• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.15 no.8
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• pp.667-673
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• 2003

Recent trends in the electronic equipment indicate that the power consumption and heat generation in a chip increase as the components are miniaturized and the computing speed becomes faster. Suitable heat dissipation is required to ensure the guaranteed performance and reliable operation of the electronic devices. The aim of the present study is to investigate the forced-convective thermal-hydraulic characteristics of a pin-fin heat exchanger as a candidate for cooling system of the electronic devices. The influence of the structure of the pin-fin assembly on heat transfer is investigated by porous medium model. The results are compared with the experimental data or correlations of several researchers for the heat transfer coefficients for the channel flow with pin-fin arrays. Finally, the effects of design parameters such as the pin-fin diameter and the spacing are examined.

• Clean Technology
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• v.14 no.4
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• pp.265-270
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• 2008

In this study, the flow and heat transfer of the aligned pin-fin array of the air cooling module for electronic packaging application were numerically analyzed with various fin shapes. The geometric cross-sectional shapes of pin-fins considered in this study were ellipse, wing and circle. The fins had same cross-sectional area and height, but they had different surface areas. As the results, the surface area, the heat transfer coefficient, and the heat transfer performance of pin-fins greatly depended on their shapes. Of the three types of pin-fins, the wing type pin-fin with suitable shape produced the best heat transfer performance. This result implies that the cooling capacity of the pin-fin cooler can be significantly enhanced only by the change of fin shape without increasing air flow-rate or fin density.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.29 no.7 s.238
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• pp.828-836
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• 2005

Impingement/effusion cooling technique is used for combustor liner or turbine parts cooling in gas turbine engine. In the impingement/effusion cooling system, the crossflow generated in the cooling channel induces an adverse effect on the cooling performance, which consequently affects the durability of the cooling system. In the present study, to reduce the adverse effect of the crossflow and improve the cooling performance, circular pin fins are installed in impingement/effusion cooling system and the heat transfer characteristics are investigated. The pin fins are installed between two perforated plates and the crossflow passes between these two plates. A blowing ratio is changed from 0.5 to 1.5 for the fixed jet Reynolds number of 10,000 and five circular pin fin arrangements are considered in this study. The local heat/mass transfer coefficients on the effusion plate are measured using a naphthalene sublimation method. The results show that local distributions of heat/mass transfer coefficient are changed due to the installation of pin fins. Due to the generation of vortex and wake by the pin fin, locally low heat/mass transfer regions are reduced. Moreover, the pin fin prevents the wall jet from being swept away, resulting in the increase of heat/mass transfer. When the pin fin is installed in front of the impinging let, the blockage effect on the crossflow enhances the heat/mass transfer. However, the pin fin installed just behind the impinging jet blocks up the wall jet, decreasing the heat/mass transfer. As the blowing ratio increases, the pin fins lead to the higher Sh value compared to the case without pin fins, inducing $16\%{\~}22\%$ enhancement of overall Sh value at high blowing ratio of M=1.5.

• Advances in Computational Design
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• v.6 no.1
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• pp.31-42
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• 2021

This research aims to demonstrate the optimal geometrical design of splayed multiple cross-sectional pin fin heat sinks (SMCSPFHS), which are a type of side-inlet-side-outlet heat sink (SISOHS). The optimiser strength Pareto evolutionary algorithm2 (SPEA2)is employed to explore a set of Pareto optimalsolutions. Objective functions are the fan pumping power and junction temperature. Function evaluations can be accomplished using computational fluid dynamics(CFD) analysis. Design variablesinclude pin cross-sectional areas, the number of fins, fin pitch, thickness of heatsink base, inlet air speed, fin heights, and fin orientations with respect to the base. Design constraints are defined in such a way as to make a heat sink usable and easy to manufacture. The optimum results obtained from SPEA2 are compared with the straight pin fin design results obtained from hybrid population-based incremental learning and differential evolution (PBIL-DE), SPEA2, and an unrestricted population size evolutionary multiobjective optimisation algorithm (UPSEMOA). The results indicate that the splayed pin-fin design using SPEA2 issuperiorto those reported in the literature.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.9 no.3
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• pp.259-267
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• 1997

Average heat transfer coefficients and friction coefficients have been measured from staggered short pin-fin arrays to investigate the effect of fin shapes. Flow entering into the test section is a fully developed duct flow and the Reynolds number ranges from 5,000 to 25,000 based on fin diameter and average approaching velocity. The fin has three different shapes; uniform-diameter circular fin, two stepped-diameter circular fins. Average heat transfer rates change slightly with the fin shapes. However, friction loss(pressure loss) for the stepped-diameter fins is significantly less than that for the uniform-diameter fin. This results indicate that the stepped-diameter fin arrays in duct flow enhance heat transfer rates largely based on unit pumping power.

• 유체기계공업학회:학술대회논문집
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• 2005.12a
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• pp.185-190
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• 2005

This work presents a numerical procedure to optimize the elliptic-shaped pin fin arrays to enhance turbulent heat transfer. The response surface method is used as an optimization technique with Reynolds-averaged Navier Stokes analysis of flow and heat transfer. Shear stress transport (SST) turbulence model is used as a turbulence closure. Computational results for average heat transfer rate show a reasonable agreement with the experimental data. Four variables including major axis length, minor axis length, pitch and the pin fin length nondimensionalized by duct height are chosen as design variables. The objective function is defined as a linear combination of heat transfer and friction-loss related terms with weighting factor. D-optimal design is used to reduce the data points, and, with only 28 points, reliable response surface is obtained. Optimum shapes of the pin-fin arrays have been obtained in the range from 0.0 to 0.1 of weighting factor.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.16 no.7
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• pp.623-629
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• 2004

Rapid development of electronic technology requires small size, high density packaging and high power of electronic devices, which result in more heat generation by the electronic system. Present cooling technology may not be adequate for the thermal management in the current state-of-the-art electronic equipment. Forced convective heat transfer in a channel filled with pin-fin array is studied experimentally in this paper as an alternative cool-ing scheme for a high heat-dissipating equipment. Various configurations of the pin-fin array are selected in order to find out the effect of spacing and diameter of the pin-fin on the heat transfer and pressure drop characteristics. In the low porosity region, interfacial heat transfer and pressure drop seem to show different trend compared to the conventional heat transfer process.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.32 no.11
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• pp.817-823
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• 2008

A pin fin with variable fin base thickness is optimized based on the ratio of heat loss to the maximum heat loss using a two-dimensional analytic method. The temperature profile along the normalized radius position in the fin is presented. For fixed fin outer radius, the optimum heat loss, fin length and efficiency as a function of fin base thickness, outer radius, convection characteristic numbers ratio and ambient convection characteristic number are presented. One of the results shows that the effect of fin outer radius and ambient convection characteristic number on the optimum fin length is remarkable.

• Journal of computational fluids engineering
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• v.13 no.2
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• pp.20-26
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• 2008

A numerical study is carried out to analyze the steady three-dimensional turbulent flow and convective heat transfer in a staggered pin-fin array with diamond shaped elements at various geometrical configurations. Steady Reynolds-averaged Navier-Stokes equations and energy equation are solved using a finite volume based solver. Shear stress transport (SST) model is used as turbulence closure. The computational domain is composed of one pitch of pin-fin displacement with periodic boundary conditions on the surfaces normal to the streamwise direction and the cross-streamwise direction. The numerical results for Nusselt number and friction factor are validated with experimental results. The effects of pin angle, pin height and pitch on Nusselt number, friction factor and efficiency index are investigated.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.41 no.6
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• pp.381-387
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• 2017

Dehydrogenation from the hydrolysis of a sodium borohydride ($NaBH_4$) solution has been of interest owing to its high theoretical hydrogen storage capacity (10.8 wt.％) and potentially safe operation. An experimental study has been performed on the catalytic reaction rate and pressure drop of a $NaBH_4$ solution over both a single microchannel with a hydraulic diameter of $300{\mu}m$ and a staggered array of micro pin fins in the microchannel with hydraulic diameter of $50{\mu}m$. The catalytic reaction rates and pressure drops were obtained under Reynolds numbers from 1 to 60 and solution concentrations from 5 to 20 wt.％. Moreover, reacting flows were visualized using a high-speed camera with a macro zoom lens. As a result, both the amount of hydrogenation and pressure drop are 2.45 times and 1.5 times larger in a pin fin microchannel array than in a single microchannel, respectively.