• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.05b
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• pp.171-174
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• 2000

We have investigated the CMP slurry properties of silicate oxide thin films surface on CMP cleaning process. The metallic contaminations by CMP slurry were evaluated in four different oxide films, such as plasma enhanced tetra-ethyl-ortho-silicate glass(PE-TEOS), $O_3$ boro-phospho silicate giass( $O_3$-BPSG), PE-BPSG, and phospho-silicate glass(PSG). All films were polished with KOH-based slurry prior to entering the post-CMP cleaner. The Total X-Ray Fluorescence(TXRF) measurements showed that all oxide surfaces are heavily contaminated by potassium and calcium during polishing, which is due to a CMP slurry. The polished $O_3$-BPSG films presented higher potassium and calcium contaminations compared to PE-TEOS because of a mobile ions gettering ability of phosphorus. For PSG oxides, the slurry induced mobile ion contamination increased with an increase of phosphorus contents.

• Journal of the Korean Vacuum Society
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• v.13 no.4
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• pp.175-181
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• 2004

We investigated the stability of the DLC film coated on 304 stainless steel substrate by Radio frequency assisted chemical vapor deposition method. Fracture and spallation behaviour of the coating was observed during micro-tensile test of the fil $m_strate composite. As the tensile deformation progressed, the cracks of the film were observed in the perpendicular direction to the tensile axis. Further deformation resulted in the plastic deformation with $45^{\circ}$ slip bands on the substrate surface. Spallation of the film occurred with the plastic deformation, which was initiated at the cracks of the film and was aligned along the slip directions. We found that both the cracking and the spallation behaviors are strongly dependent on the pre-treatment condition, such as Ar plasma pre-treatment. The spallation of the film was considerably suppressed in an optimized condition of the substrate cleaning by Ar glow discharge. We observed the improved stability with increasing duration of Ar plasma pre-treatment.nt.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.11 no.2
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• pp.409-413
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• 2010

We fabricated 10 nm-thick cobalt silicide($CoSi_2$) as a buffer layer on a p-type Si(100) substrate to investigate the possibility of GaN epitaxial growth on $CoSi_2/Si(100)$ substrates. We deposited 500 nm-GaN on the cobalt silicide buffer layer at low temperature with a PA-MBE (plasma assisted-molecular beam epitaxy) after the $CoSi_2/Si$ substrates were cleaned by HF solution. An optical microscopy, AFM, TEM, and HR-XRD (high resolution X-ray diffractometer) were employed to determine the GaN epitaxy. For the GaN samples without HF cleaning, they showed no GaN epitaxial growth. For the GaN samples with HF cleaning, they showed $4\;{\mu}m$-thick GaN epitaxial growth due to surface etching of the silicide layers. Through XRD $\omega$-scan of GaN <0002> direction, we confirmed the cyrstallinity of GaN epitaxy is $2.7^{\circ}$ which is comparable with that of sapphire substrate. Our result implied that $CoSi_2/Si(100)$ substrate would be a good buffer and substrate for GaN epitaxial growth.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 1999.05a
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• pp.2-2
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• 1999

금속재료의 표면 특성을 높이기 위해서 여러 표면처리 방법들이 사용되어져 오고 있다. 그 중 용사법에 의한 코팅방법이 최근의 현저한 기술적인 진보와 새로운 용사재료의 개발 등에 의해 여러 분야에 널리 응흉되고 있다. 일반적으로 이 용사법에 의한 코팅층은 다리, 선박 등의 대형 구조물에 대한 내식성 향상뿐만 아니라 자동차 및 항공기 부품, 핵 반응기 등의 코팅부에 널리 이용되고 였다. 특히 해수분위기에서 주로 사용되는 설비의 내식성을 향상시킬 목적으로 사용되 는 알루마늄 및 아연 합금의 용사 코팅층은 대부분의 경우 건조한 분위기보다는 수분이 많은 수용액 환경 하에서 사용되므로, 사용 환경 중에서 용사피막의 내식성을 조사하는 연구가 요구되고 있다. 사용되는 환경하에서의 침지시험에 의한 방법도 중요하지만, 가속화된 전기화학측정에 의한 방법 또한 이용된다. 열용사법에 의한 코팅층의 전기화학적 특성을 알아보기 위해서 3.5 % NaCI 수용액 내에서 AI 5 5083 모재와 Al-2%Zn 합금의 용사 코팅층 각각에 대한, 그리고 AI 5083 모재 위 AI-2%Zn 용사층이 코팅된 경우에 대한 분극거동과 침지시간에 따른 부식전위 및 분극저항성의 특성변화, 표면의 임피던스특성 변화 등을 측정하였다. 이 결과 모재에 대한 코팅층의 희생양극성올 판단할 수 있고, 모재/코팅 사스템의 분극거동은 혼성전위이론(mixed-potential theory)에 의해 결정되었다. 용사 코팅층이 박리되어 모재가 일부 드러난 경우를 모사한 시험편올 제작하고, 시험편 표면의 각 위치에 따라 부식전위 분포를 측정하였다. 그리고 측정 데이터를 기초로 표면의 상태변화를 모사하여 용사코팅에 의한 표면에서의 방식전위분포를 시율레이션하였다. 이와 같은 표면에서의 방식전위분포 해석을 통하여, 코팅층의 희생양극성에 의한 모재의 방식범위를 판단할 수 있다.의 비저 항을 갖는 철 박막에서도 99.9% 순도의 철을 타켓으로 하여 증착된 막은 일반 저탄소 강을 타켓으로 하여 증착된 막보다 훨씬 낮은 부식속도를 보였다.TEX>$He/O_2/Ar/N_2$의 gas를 사용 한 atmospheric pressure plasma cleaning 과 $Ar/O_2$의 gas를 사용한 ICP cleaning에서 이 차전자방출계수(SEEC)가 약 1.5~2.5배 증가된 것을 알 수 있었다. 저지능 등을 평가하여 각 실험결과를 비교분석하여 보았다. 수록 민감하여 304 의 IGSCC 와 매우 유사한 거동을 보인다. 본 강연에서는 304 와 600 의 고온 물에서 일어나는 IGSCC 민감도에 미치는 환경, 예민화처리, 합금원소의 영향을 고찰하고 이에 대한 최근의 연구 동향과 방식 방법을 다룬다.다.의 목적과 지식)보다 미학적 경험에 주는 영향이 큰 것으로 나타났으며, 모든 사람들에게 비슷한 미학적 경험을 발생시키는 것 이 밝혀졌다. 다시 말하면 모든 사람들은 그들의 문화적인 국적과 사회적 인 직업의 차이, 목적의 차이, 또한 환경의 의미의 차이에 상관없이 아름다 운 경관(High-beauty landscape)을 주거지나 나들이 장소로서 선호했으며, 아름답다고 평가했다. 반면에, 사람들이 갖고 있는 문화의 차이, 직업의 차 이, 목적의 차이, 그리고 환경의 의미의 차이에 따라 경관의 미학적 평가가 달라진 것으로 나타났다.corner$적 의도에 의한 경관구성의 일면을 확인할수 있지만 엄밀히 생각하여 보면 이러한 예의 경우도 최락의 총체적인 외형은 마찬가지로 $\ulcorner$순응$\lrcorner$의 범위를 벗어나지 않는다. 그렇기 때문에도 $\ulcorner$순응$\lrcorne

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.259-259
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• 2008

The LTCC (Low Temperature Co-fired Ceramic) technology meets the requirements for high quality microelectronic devices and microsystems application due to a very good electrical and mechanical properties, high reliability and stability as well as possibility of making integrated three dimensional microstructures. The wet process, which has been applied to the etching of the metallic thin film on the ceramic substrate, has multi process steps such as lithography and development and uses very toxic chemicals arising the environmental problems. The other side, Plasma technology like ion beam sputtering is clean process including surface cleaning and treatment, sputtering and etching of semiconductor devices, and environmental cleanup. In this study, metallic multilayer pattern was fabricated by the ion beam etching of Ti/Pd/Cu without the lithography. In the experiment, Alumina and LTCC were used as the substrate and Ti/Pd/Cu metallic multilayer was deposited by the DC-magnetron sputtering system. After the formation of Cu/Ni/Au multilayer pattern made by the photolithography and electroplating process, the Ti/Pd/Cu multilayer was dry-etched by using the low energy-high current ion-beam etching process. Because the electroplated Au layer was the masking barrier of the etching of Ti/Pd/Cu multilayer, the additional lithography was not necessary for the etching process. Xenon ion beam which having the high sputtering yield was irradiated and was used with various ion energy and current. The metallic pattern after the etching was optically examined and analyzed. The rate and phenomenon of the etching on each metallic layer were investigated with the diverse process condition such as ion-beam acceleration energy, current density, and etching time.

• Korean Chemical Engineering Research
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• v.43 no.1
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• pp.27-32
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• 2005

We propose an effective and environmentally friendly dry stripping method using a supercritical carbon dioxide ($SCCO_2$) system modified by a single and multiple cosolvents to remove ion-implanted photoresist and residue from a wafer surface at three different temperatures (97, 148, $200^{\circ}C$) and pressures (200, 300, 400 bar). After high dose of ion implantation the photoresist was not easily removed by using pure $SCCO_2$, but swollen. The $SCCO_2$ system modified by single cosolvents and multiple cosolvents mixed with aprotic solvents could not effectively remove the heavy organics, but swell them. However, the $SCCO_2$ system modified with multiple cosolvent (5%, v/v) composed of DMSO and DIW showed high removal efficiency for ion-implanted photoresists at $97^{\circ}C$ and 200 bar for 30 min (about 80%). In this study it has been shown that the dry stripping method using $SCCO_2$ system modified with multiple cosolvents could replace either plasma ashing or acid and solvent wet bench method and dramatically reduce accompanied chemical usage and disposal.

• Proceedings of the Korean Vacuum Society Conference
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• 1998.02a
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• pp.71-72
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• 1998

반도체 집적 공정의 발달로 차세대 소자용으로 30 A 이하의 극 박막 Si02 절연막이 요구되고 있으며, 현재 제품으로 50-70 A 두께의 절연막을 사용한 것이 발표되고 있다. 절연막의 두께가 앓아질수록 많은 문제가 발생할 수 있는데 그 예로 절연막의 breakdo때둥에 의한 신뢰성 특성의 악화, 절연막올 통한 direct tunneling leakage current, boron풍의 dopant 침투로 인한 소자 특성 ( (Threshold Voltage)의 불안, 전기적 stress하에서의 leakage current증가와 c charge-trap 및 피terface s쩌.te의 생성으로 인한 소자 특성의 변화 둥으로 요약 된다. 절연막의 특성올 개선하기 위해 여러 가지 새로운 공정들이 제안되었다. 그 예로, Nitrogen올 Si/Si02 계면에 doping하여 절연막의 특성을 개선하는 방법 으로 고온 열처 리 를 NH3, N20, NO 분위 기 에서 실시 하거 나, polysilicon 또는 s silicon 기판에 nitrogen올 이온 주입하여 열처리 하는 방법, 그리고 Plasma분 위기에서 Nitrogen 함유 Gas를 이용하여 nitrogen을 doping시키는 방법 둥이 연구되고 있다. 또한 Oxide cleaning 후 상온에서 성장되는 oxide를 최소화 하여 절연막의 특성올 개선하기 위하여 LOAD-LOCK을 이용하는 방법, C뼈피ng 공정의 개선올 통한 contamination 감소와 silicon surface roughness 감소 로 oxide 신뢰성올 개선하는 방법 둥이 있다. 구조적 인 측면 에 서 는 Polysilicon 의 g없n size 를 최 적 화하여 OxideIPolysilicon 의 계면 특성올 개선하는 연구와 Isolation및 Gate ETCH공정이 절연막의 특성에 미 치 는 영 향도 많이 연구되 고 있다 .. Plasma damage 가 Oxide 에 미 치 는 효과 를 제어하는 방법과 Deuterium열처리 퉁올 이용하여 Hot electron Stress하에서 의 MOS 소자의 Si/Si02 계면의 신뢰성을 개선하고 있다. 또한 극 박막 전연막의 신뢰성 특성올 통계적 분석올 통하여 사용 가능한 수명 올 예 측 하는 방법 과 Direct Tunneling Leakage current 를 고려 한 허 용 가농 한 동작 전 압 예측 및 Stress Induced Leakage Current 둥에 관해서 도 최 근 활발 한 연구가 진행되고 있다.

• Journal of Korean Society of Environmental Engineers
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• v.38 no.6
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• pp.291-298
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• 2016

Electrochemical water treatment process as a useful treatment method for the removal of non-degradable matter has been consistently studied for several decades. Key process of electrochemical water treatment are oxidation reaction from an anode and reduction from a cathode. In this study, the effect of pre-treatment methods in the insoluble electrode manufacturing process for the water treatment has been evaluated for the life time of electrode The results of this study showed that pre-treatment methods of a base metal such as surface roughness, clean method and interlayer formation influenced to life time of electrode when the same condition (catalyst electrode layer coating method and material system) was applied for pre-treatment methods. This study was conducted by using $IrO_2/Ti$ electrode In the test of sand-blasting process, an electrode manufactured by using sanding media of different sizes resulted in the most effective electrode life time when the size of alumina was used for $212{\sim}180{\mu}m$ praticle size (#80). The most effective method was considered using arc plasma in the additional roughness control and cleaning process, sputtering method to form Ta type interlayer formation process.

• Applied Chemistry for Engineering
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• v.25 no.1
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• pp.41-46
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• 2014

The property improvement of polycarbonate coated with a multilayer film composed of an inorganic $SiO_2$ film and a photocatalytic $TiO_2$ film was studied. The $SiO_2$ film as a binder had an excellent light transmission characteristic. After the treatment with atmospheric pressure plasma, the surface of $SiO_2$ film showed the hydrophilicity, which increased the film coating uniformity with a $TiO_2$-containing aqueous solution. When $TiO_2$ film was over 200 nm thick, the absorption effect of UV rays in the range of 180~400 nm suppressed the yellowing phenomena of polycarbonate substrate. The inorganic film improved the heat resistance of polycarbonate substrates. $TiO_2$ film in the outmost under the exposure of UV rays promotes the catalytic oxidation characteristics and yields the capability to the decomposition of organic contaminants, and also increases the self-cleaning properties due to the increase of hydrophilicity. Structural stability of the polycarbonate substrate coated with inorganic $TiO_2$ and $SiO_2$ film was shown. The role of $SiO_2$ film between $TiO_2$ and polycarbonate substrate suppressed the peeling of $TiO_2$ film by inhibiting the photocatalytic oxidation effect of $TiO_2$ film on the polycarbonate substrate.

• Resources Recycling
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• v.30 no.5
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• pp.38-48
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• 2021

In this study, we determine the optimal process conditions for selectively recovering Si from a solar cell surface by removal of impurities (Al, Zn, Ag, etc.). To selectively recover Si from solar cells, leaching is performed using HCl solution and an ultrasonic cleaner. After leaching, the solar cells are washed using distilled water and dried in an oven. Decompression filtration is performed on the HCl solution, and ICP-OES (Inductively Coupled Plasma Optical Emission spectroscopy) full scan analysis is performed on the filtered solution. Furthermore, XRD (X-ray powder diffraction), XRF (X-ray fluorescence), and ICP-OES are performed on the dried solar cells after crushing, and the purity and recovery rate of Si are obtained. In this experiment, the concentration of acid solution, reaction temperature, reaction time, and ultrasonic intensity are considered as variables. The results show that the optimal process conditions for the selective recovery of Si from the solar cells are as follows: the concentration of acid solution = 3 M HCl, reaction temperature = 60℃, reaction time = 120 min, and ultrasonic intensity = 150 W. Further, the Si purity and recovery rate are 99.85 and 99.24%, respectively.