• Journal of Industrial Technology
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• v.36
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• pp.17-22
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• 2016

A circular pin fin (CPF) and a half circular pin fin (HCPF) are by using the one-dimensional analytic method. For these two fins, 90% of the maximum heat loss, Corresponding fin length for 90% of the maximum heat loss, fin effectiveness and fin efficiency are compared as functions of convection characteristic number and fin radius. Also, the ratio of heat loss from the HCPF to that from CPF listed with variation of fin length when the fin volumes are the same. One of the results shows that the efficiency of a CPF is larger than that of a HCPF while the effectiveness of a CPF is smaller than that of a HCPF when convection characteristic number, fin length and fin radius are the same.

• Journal of Institute of Convergence Technology
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• v.5 no.1
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• pp.27-31
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• 2015

A Pin-fin array is widely used to enhance the heat transfer in the internal cooling passage. The heat transfer distribution around the pin-fin is varied by the horseshoe vortex and flow separation. The difference of heat transfer coefficient induces the large thermal stress, which is one of the major reasons to break of hot components. So, it is required to enhance the heat transfer on the back side of pin-fin to solve the thermal stress problem. This study suggests the pin-fin with inclined jet hole and complex pin-fin/dimple array to enhance the heat transfer on the back side of pin-fin. The heat transfer coefficient is predicted by the numerical analysis, which is performed by CFX 14.0. The numerical results are obtained at Reynolds number, 10,000. The results show that the heat transfer on the back side of pin-fin is increased in both cases. Beside, the wake, which comes from dimple and jet, helps to develop the horseshoe vortex and increase the heat transfer on the next row pin-fin.

• Journal of Industrial Technology
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• v.31 no.A
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• pp.21-25
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• 2011

A comparison of temperature distributions along the fin length coordinate between two different fin tip boundary conditions for a circular pin fin is made by using the one-dimensional analytic method. One tip boundary condition is the actual fin tip boundary condition and fin tip temperature is arbitrarily given for another fin tip boundary condition. The value of the fin base temperature is depend on the fin base thickness and fin radius. One of the results shows that the temperature distribution along the fin length coordinate for the actual fin tip boundary condition and that for the arbitrarily given fin tip temperature are the same if the arbitrarily given fin tip temperature and the fin tip temperature for the actual fin tip boundary condition are the same.

• Journal of Industrial Technology
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• v.29 no.B
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• pp.3-7
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• 2009

A cylindrical pin fin with inside fluid is optimized based on fixed fin volume by using the one dimensional analytic method. Heat loss from the fin and the pin fin radius for fixed fin volume is presented as a function of the fin length. Temperature variation of the fin with the variation of ambient and inside fluid convection characteristic numbers and fin base thickness is listed. The maximum heat loss at the practical fin length and corresponding optimum fin length and radius are presented as a function of fin base thickness, inside convection characteristic number, fin volume and ambient convection characteristic number. One of the results shows that the optimum pin fin shape becomes relatively fatter as the fin volume increases.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.19 no.5
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• pp.418-425
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• 2007

The power consumption and heat generation in a chip increase as the components are miniaturized and the computing speed becomes faster. Therefore, suitable heat dissipation has become one of the primary limiting factors to ensure the guaranteed performance and reliable operation of the electronic devices. A pin-fin array which may be considered as a porous medium could be used as an alterative cooling system of the electronic equipment. The aim of the present study is to investigate the forced-convective heat transfer characteristics of pin-fin heat exchangers. Convective heat transfer through the pin~fin array is analyzed experimentally based on porous medium approach. The influence of the structure of the pin-fin array including the pin-fin spacing, the pin diameter and plate length on heat transfer characteristic is investigated and compared with the Previous analytical results and existing correlation equations. Nowadays, electronic and mechanical devices become smaller and smaller. In this sense, the main purpose of this study is to decide the optimum pin-fin arrangement to get similar heat transfer performance when the length of the existing cooling system is reduced as a half.

• Journal of Industrial Technology
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• v.27 no.B
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• pp.71-75
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• 2007

A cylindrical pin fin with variable diameter is analyzed by using the one dimensional analytical method. Heat loss and fin efficiency are presented as a function of the fin diameter, length and convection characteristic numbers ratio. The relationship between the fin diameter and convection characteristic number over the fin for the same amount of heat loss is shown. One of the results indicates the fin efficiency increases as the fin diameter increases while that decreases as the fin length increases.

• 한국신재생에너지학회:학술대회논문집
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• 2008.05a
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• pp.642-645
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• 2008

A pin fin with variable fin base thickness is analysed by using the one dimensional analytic method. Heat loss and fin thermal resistance are presented as a function of the fin base thickness, pin fin outer radius and convection characteristic numbers ratio. The relationship between the fin outer radius and fin base thickness for the same amount of heat loss is shown. One of the results indicates the fin thermal resistance decreases as the fin outer radius and/or convection characteristic numbers ratio increase whereas the fin thermal resistance is independent on the variation of fin base thickness.

• Journal of Industrial Technology
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• v.28 no.B
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• pp.3-7
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• 2008

A cylindrical pin fin with variable fin base thickness is optimized based on fixed outer radius by using the one dimensional analytic method. Heat loss from the pin fin with fixed outer radius is presented as a function of the fin length. The ratio of in length for optimum heat loss to that for the maximum heat loss is listed. The maximum heat loss and effectiveness and the fin length for the optimum heat loss are presented as a function of fin base thickness and outer radius. One of the results presents the maximum effectiveness decreases rapidly first and then decreases slowly as the fin outer radius increases.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.2408-2413
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• 2007

Since the heat generation in a chip increases as the components are miniaturized and the computing speed becomes faster, suitable heat dissipation has become one of the primary limiting factors to ensure the reliable operation of the electronic devices. A pin-fin array could be used as an alterative cooling system of the electronic equipment. In this study, convective heat transfer through the pin-fin array is analyzed experimentally based on porous medium approach. The influence of the structure of the pin-fin array including the pin-fin spacing, the pin diameter and plate length on heat transfer characteristics is investigated and compared with the previous analytical results and existing correlation equations. Nowadays, electronic and mechanical devices become smaller and smaller. In this sense, the main purpose of this study is to decide the optimum pin-fin arrangement to get similar heat transfer performance when the length of the existing cooling system is reduced as a half.

• Proceedings of the KSME Conference
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• 2003.11a
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• pp.31-36
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• 2003

Recently, the power consumption and heat generation in an electronic equipment increase as the components are miniaturized and the computing speed becomes faster. Effective cooling method is required to ensure the guaranteed performance and reliable operation of the electronic devices. The aim of the present study is to investigate the cooling characteristics of a pin-fin heat exchanger as a candidate for cooling system of the electronic devices. Various configuration of the pin-fin array is selected in order to find out the effect of spacing and diameter of the pin-fin on the heat transfer characteristics. The results are compared with the experimental data or correlations of several researchers for the channel flow with pin-fin arrays.