Stripping of Ion-Implanted Photoresist Using Cosolvent-Modified Supercritical Carbon Dioxide
![]() |
Jung, In-Il
(Department of Chemical and Biochemical Engineering, The University of Suwon)
Kim, Ju-Won (Department of Chemical and Biochemical Engineering, The University of Suwon) Lee, Sang-Yun (Department of Chemical Engineering, Yonsei University) Kim, Woo-Sik (Department of Chemical Engineering, Yonsei University) Ryu, Jong-Hoon (Department of Chemical and Biochemical Engineering, The University of Suwon) Lim, Gio-Bin (Department of Chemical and Biochemical Engineering, The University of Suwon) |
1 | International Technology Roadmap for Semiconductors, Semiconductor Industry Association, San Jose, CA(2001) |
2 | Flamm, D. L., Solid State Technology, 35, 37-41(1992) |
3 | Gillespie, P., Berry, I. and Sakthivel, P., 'Semiconductor Operations, Fusion Systems Division, Rockville, MD., Wafer Temperature Control-a Critical Parameter for Dry Photoresist and Residue Removal,' Semiconductor International(1999) |
4 | Lee, W. M., 'Aproven Sub-micron Photoresist Stripper Solution for Post Metal and via Hole Processes,' EKC Technology, Inc. (1996) |
5 | Cotte, J. M., McCullough, K. J., Moreau, W. M., Pope, K. R., Simons, J. P. and Taft, C. J., 'Process of Removing Ion-implanted Photoresist from a Workpiece,' U.S. Patent No. 6,683,008 B1 (2004) |
6 |
Weibel, G. L. and Ober, C. K., 'An Overview of Supercritical |
7 | Mullee, W. H., 'Removal of Photoresist and Residue from Substrte using Supercritical Carbon Dioxide Process,' Kor. Patent No. 2003-0024873(2003) |
8 | Louis, D., Lajoinie, E., Pires, F., Lee, W. M. and Holmes, D., 'Post Etch Cleaning of Low-k Dielectric Materials for Advanced Inter Connects', Charcterization and Process Optimization, 41-42, 415-418(1998) |
9 | Nagal, N., Imai, T., Terada, K., Seki, H., Okumura, H., Fujino, H., Yamamoto, T., Nishuyama, I. and Hatta, A., Surf. Interface Anal., 34, 545-551(2002) DOI ScienceOn |
![]() |