Journal of Surface Science and Engineering (한국표면공학회지)

The Korean Institute of Surface Engineering (한국표면공학회)
권호 표지

Pb-FREE SOLDER PLATING

  • Yada, Y. (2nd Development Department, Research Center, Ebara-Udylite Co., Ltd.) ;
  • Tokio, K. (2nd Development Department, Research Center, Ebara-Udylite Co., Ltd.)
  • Published : 1999.06.01
Download PDF
⟨ Previous Next ⟩

Abstract

In the future, restrictions are likely to be imposed on the use of lead in the electronics industry. In dealing with such a move, we have been developing Pb-free Sn-Ag plating process to replace presently available Sn-Pb process. In this paper, the result of a basic comparison test between Sn-Pb plating and Sn-Ag plating is reported.

Keywords