• 제목/요약/키워드: physical vapor deposition method

검색결과 129건 처리시간 0.026초

열선 CVD법에 의한 다결정 실리콘 박막증착 및 특성분석 (Poly-Si Thin Films by Hot-wire Chemical Vapor Deposition Method)

  • 정연식;이정철;김석기;윤경훈;송진수;박이준;권성원;임굉수
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.2
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    • pp.1030-1033
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    • 2003
  • This paper presents the deposition characterization of polycrystalline silicon films by the HWCVD(Hot-wire Chemical Vapor Deposition) method at low substrate($300^{\circ}C$). The filament temperature, pressure and $SiH_4$ concentration were determined to be a critical parameter for the deposition of poly-Si films. Series A was deposited under the conditions of $1380^{\circ}C$(Tf), 100 mTorr and $2{\sim}10%\{SiH_4/(SiH_4+H_2)\}$ for 60 min. Series B was deposited under the conditions of $1400{\sim}1450^{\circ}C$ (Tf), 30 mTorr and $2{\sim}12%$ for 60 min. The physical characteristics were measured by Raman and FTIR spectroscopy, dark and photoconductivity measurements under AM1.5 illumination.

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전자빔을 이용한 물리기상증착법으로 제조된 열차폐용 4 mol% YSZ 코팅의 내열특성 (Thermal Durability of 4YSZ Thermal Barrier Coating Deposited by Electron Beam PVD)

  • 박찬영;양영환;김성원;이성민;김형태;임대순;장병국;오윤석
    • 한국분말재료학회지
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    • 제20권6호
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    • pp.460-466
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    • 2013
  • 4 mol% Yttria-stabilized zirconia (4YSZ) coatings with $200{\mu}m$ thick are fabricated by Electron Beam Physical Vapor Deposition (EB-PVD) for thermal barrier coating (TBC). $150{\mu}m$ of NiCrAlY based bond coat is prepared by conventional APS (Air Plasma Spray) method on the NiCrCoAl alloy substrate before deposition of top coating. 4 mol% YSZ top coating shows typical tetragonal phase and columnar structure due to vapor phase deposition process. The adhesion strength of coating is measured about 40 MPa. There is no delamination or cracking of coatings after thermal cyclic fatigue and shock test at $850^{\circ}C$.

Fabrication of resistive switching memory by using MoS2 layers grown by chemical vapor deposition

  • Park, Sung Jae;Qiu, Dongri;Kim, Eun Kyu
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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    • pp.298.1-298.1
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    • 2016
  • Two-dimensional materials have been received significant interest after the discovery of graphene due to their fascinating electronic and optical properties for the application of novel devices. However, graphene lack of certain bandgap which is essential requirement to achieve high performance field-effect transistors. Analogous to graphene materials, molybdenum disulfide ($MoS_2$) as one of transition-metal dichalcogenides family presents considerable bandgap and exhibits promising physical, chemical, optical and mechanical properties. Here we studied nonvolatile memory based on $MoS_2$ which is grown by chemical vapor deposition (CVD) method. $MoS_2$ growth was taken on $1.5{\times}1.5cm^2$ $SiO_2$/Si-substrate. The samples were analyzed by Raman spectroscopy, atomic force microscopy and X-ray photoelectron spectroscopy. Current-voltage (I-V) characteristic was carried out HP4156A. The CVD-$MoS_2$ was analyzed as few layers and 2H-$MoS_2$ structure. From I-V measurement for two metal contacts on CVD-$MoS_2$ sample, we found typical resistive switching memory effect. The device structures and the origin of nonvolatile memory effect will be discussed.

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Fundamental Study of CNTs Fabrication for Charge Storable Electrode using RF-PECVD System

  • Jung, Ki-Young;Kwon, Hyuk-Moon;Ahn, Jin-Woo;Lee, Dong-Hoon;Park, Won-Zoo;Sung, Youl-Moon
    • 조명전기설비학회논문지
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    • 제23권7호
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    • pp.8-13
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    • 2009
  • Plasma enhanced chemical vapor deposition (PECVD) is commonly used for Carbon nanotubes (CNTs) fabrication, and the process can easily be applied to industrial production lines. In this works, we developed novel magnetized radio frequency PECVD system for one line process of CNTs fabrication for charge storable electrode application. The system incorporates aspects of physical and chemical vapor deposition using capacitive coupled RF plasma and magnetic confinement coils. Using this magnetized RF-PECVD system, we firstly deposited Fe layer (about 200[nm]) on Si substrate by sputter method at the temperature of 300[$^{\circ}$] and hence prepared CNTs on the Fe catalyst layer and investigated fundamental properties by scanning electron microscopy (SEM) and Raman spectroscopy (RS). High-density, aligned CNTs can be grown on Fe/Si substrates at the temperature of 600[$^{\circ}$] or less.

전계인가법을 이용한 $\beta$-PVDF 증착 박막의 제조와 유전특성에 관한 연구 (A Study on the Preparation and Dielectric Characteristic of $\beta$-PVDF Vapor Deposited Thin Films by Applied Electric Field Method)

  • 박수홍;이덕출
    • 한국전기전자재료학회논문지
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    • 제11권3호
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    • pp.221-228
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    • 1998
  • In this study, the $\beta$-Polyvinylidene fluoride(PVDF) thin films were fabricated by physical vapor deposition method. Also, the properties of dielectric relaxation were studied to understand carrier's behavior of PVDF thin films, to be regarded as the excellent piezo and pyroelectricity. In the process of vapor deposition, the $\beta$-PVDF thin films have been fabricated under the condition of the substrate temperature at 3$0^{\circ}C$, the applied electric field at 142.8kV/cm and the pressure at 2.0${\times}10^{-5}$torr. The dielectric properties of PVDF have been studied in the frequency range 10Hz to 1MHz at temperature from 30 to $100^{\circ}C$. The relative dielectric constant of $\alpha$ and $\beta$-PVDF were 6.8 and 9.8, respectively, under a frequency of 1kHz. Such a phenomenon was caused by the decrease in intermolecular forces originated by the phase-transition from the TGTG' molecular conformation to the TT planar zig-zag conformation. And the relative dielectric constant is increased as a measuring temperature increases, because of the reduction of relaxation time caused by the decrease of intermolecular force.

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Atomic layer deposition of In-Sb-Te Thin Films for PRAM Application

  • Lee, Eui-Bok;Ju, Byeong-Kwon;Kim, Yong-Tae
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2011년도 제40회 동계학술대회 초록집
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    • pp.132-132
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    • 2011
  • For the programming volume of PRAM, Ge2Sb2Te5(GST) thin films have been dominantly used and prepared by physical vapor deposition (PVD), chemical vapor deposition (CVD), atomic layer deposition (ALD). Among these methods, ALD is particularly considered as the most promising technique for the integration of PRAM because the ALD offers a superior conformality to PVD and CVD methods and a digital thickness control precisely to the atomic level since the film is deposited one atomic layer at a time. Meanwhile, although the IST has been already known as an optical data storage material, recently, it is known that the IST benefits multistate switching behavior, meaning that the IST-PRAM can be used for mutli-level coding, which is quite different and unique performance compared with the GST-PRAM. Therefore, it is necessary to investigate a possibility of the IST materials for the application of PRAM. So far there are many attempts to deposit the IST with MOCVD and PVD. However, it has not been reported that the IST can be deposited with the ALD method since the ALD reaction mechanism of metal organic precursors and the deposition parameters related with the ALD window are rarely known. Therefore, the main aim of this work is to demonstrate the ALD process for IST films with various precursors and the conformal filling of a nano size programming volume structure with the ALD?IST film for the integration. InSbTe (IST) thin films were deposited by ALD method with different precursors and deposition parameters and demonstrated conformal filling of the nano size programmable volume of cell structure for the integration of phase change random access memory (PRAM). The deposition rate and incubation time are 1.98 A/cycle and 25 cycle, respectively. The complete filling of nano size volume will be useful to fabricate the bottom contact type PRAM.

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양축 정렬된 Ni기판 위에 MOCVD법에 의한 YBCO 초전도 선재용 Ce$O_{2}$ 완충층의 증착 (Deposition of Ce$O_{2}$ buffer layer for YBCO coated conductors on hi-axially textured Ni substrate by MOCVD technique)

  • 김호진;주진호;전병혁;정충환;박순동;박해웅;홍계원;김찬중
    • 한국초전도저온공학회:학술대회논문집
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    • 한국초전도저온공학회 2002년도 학술대회 논문집
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    • pp.91-94
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    • 2002
  • Textured Ce$O_{2}$ buffers for YBCO coated conductors were deposited on biaxially textured Ni substrate by metalorganic chemical vapor deposition The texture of deposited Ce$O_{2}$ films was varied with deposition temperature(T) and oxygen partial pressure($Po_{2}$). ($\ell$ 00) textured Ce$O_{2}$ films were deposited at T= 500~$520^{\circ}C$, $Po_{2}$= 0.90~3.33 Torr. The growth rate of the Ce$O_{2}$ films was 150~200 nm/min at T= $520^{\circ}C$ and $Po_{2}$= 2.30 Torr, which was much faster than that prepated by other physical deposition method.

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진공증착법을 이용한 P(VDF-TrFE) 공중합체 박막의 압전특성에 관한 연구 (A Study on the Piezoelectric Characteristic of P(VDF-TrFE) Copolymer Thin Film by Physical Vapor Deposition Method)

  • 박수홍
    • 한국진공학회지
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    • 제17권3호
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    • pp.220-225
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    • 2008
  • 본 실험은 P(VDF-TrFE) 공중합체 박막을 제조하고 압전특성을 검토하는데 있다. 또한 압전 특성 분석에서 압전 계수 $d_{33}$와 압전 전압 계수 $g_{33}$는 증착 온도가 $260{\sim}300^{\circ}C$ 까지는 32.3pC/N에서 36.28pC/N, $793{\times}10^{-3}V{\cdot}m/N$에서 $910.5{\times}10^{-3}V{\cdot}m/N$으로 증가하는 경향을 나타내었다. 이상의 실험 결과로 $300^{\circ}C$의 온도에서 P(VDF-TrFE) 공중합체 박막을 제조 할 때 최적의 특성이 나타남을 알 수 있었다. 반면에 증착온도가 $320^{\circ}C$에서 증착한 경우에는 각각 25.3pC/N, $680.3{\times}10^{-3}V{\cdot}m/N$으로 감소하였다.

진공증착법으로 제조된 PVDF 유기박막의 초음파 응답 특성에 관한 연구 (A Study on the Ultrasonic Response Characteristic of PVDF Organic Thin Film by Physical Vapor Deposition Method)

  • 박수홍
    • 한국진공학회지
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    • 제18권3호
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    • pp.221-228
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    • 2009
  • 본 논문의 목적은 진공증착법을 이용한 $\beta$-PVDF($\beta$-Polyvinylidene fluoride) 유기 박막의 제조와 제조된 유기 박막의 초음파 응답 특성을 연구하는데 있다. 진공 증착은 증발원 온도 $270^{\circ}C$, 인가 전계 142.4kV/cm, 진공도 $2.0{\times}10^{-5}Torr$에서 실시하였다. 기판온도의 증가에 따라서 결정화도는 47%에서 67.8%로 증가함을 알 수 있었다. 초음파 응답특성에서 거리를 1cm에서 100cm로 변화시켰을 경우, 출력전압은 0.615V에서 0.4V로 감소하였다.