• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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• pp.633-636
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• 2006

GE has developed a plastic substrate technology comprised of a superior high-heat polycarbonate substrate film and a unique transparent coating package that provides the ultrahigh barrier to moisture and oxygen, and chemical resistance to solvents used in device fabrication. This contribution will update recent progresses made at GEFlexible Ultra-high Gas Barrier Substrate for Organic Electronics on ultra-high barrier coated plastic substrate, both in batch mode and in roll-to-roll mode

• Journal of Welding and Joining
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• 제19권1호
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• pp.104-111
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• 2001

This study presents an analysis method for heat flow and deformation of sheet metal laser welding. A heat source model for 2-dimensional heat flow analysis of laser welding process was suggested in this paper. To investigate the availability of the heat source model, the analysis results were compared and estimated with the results of previous researches. We could get a good agreement between the results of numerical analysis and experiments in the temperature distribution of weldment. Due to the characteristics of welding process, some kinds of deformations are usually generated in a welded structure. Generally, the degree of deformation is dependent on the welding sequence constraints as well as input power Therefore, in this paper we evaluate the deformation of gas pressure vessel according to the welding sequence and input power. In the analysis of weld deformation, 2-dimensional thermo-elasto-plastic analysis was performed for the gas pressure vessel by using a commercial FE program package.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.I
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• pp.614-615
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• 2005

The use of plastic substrates enables new applications, such as flexible display devices, and other flexible electronic devices, using low cost, roll-to-roll (R2R) fabrication technologies. One of the limitations of polymeric substrate in these applications is that oxygen and moisture rapidly diffuse through the material and subsequently degrade the electro-optical devices. GE Global Research (GEGR) has developed a plastic substrate technology comprised of a superior high-heat polycarbonate ($LEXAN^{(R)}$) substrate film and a unique transparent coating package that provides the ultrahigh barrier (UHB) to moisture and oxygen,chemical resistance to solvents used in device fabrications, and a high performance transparent conductor. This article describes the coating solutions for polycarbonate ($LEXAN^{(R)}$) films and its compatibility with OLED device fabrication processes.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권1호
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• pp.445-446
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• 2007

The use of plastic substrates enables new applications, such as flexible display devices, and other flexible electronic devices, using low cost, rollto-roll (R2R) fabrication technologies. One of the limitations of polymeric substrate in these applications is that oxygen and moisture rapidly diffuse through the material and subsequently degrade the electro-optical devices. GE Global Research (GEGR) has developed a plastic substrate technology comprised of a superior high-heat polycarbonate (LEXAN(R)) substrate film and a unique transparent coating package that provides the ultrahigh barrier (UHB) to moisture and oxygen, chemical resistance to solvents used in device fabrications, and a high performance transparent conductor. This article describes the coating solutions for polycarbonate (LEXAN(R)) films and its compatibility with OLED device fabrication processes.

• Structural Engineering and Mechanics
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• 제55권5호
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• pp.913-929
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• 2015

The ratcheting and strain cyclic behaviour of joined conical-cylindrical shells under uniaxial strain controlled, uniaxial and multiaxial stress controlled cyclic loading are investigated in the paper. The elasto-plastic deformation of the structure is simulated using Chaboche non-linear kinematic hardening model in finite element package ANSYS 13.0. The stress-strain response near the joint of conical and cylindrical shell portions is discussed in detail. The effects of strain amplitude, mean stress, stress amplitude and temperature on ratcheting are investigated. Under strain symmetric cycling, the stress amplitude increases with the increase in imposed strain amplitude. Under imposed uniaxial/multiaxial stress cycling, ratcheting strain increases with the increasing mean/amplitude values of stress and temperature. The abrupt change in geometry at the joint results in local plastic deformation inducing large strain variations in the vicinity of the joint. The forcing frequency corresponding to peak axial ratcheting strain amplitude is significantly smaller than the frequency of first linear elastic axial vibration mode. The strains predicted from quasi static analysis are significantly smaller as compared to the peak strains from dynamic analysis.

• 한국기계가공학회지
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• 제7권1호
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• pp.47-52
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• 2008

We present a 3-D profiler specially devised for the profile measurement of rough surfaces that are difficult to be measured with conventional non-contact interferometer. The profiler comprises multiple two-point-diffraction sources made of single-mode optical fibers. Test measurement proves that the proposed profiler is well suited for the warpage inspection of microelectronics components with rough surface, such as unpolished backsides of silicon wafers and plastic molds of integrated-circuit chip package.

• Journal of Welding and Joining
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• 제17권1호
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• pp.124-132
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• 1999

Thermal fatigue strength of the solder joints is the most critical issue for TSOP(Thin Small Outline Package) because the leads of this package are extremely short and thermal deformation cannot be absorbed by the deflection of the lead. And the TSOP body can be subject to early fatigue failures in thermal cycle environments. This paper was discussed distribution of thermal stresses at near the joint between silicon chip and die pad and investigated their reliability of solder joints of TSOP with 42 alloy clad lead frame on printed circuit board through FEM and 3 different thermal cycling tests. It has been found that the stress concentration around the encapsulated edge structure for internal crack between the silicon chip and Cu alloy die pad. And using 42 alloy clad, The reliability of TSOP body was improved. In case of using 42 alloy clad die pad(t=0.03mm). $$\sigma$_{VMmax}$ is 69Mpa. It is showed that 15% improvement of the strength in the TSOP body in comparison with using Cu alloy die pad $($\sigma$_{VMmax}$=81MPa). In solder joint of TSOP, the maximum equivalent plastic strain and Von Mises stress concentrate on the heel of solder fillet and crack was initiated in it's region and propagated through the interface between lead and solder. Finally, the modified Manson-Coffin equation and relationship of the ratio of $N_{f}$ to nest(η) and cumulative fracture probability(f) with respect to the deviations of the 50% fracture probability life $(N_{f 50%})$ were achieved.

• Journal of Welding and Joining
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• 제21권7호
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• pp.71-77
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• 2003

In this study, an investigation based on the superposition principle to predict residual stress redistribution caused by crack propagation itself initially through residual tensile stress field was performed by finite element method. The tendency in residual stress redistribution caused by crack propagation recognized both from the analytical results and experimental result was the residual stress concentration consecutively occurred in the vicinity of crack tip even the situation that the crack propagated to the region initially residual compressive stress existed. The software for the analysis is ABAQUS, which is a general purpose finite element package. The analytical method that attempt to take the plastic deformation at the crack tip due to tensile residual stress into the consideration of residual stress redistribution caused by crack propagation was proposed. The plastic zone size at the tip of fatigue crack and redistributed residual stresses were calculated by finite element method on the bases of the concept of Dugdale model. Comparing these analytical results with experimental results, it is verified that the residual stress redistribution caused by crack propagation can be predicted by finite element method with the proposed analytical method.

• 마이크로전자및패키징학회지
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• 제17권3호
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• pp.17-26
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• 2010

반도체 패키지에 사용되고 있는 유연 솔더는 환경 보호 필요성 대문에 무연 솔더로 빠르게 대체되고 있다. 이와 같은 무연 솔더에 대한 여구는 주로 재료의 발견과 공정 적응성의 관점에서 이루어졌을 뿐, 기계적인 성질이나 신뢰성의 관점에서의 연구는 많이 이루어지지 않았다. 본 논문에서는 무아레 간섭계를 이용하여 유연 솔더와 무연 솔더 실장 WB-PBGA 패키지 결합체의 온도변화에 대한 열-기게적 거동을 해석하였다. 실시간 무아레 간섭계를 이용하여 각 온도 단계에서 변위 분포를 나타내는 간섭무늬를 얻고, 그로부터 유연과 무연의 솔더 조인트를 갖는 WB-PBGA 패키지의 굽힘 변형 거동 및 솔더 볼의 변형률을 비교 분석하였다. 분석결과를 보면 유연 솔더 실장 패키지 결합체의 솔더 볼은 칩경계 부근인 #3 솔더 볼에서 발생하는 전단변형률이 파손에 큰 영향을 미치며, 무연 솔더가 실장된 패키지 결합체의 솔더 볼은 가장 바깥 부근인 #7 솔더 볼에서 발행하는 수직 변형률이 파손에 큰 영향을 미칠 것으로 예측된다, 또한 무연 솔더 실장 패키지 결합체는 같은 온도 조건에서 유연 솔더 실장된 패키지에 비해 굽힘 변형이 휠씬 크게 발생될 뿐 아니라 솔더 볼의 유효변형률도 10% 정도 크게 발생하는 것으로 나타나서 열변형에 의한 파손에 취약할 것으로 예측된다.

• 농업과학연구
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• 제38권2호
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• pp.205-212
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• 2011

The potential factors for quality loss of cleaned fresh ginseng and technology to be associated with the improvement of marketability through pre-packaging fumigation were examined. Major microorganisms isolated from fresh ginseng included Botrytis cinerea, and Erwinia sp. Others such as Cylindrocarpon sp., Fusarium spp., Pennicilium spp., Bacillus spp. were also found at relatively low frequency. The bacterial density of vacuum packaged fresh ginseng rapidly increased during simulated marketing. Little correlation between bacterial growth and package swelling was found. In order to improve packaging method of fresh ginseng, pre-packaging treatment of 2-phenylethyl alcohol (PE, 100 uL/L, 4 hr) was examined. The fumigation treatment effectively inhibited the growth of bacteria density and also effective on keeping firmness of ginseng root, especially in cortical portion. The internal gas compositions of plastic container packaged for ginseng were approximately ranged between 6 to 8% $O_2$and 3 to 4% $CO_2$. The $O_2$ level of fumigation treatment was lower than control whereas $CO_2$ level was higher. The upsurge of ethylene evolution I day after simulated marketing was found only in fumigation treatment but it returned to ordinary level at day 2. The sucrose content of 2-PE treatment was significantly reduced at 5 days after simulated marketing but reducing sugars like glucose and fructose remained at higher level. The difference in sugar levels was reduced after 10 days of simulated marketing. The decay of fresh ginseng began at the lateral or fine root, which is weak to physical damage, in general. The epidermis was more damaged. Plastic container packaging with PE fumigation could be an alternative to vacuum packaging, which allows an aerobic environment and prevents anaerobic respiration. Further study of pre-package fumigation is required to improve technology of fresh ginseng marketing.