this study was to identify the exposure level of airborne hexavalent chromium in the plating industry and the exposure level compared to domestic and international occupational exposure limits. Methods: A total 92 samples were collected from ten industrial plating sites. Hexavalent chromium samples were collected using a three-stage cassette equipped with a 37 mm, 5 ㎛ pore size PVC filter. The analysis was performed by ion chromatography. Results: The geometric mean of hexavalent chromium concentration in the plating industry was 0.052 ㎍/m², and it was found that the average exposure level was 0.8 times the South Korean exposure limit. When applying the US ACGIH TLV, however, the average concentration was more than twice as high. Conclusions: The South Korean exposure limit for hexavalent chromium needs to be strengthened due to significant differences in exposure levels according to domestic and international occupational exposure limits. Furthermore, respiratory and dermal sensitization should be labeled.

• 마이크로전자및패키징학회지
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• 제19권3호
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• pp.1-7
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• 2012

Electroplating technology is widely used in semiconductor microelectronic industry. With the development of semiconductor integrated circuit to high density and light-small scale, Extremely high quality and plated uniformity of the deposited metals are needed. Simulation technique can help to obtain better plating results. Although a few plating simulation softwares have been commercialized, plating simulation is not widely prevalent in Korea. In this paper, principle of electroplating and mathematical modeling of plating simulation are discussed. Also introduced are some cases enhancing plating thickness uniformity on leadframe, PCB and wafer by using plating simulation.

• 한국산업보건학회지
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• 제3권2호
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• pp.152-165
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• 1993

This study was performed at eleven small-sized plating factories located in Seoul, Incheon, Ansan, and Taejeon from July 21 to October 6, 1992. The major objectives of this study were to evaluate worker exposure to hexavalent chromium and local exhaust ventilation (L.E.V.) systems at the chromium plating operations. The most suitable L.E.V. systems for chromium plating tanks were designed as examples for recommendation to the industry. The results are summarized as follows. The range of chromium plating operations investigated included decorative, hard, and black chromium plating on several kinds of parts. Most of plating tanks were not equipped with proper control methods against emission of hexavalent chromium mists and workers were not wearing appropriate personal protectives. The ariborne hexavalent chromium concentrations showed an approximate lognormal distribution. The geometric means of both personal and area samples were within the Korean and ACGIH standards, $50{\mu}g/m^3$. However, in comparison with the NIOSH criterion, $1{\mu}g/m^3$, the geometric means of personal samples at two factories and the geometric means of area samples at two factories exceeded it. The geometric means of personal and area samples of high exposure groups (above the NIOSH criterion) were 7 and 27 times higher than those of low exposure groups (below the NIOSH criterion), respectively. The L.E.V. systems of high exposure groups were improperly designed, and the factory with the highest exposure level had no L.E.V. systems at all on chemical etching process. Whereas at factories of low exposure groups, mist control methods such as mist suppressants, tank cover, and/or auxillary L.E.V. systems were added to L.E.V systems. The evaluation of L.E.V. systems showed that there was no chromium plating operation satisfying the ACGIH criteria for capture velocity, slot velocity, and exhaust rate simultaneously. To increase performance of L.E.V. systems, it must be designed to minimize the impact of boundary layer separation. Push-pull ventilation hood and downward plenum ventilation hood were suggested for the Korean industry.

• 한국표면공학회지
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• 제32권3호
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• pp.211-213
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• 1999

In the future, restrictions are likely to be imposed on the use of lead in the electronics industry. In dealing with such a move, we have been developing Pb-free Sn-Ag plating process to replace presently available Sn-Pb process. In this paper, the result of a basic comparison test between Sn-Pb plating and Sn-Ag plating is reported.

• Journal of Ceramic Processing Research
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• 제19권6호
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• pp.455-460
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• 2018

Chromium plating is a common surface treatment technique extensively applied in industry due its excellent properties which include substantial hardness, abrasion resistance, corrosion resistance, surface color, and luster. In this study, the effect of PTFE on corrosion behavior of Cr-P plating, low carbon steel substrates are electroplated in Cr(III) baths without and with PTFE. Trivalent chromium carbon plating was electroplated from trivalent chromium sulfate-based baths with different PTFE dispersion contents. The study focused on the microstructure, PTFE content, roughness, and corrosion resistance of the Cr-P-PTFE composite plating. Scanning electron microscopy and atomic force microscopy images showed a smoother plating and a decrease in the surface roughness of the electrodeposited. The results demonstrate that PTFE eliminates the cracks within plating by reducing internal stress. Therefore, the corrosion resistance of Cr-P-PTFE composite platings were better than that of Cr-P alloy platings.

• 한국표면공학회지
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• 제42권6호
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• pp.301-310
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• 2009

Recently, it has been increasing for the eco-environment plating and surface treatment of eco-environment to decrease hazardous materials. Particular eco-environment can be applied to electronics or automotive parts of industry. In the case of mobile phone, if there were fired, the products bearing dye may be contaminated with the hazardous and wasted. we can obtain the original metal color by electro coloring by metal salt, get rid of hazardous gas, decrease the wasted sludges. Now, the industrial patent number is increasing in Korea, we can accomplish the development of green industry by supporting technical trend of the plating and surface treatment in eco-environment.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2001년도 ICCAS
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• pp.37.1-37
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• 2001

Electric plating is used in various industry field. Specially, pulse plating is able to deposit material at high current density compared to conventional DC plating. For example, pulse plating can get more fine grain, can improve adhesion and metal distribution and current efficiency, can reduce internal stress and crack. Therefore, we developed bidirection pulse power supply(BPPS) which has high speed pulse current and high current density and improve deposition quality and increase plating speed in this paper. BPPS(Bidirection pulse power supply) needs high speed rising time, falling time and output current accuracy. BPPS consists of rectifier part, chopper part, invertor part, and control part. Rectifier part changes outprt current direction.

• 한국표면공학회지
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• 제10권1호
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• pp.1-18
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• 1977

To support the domestic plating industry concerning localized products, survey was conducted in with chemicals and properties of plating solution. Collected samples from 55 factories throughout the country were investigated by spectigated by spectrograph, Hull cell test chemical analysis method to find major chemical components of the plating solution.