• Title/Summary/Keyword: plasma electronics

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The Aging-time change by the plasma-treatment of MgO film in AC-Plasma Display Panels

  • Seo, Gi-Weon;Kim, Jong-Bin;Park, Seung-Tea;Seo, Young-Woo;Kim, Sung-Gyu;Lee, Sang-Han;Lee, Chang-Joon;Kim, Dae-Young;Park, Min-Soo;Kim, Je-Seok;Ryu, Byung-Gil
    • 한국정보디스플레이학회:학술대회논문집
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    • 2005.07a
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    • pp.721-723
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    • 2005
  • We applied the Atmospheric Pressure Plasma (AP-plasma) to the MgO film to try to control the Aging-time on the PDP production-line. The MgO film surface and the discharge characteristics of AC-PDPs were investigated, using the plasma-treated MgO film. The Aging-time change can be achieved by treating the MgO film with plasma. This method can be adapted to the mass production-line.

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Lossless Single-Switch Inverter for Plasma Burner Drive Application (Plasma Burner 구동을 위한 무손실 단일 스위치 인버터)

  • Kang, Kyung-Soo;Kim, Sang-Yeon;Kim, Se-Min;Lee, Jeong-sun;Roh, Chung-Wook
    • Proceedings of the KIPE Conference
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    • 2015.07a
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    • pp.201-202
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    • 2015
  • 기존 Plasma Burner용 인버터 구동회로의 경우, Full Bridge Inverter를 사용하기 때문에 소자수가 많고 스위칭 손실이 큰 문제점이 있다. 본 논문은 Plasma Burner 구동을 위한 무손실 단일 스위치 인버터를 제안한다. 기존 Full Bridge Inverter를 사용하는 Plasma Burner 구동회로의 경우에는 4개의 스위치를 사용하기 때문에 스위치 손실이 매우 크고, Heat-sink 크기가 커지는 단점이 있다. 반면 제안된 Plasma Burner 구동을 위한 무손실 단일 스위치 인버터는 1개의 스위치를 사용하고, 스너버의 전력 손실이 최소화되기 때문에 전력 손실이 매우 작고 Heat-sink 최소화 및 고효율화가 가능한 장점을 갖는다. 본 논문에서는 제안된 Plasma Burner 구동을 위한 무손실 단일 스위치 인버터의 이론적인 특성을 분석하고 모의실험을 통해 확인하였으며, 15W급 Plasma Bunrer에 적용하여 실험을 통해 우수성을 검증하였다.

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Oxygen Plasma Characterization Analysis for Plasma Etch Process

  • Park, Jin-Su;Hong, Sang-Jeen
    • Journal of the Speleological Society of Korea
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    • no.78
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    • pp.29-31
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    • 2007
  • This paper is devoted to a study of the characterization of the plasma state. For the purpose of monitoring plasma condition, we experiment on reactive ion etching (RIE) process. Without actual etch process, generated oxygen plasma, measurement of plasma emission intensity. Changing plasma process parameters, oxygen flow, RF power and chamber pressure have controlled. Using the optical emission spectroscopy (OES), we conform to the unique oxygen wavelength (777nm), the most powerful intensity region of the designated range. Increase of RF power and chamber pressure, emission intensity is increased. oxygen flow is not affect to emission intensity.

Plasma Charge Damage on Wafer Edge Transistor in Dry Etch Process (Dry Etch 공정에 의한 Wafer Edge Plasma Damage 개선 연구)

  • Han, Won-Man;Kim, Jae-Pil;Ru, Tae-Kwan;Kim, Chung-Howan;Bae, Kyong-Sung;Roh, Yong-Han
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.06a
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    • pp.109-110
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    • 2007
  • Plasma etching process에서 magnetic field 영향에 관한 연구이다. High level dry etch process를 위해서는 high density plasma(HDP)가 요구된다. HDP를 위해서 MERIE(Magnetical enhancement reactive ion etcher) type의 설비가 사용되며 process chamber side에 4개의 magnetic coil을 사용한다. 이런 magnetic factor가 특히 wafer edge부문에 plasma charging에 의한 damage를 유발시키고 이로 인해 device Vth(Threshold voltage)가 shift 되면서 제품의 program 동작 문제의 원인이 되는 것을 발견하였다. 이번 연구에서 magnetic field와 관련된 plasma charge damage를 확인하고 damage free한 공정조건을 확보하게 되었다.

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Atmospheric Plasma Treatment on Copper for Organic Cleaning in Copper Electroplating Process: Towards Microelectronic Packaging Industry

  • Hong, Sei-Hwan;Choi, Woo-Young;Park, Jae-Hyun;Hong, Sang-Jeen
    • Transactions on Electrical and Electronic Materials
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    • v.10 no.3
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    • pp.71-74
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    • 2009
  • Electroplated Cu is a cost efficient metallization method in microelectronic packaging applications. Typically in 3-D chip staking technology, utilizing through silicon via (TSV), electroplated Cu metallization is inevitable for the throughput as well as reducing the cost of ownership (COO).To achieve a comparable film quality to sputtering or CVD, a pre-cleaning process as well as plating process is crucial. In this research, atmospheric plasma is employed to reduce the usage of chemicals, such as trichloroethylene (TCE) and sodium hydroxide (NaHO), by substituting the chemical assisted organic cleaning process with plasma surface treatment for Cu electroplating. By employing atmospheric plasma treatment, marginally acceptable electroplating and cleaning results are achieved without the use of hazardous chemicals. The experimental results show that the substitution of the chemical process with plasma treatment is plausible from an environmentally friendly aspect. In addition, plasma treatment on immersion Sn/Cu was also performed to find out the solderability of plasma treated Sn/Cu for practical industrial applications.

The Characteristics of Microwaves in the Plasma Medium (프라스마내의 마이크로파 특성)

  • 양인용;강형목
    • Journal of the Korean Institute of Telematics and Electronics
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    • v.2 no.2
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    • pp.2-8
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    • 1965
  • This paper shows the characteristics of microwaves in a plasma medium bounded by a waveguide. A standing wave detector which has VSWR less than 1.05 is designed and constructed. The electromagnetic waves which propagate through the plasma is reflected partly by the interaction between the external magnetic fields and plasma. The plasma is consisted of the electrons and positive ions ionized by high temperature of tungsten filament inserted in the waveguide. The transmitted power through the plasma was reduced by the amount of 1.5db from the reference.

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Step Response of RF Plasma in Carbon Tetrafluoride($CF_4$)

  • So, Soon-Youl;Akinori Oda;Hirotake Sugawara;Yosuke Sakai
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2000.07a
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    • pp.930-933
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    • 2000
  • To understand the behavior of electron, ions and radicals on radio-frequency non-equilibrium plasma, it is necessary to know the basic information about its fundamental properties and reactions. Especially, the transient response of radio-frequency plasma has an important means of controlling selective etch rates and investigating the stability of a plasma chemical process. In this paper, we present the results of periodic steady-state behavior and transient behavior carbon Tetrafluoride(CF$_4$) discharge at 0.2 Torr in a 2 cm gap parallel-plate. After the number densities of charged particles became steady-state, the applied voltage was increased or decreased in an instant and the transient behavior of charged particles and radicals was investigated from one steady-state to the next steady state.

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Impact of Plasma Induced Degradation on Low Temperature Poly-Si CMOS TFTs during Etching Process

  • Chang, Jiun-Jye;Chen, Chih-Chiang;Chuang, Ching-Sang;Yeh, Yung-Hui
    • 한국정보디스플레이학회:학술대회논문집
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    • 2002.08a
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    • pp.519-522
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    • 2002
  • In this paper, we analyze the impact of plasma etching process induced device degradation on low temperature poly-Si TFTs. The results indicate the relationship between device degradation and PPID effect during plasma fabrication. The dual-gate structure, which is used to suppress leakage current, is also discussed in this research.

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Analysis of the radiation characteristics from a slot antenna in a plane conductor covered with a moving isotropic plasma layer (운동중인 등방성 플라즈마 층으로 덮인 평면도체 슬랏 안테나의 복사특성 해석)

  • 김남태
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.33A no.11
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    • pp.44-51
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    • 1996
  • The radiation characteristics of a slot antenna in a plane conductor covered with a miving isotropic plasma layer are analyzed. The radiation null which causes distortion in radiation pattern is explainted by the zero of integrand in an asymptotic integral for radiation fields as a function of the plasma parameter and the plasma velocity. Numerical resutls for a radiation null calculated from various plasma and velocity parameters correspond to the results of two-dimensional problem.

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Interactions of non-thermal bioplasma with cancer, and immune cells

  • Kaushik, Nagendra Kumar;Kaushik, Neha;Choi, Eun Ha
    • Proceedings of the Korean Vacuum Society Conference
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    • 2015.08a
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    • pp.66.2-66.2
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    • 2015
  • There is the urgent need of new human health care's technology against cancers or tumors based on plasma electronics, medicine and biology. Main target of our study is to enhance efficacy and selectivity of plasma on cancer cells with metabolic modifiers and by inducing immune-modulations. We have evaluated the combination effect of plasma with metabolic modifiers (2-DG) on various solid and liquid cancers. Our findings suggest that 2-DG enhances the efficacy and selectivity of plasma and induces apoptosis in blood cancer cells through glucose deprivation. Finally, we conclude that 2-DG with non-thermal plasma may be used as a combination treatment against cancer cells. Our work also comprises plasma induced activation of immune cells; which find applications for curing various kinds of resistant tumors and other dreadful diseases. Plasma significantly activates immune cells which increases cell death in solid tumors in co-culture conditions.

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