• Journal of the Institute of Electronics Engineers of Korea TC
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• v.47 no.1
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• pp.77-83
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• 2010

Radiation characteristics of $5{\times}4$ pin array patch antennas are compared to those of $5{\times}2$ pin array patch antennas for several substrate thicknesses using the computer simulation. Since the number of unit cells of a $5{\times}2$ pin array patch antenna is half of that of a $5{\times}4$ pin array patch antenna, the number of pins used in a $5{\times}2$ pin array patch antenna is half of that in a $5{\times}4$ pin array patch antenna and the patch width of a $5{\times}2$ pin array patch antenna is very small compared to that of a $5{\times}4$ pin array patch antenna. However, the radiation characteristics of a $5{\times}2$ pin array patch antenna are almost similar to those of a $5{\times}4$ pin array patch antenna.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2012.11a
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• pp.71-71
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• 2012

Memory 반도체 Test공정에서 사용되는 Probe Card의 Probing Area가 넓어지면서 종래에 사용되던 Cantilever제품의 사용이 불가능하게 되고, MEMS공정을 사용한 새로운 형태의 Advanced제품이 시장에 출현을 하였다. MEMS형의 제품은 다수의 Micro Spring을 MLC(Multi Layer Ceramic)위에 MEMS 공정을 사용하여 생성하는 방식으로서 MLC는 좁은 지역에 다수의 Pin을 생성 할 수 있는 공간을 만들어 주며, 또 다른 이유는 전기적 특성인 임피던스를 맞추고 다수의 Pin의 압력에 의하여 생기는 하중을 Ceramic기판으로 지탱하기 위한 목적도 있다. 이에 MLC와 같은 전기적 특성을 임피던스를 맞춘 RF-CPCB를 사용하여 작은 면적에 다수의 Pin접합이 가능한 방법을 마련한 후, 이 RF-PCB를 부착하여 Pin의 하중을 받는 Wafer와 유사한 열팽창을 갖는 Substrate를 사용하여 MLC를 대체하여 다양한 온도 조건에서 사용이 가능하며, 복잡하고 공정비가 많이 드는 MEMS 공정에 의한 일괄 Micro Spring 생성 공정을 전주 도금 또는 2D방식의 도금 Pin으로 대체하였으며, Probe Card의 중요한 물리적 특성인 Pin들의 정렬도를 마련하기 위해 Photo Process를 사용한 Wafer로 만든 Wafer Pin Array Frame을 사용하여 2D 제작 Pin을 일괄 또는 부분 접합이 가능한 방법으로 Probe Array Head를 제작하여 이들을 부착하여 Probe Array Head를 이전의 MEMS공정 방법에 비해 쉽고 빠르게 만들어 probe Card를 제작 할 수 있게 되었다.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.46 no.12
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• pp.44-51
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• 2009

The radiation characteristics of a pin array patch antenna phased array are compared to those of a conventional patch antenna phased array. The performance of a pin array patch antenna phased array is much improved than that of a conventional patch antenna phased array because the mutual coupling between the adjacent pin array patch antennas is very small compared to that between the adjacent conventional patch antennas. The radiation characteristics of a pin array patch antenna phased array show the superior performance such as low variation of the gain of the main beam and the side lobe level for the variation of the direction of the main beam.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.19 no.5
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• pp.418-425
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• 2007

The power consumption and heat generation in a chip increase as the components are miniaturized and the computing speed becomes faster. Therefore, suitable heat dissipation has become one of the primary limiting factors to ensure the guaranteed performance and reliable operation of the electronic devices. A pin-fin array which may be considered as a porous medium could be used as an alterative cooling system of the electronic equipment. The aim of the present study is to investigate the forced-convective heat transfer characteristics of pin-fin heat exchangers. Convective heat transfer through the pin~fin array is analyzed experimentally based on porous medium approach. The influence of the structure of the pin-fin array including the pin-fin spacing, the pin diameter and plate length on heat transfer characteristic is investigated and compared with the Previous analytical results and existing correlation equations. Nowadays, electronic and mechanical devices become smaller and smaller. In this sense, the main purpose of this study is to decide the optimum pin-fin arrangement to get similar heat transfer performance when the length of the existing cooling system is reduced as a half.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.2408-2413
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• 2007

Since the heat generation in a chip increases as the components are miniaturized and the computing speed becomes faster, suitable heat dissipation has become one of the primary limiting factors to ensure the reliable operation of the electronic devices. A pin-fin array could be used as an alterative cooling system of the electronic equipment. In this study, convective heat transfer through the pin-fin array is analyzed experimentally based on porous medium approach. The influence of the structure of the pin-fin array including the pin-fin spacing, the pin diameter and plate length on heat transfer characteristics is investigated and compared with the previous analytical results and existing correlation equations. Nowadays, electronic and mechanical devices become smaller and smaller. In this sense, the main purpose of this study is to decide the optimum pin-fin arrangement to get similar heat transfer performance when the length of the existing cooling system is reduced as a half.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.45 no.10
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• pp.80-89
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• 2008

Patch antennas with an array of pins interconnecting the patch and the ground (Pin array patch antennas) are fabricated and their characteristics are measured. The radiation characteristics of pin array patch antennas are compared to those of conventional patch antennas. The suppressions of the radiation in horizontal directions in E-plane and H-plane are more than 10 dB and 4 dB, respectively. The forward radiation is increased, while the backward radiation is decreased. The directivity is improved because the half-power beamwidth of radiation patterns in both E-plane and H-plane is reduced. The resonance frequency of a pin array patch antenna increases as the pin radius of a pin amy patch antenna increases. An optimum pin radius of a pin array patch antenna exists for the maximum suppression of the radiation in horizontal directions.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.1
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• pp.9-17
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• 2010

In this study, von Mises stress and total strain energy density characteristics of lead pin in PGA (Pin Grid Array) packages have been calculated by using the FEM (Finite Element Method). FEM computation is carried out with various heat treatment conditions of lead pin material under $20^{\circ}$ bending and 50 mm tension condition. Results show that von Mises stress locally concentrated on lead pin corners and interface between lead pin head and solder. von Mises stress and total strain energy density decrease as heat treatment temperature of lead pin increases. Also, round shaped corner of lead pin decreases both von Mises stress and total strain energy density on interface between lead pin head and solder. This means that PGA package reliability can be improved by changing the mechanical property of lead pin through heat treatment. This has been known that solder fatigue life decreases as total strain energy density of solder increases. Therefore, it is recommended that both optimized lead pin shape and optimized material property with high lead pin heat treatment temperature determine better PGA package reliability.

• Journal of the Korean Society of Propulsion Engineers
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• v.24 no.5
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• pp.43-55
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• 2020

The effect of cutted pin in front of pin-fin array was analyzed for increasing the cooling performance of gas turbine blade. The numerical simulations were conducted to figure out the flow and thermal characteristics. The base case which is staggered pin-fin array, cut pin case 1 which has X₂/D_p=1.25 cut pin and cut pin case 2 which has X₃/D_p=1.75 cut pin were compared. The results showed that cut pin increases the strength of the horseshoe vortex which occurred at the leading edge of pin-fin array. Furthermore, the wake effect is reduced at the trailing edge of pin-fin array. As a result, the heat transfer distribution on the endwall increases. However, the friction factor increases owing to the installation of cut pin, but the thermal performance factor is increased maximum 23.8% in cut pin case 2. Therefore, installation of cut pin will be helpful for increasing the cooling performance of pin-fin array of gas turbine blade.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.16 no.7
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• pp.623-629
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• 2004

Rapid development of electronic technology requires small size, high density packaging and high power of electronic devices, which result in more heat generation by the electronic system. Present cooling technology may not be adequate for the thermal management in the current state-of-the-art electronic equipment. Forced convective heat transfer in a channel filled with pin-fin array is studied experimentally in this paper as an alternative cool-ing scheme for a high heat-dissipating equipment. Various configurations of the pin-fin array are selected in order to find out the effect of spacing and diameter of the pin-fin on the heat transfer and pressure drop characteristics. In the low porosity region, interfacial heat transfer and pressure drop seem to show different trend compared to the conventional heat transfer process.

• Journal of Institute of Convergence Technology
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• v.5 no.1
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• pp.27-31
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• 2015

A Pin-fin array is widely used to enhance the heat transfer in the internal cooling passage. The heat transfer distribution around the pin-fin is varied by the horseshoe vortex and flow separation. The difference of heat transfer coefficient induces the large thermal stress, which is one of the major reasons to break of hot components. So, it is required to enhance the heat transfer on the back side of pin-fin to solve the thermal stress problem. This study suggests the pin-fin with inclined jet hole and complex pin-fin/dimple array to enhance the heat transfer on the back side of pin-fin. The heat transfer coefficient is predicted by the numerical analysis, which is performed by CFX 14.0. The numerical results are obtained at Reynolds number, 10,000. The results show that the heat transfer on the back side of pin-fin is increased in both cases. Beside, the wake, which comes from dimple and jet, helps to develop the horseshoe vortex and increase the heat transfer on the next row pin-fin.