• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.1
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• pp.43-47
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• 2001

Plasma polymerized hexamethyldisiloxane thin film was fabricated by employing an inter-electrode capacitively coupled type apparatus under the following conditions : carrier gas flow rate of 11 sccm, reaction pressure of 0.1 torr, discharge frequency of 13.56 MHz and discharge power of 30∼90 W. Polymerization rate of thin film fabricated at the discharge power of 90W is 32.5nm/min. Relative dielectric constant and dielectric loss tangent of thin film shows 3.2∼3.8 and 2.6x10$\^$-3/∼4.51x10$\^$-3/ respectively in the frequency range of 1 kHz∼1 MHz. As the annealing temperature is increased, the relative dielectric constant gradually decreases while the dielectric loss tangent increases. The current density increase gradually with increasing annealing temperature and electric field. The electric conduction of the heaxamethyldisiloxane thin film shows Schottky effect.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.328-328
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• 2011

Wetting phenomena have been heavily studied for industrial and academic researches especially tuning the wettability between hydrophilicity and hydrophobicity. Wicking through the surface texture is shown on superhydrophilic surface while rolling (or dewetting) on the patterns of superhydrophobic surface. These wetting phenomena are known to be affected by surface wettability determined with physical surface patterns as well as chemical composition of surface layer. In this research, we introduce a method to control the wettability of a thin C-SiOx film from hydrophobic to hydrophilic using a mixture gas of HMDSO/$O_2$ by plasma polymerization with rf-CVD (radio frequency-Chemical Vapor Deposition). Wettability was finely controlled by changing the ratio of HMDSO/$O_2$. Hydrophilicity increased as the ratio decreased, while hydrophobicity was enhanced by the ratio. Moreover, fine control from superhydrophilicity to superhydrophobicity was achieved by C-SiOx coating on the Si wafer with prepatterns of submicron-sized pillar array formed by $CF_4$ plasma etching.

• Proceedings of the KIEE Conference
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• 1994.07b
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• pp.1400-1402
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• 1994

Plasma polymerized thin films was prepared using an interelectrod inductively coupled gas-flow-type reactor. Styrene was chosen as the monomer to be used. This thin films were also delineated by the electron-beam apparatus with an acceleration voltage 30kV, and the pattern in the resist was developed with RIE 80 with argon gas mixture ratio, pressure and RF power. The molecular structure of thin films was investigated by GPC and FT-IR and then was discussed in relation to its quality as a resist. In the case of plasma polymerization, thickness of resist could be controlled by discharge duration and power. Also etch rate is increased as to growing pressure with RIE 80.

• Elastomers and Composites
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• v.34 no.4
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• pp.299-314
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• 1999

Bonding metal and textile components to rubber has always posed a problem. In this paper, an attempt had been made to modify textile and metal surfaces for bonding with rubber. The metal surfaces were modified using silane coupling agents and textile fibers were modified using plasma polymerization techniques. Some results on adhesion of metals to a range of sulfur-cured rubber compounds using a combination of organofunctional silanes are given here. The treatment was not only effective for high-sulfur compounds but also for low-sulfur com pounds as used in engine mounts and even for some semi-EV compounds. Coatings of plasmapolymerized pyrrole or acetylene were deposited on aramid and polyester tire cords. Standard pull-out force adhesion measurements were used to determine adhesion of tire cords to rubber compounds. The plasma coatings were characterized by various techniques and the performance results are explained in an interpenetrating network model.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1994.05a
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• pp.138-140
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• 1994

Plasma polymerized thin film was prepared using an interelectrod inductively coupled gas-flow-type reactor. Styrene was chosen as the monomer to be used. This thin films were also delineated by the electron-beam apparatus with an acceleration voltage 30kV, and the pattern in the resist was developed with RIE 80 with argon gas mixture ratio, pressure and RF power. The effect of charge of discharge power on growth rate and etching rate of the thin films were studied. The molecular structure of thin films were investigated by FIR and then was discussed in relation to its quality as a resist. In the case of Plasma polymerization, thickness of resist could be controlled by discharge duration and power. Also etch rate is increased as to growing argon gas and RF power with RIE 80.

• Polymer(Korea)
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• v.32 no.1
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• pp.38-42
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• 2008

Ultrathin films were coated on low density Polyethylene (LDPE) food packaging films by plasma polymerization of methane, acetylene, hexamethyldisiloxane (HMDSO), and HMDSO+oxygen to improve the barrier property of the LDPE films. The film coated in HMDSO +oxygen (flow rate: 0.6+ 9.0 SCCM) plasma at 40 W for 10 min showed the highest improvement in the barrier property against oxygen, reducing the permeability of oxygen as much as 18.6 times. The film coated in acetylene (flow rate 0.75 SCCM) plasma at 10 W for 10 min showed the highest improvement in the barrier property against carbon dioxide and moisture, reducing the permeability of carbon dioxide and moisture as much as 12.0 and 3.0 times, respectively. In addition, cherry tomato, cucumber, and mushroom (Flammulina velutipes) wrapped with the coated films were kept fresh $1.5{\sim}3.0$ times longer than those wrapped with an LDPE film.

• Restorative Dentistry and Endodontics
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• v.28 no.2
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• pp.156-161
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• 2003

The purpose of this study is to evaluate the polymerization ability of three different light sources by microhardness test. Stainless steel molds of 1, 2, 3, 4 and 5 mm in thickness of 7 mm in diameter were prepared. The hybrid composite Z100 was packed into the hole of the mold and curing light was activated for designated time. Three different light sources, conventional halogen, light emitting diode, and plasma arc, were used for curing of composite. Two different curing times applied ; one is to follow the manufacturers recommendation and the other is to extend the curing time of LED and plasma arc for balancing the light energy with halogen. Immediately after curing, the Vickers hardness was measured at the bottom of specimen. The results were as follows. 1 The composite cured with LED showed equal to higher microhardnesss than halogen. 2. The composite was cured with plasma arc by manufacturers recommendation showed lowest micro-hardness at all thickness. However, when curing time was extended, microhardness was higher than the others. In conclusion, this study suggested that plasma arc needs properly extended curing time.

• Restorative Dentistry and Endodontics
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• v.27 no.5
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• pp.488-492
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• 2002

The purpose of this study was to evaluate the effectiveness of plasma arc curing (PAC) unit for composite and compomer curing. To compare its effectiveness with conventional quartz tungsten halogen (QTH) light curing unit, the polymerization shrinkage rates and amounts of three composites (Z100, Z250, Synergy Duo Shade) and one compomer, that had been light cured by PAC unit or QTH unit, was compared using a custome made linometer. The measurement of polymerization shrinkage was peformed after polymerization with either QTH unit or PAC unit. In case of curing with the PAC unit, the composite was light cured with Apollo 95E for 6s, the power density of which was recorded as 1350 mW/$\textrm{cm}^2$ by Coltolux Light Meter. For light curing with QTH unit, the composite was light cured for 30s with the XL2500, the power density of which was recorded as 800 mW/$\textrm{cm}^2$ by Coltolux Light Meter. The amount of linear polymerization shrinkage was recorded in the computer every 0.5s for 60s. Ten measurements were made for each material. The amount of linear polymerization shrinkage for each material in 10s and 60s which were cured with PAC or QTH unit were compared with t test. The amount of polymerization shrinkage in the tested materials were compared with 1way ANOVA with Duncan's multiple range test. As for the amounts of polymerization shrinkage in 60s, there was no difference between PAC unit and QTH unit in Z250 and Synergy Duo Shade. In Z100 and Dyract AP, it was lower when it was cured with PAC unit than when it was cured with QTH unit (p<0.05). As for the amounts of polymerization shrinkage in 10s, there was no difference between PAC unit and QTH unit in Z100 and Dyract AP. The amounts of polymerization shrinkage was significantly higher when it was cured with PAC unit in Z250 and Synergy Duo Shade (p<0.05). The amounts of polymerization shrinkage in the tested materials when they were cured with QTH unit were Z250 (6.6um) < Z100 (9.3um), Dyract AP (9.7um) < Synergy Duo Shade (11.2um) (p<0.05). The amount of polymerization shrinkage when the materials were cured with PAC unit were Dyract AP (5.6um) < Z100 (8.1um), Z250(7.0um) < Synergy Duo Shade (11.2um) (p<0.05).

• Proceedings of the Korean Fiber Society Conference
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• 1990.06a
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• pp.21-22
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• 1990

• Proceedings of the Korean Fiber Society Conference
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• 1991.06b
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• pp.29-30
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• 1991