• Applied Chemistry for Engineering
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• v.10 no.8
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• pp.1114-1118
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• 1999

Barrier rib for the plasma display panel(PDP) was made by photolithographic process utilizing photosensitive barrier rib paste. The barrier rib paste was prepared by first dissolving ethylcellulose(binder polymer) in butyl carbitol(BC)/butyl carbitol acetate(BCA) =30/70 wt % mixture solvent at 15 wt % concentration. To this solution a mixture of functional monomers consisted of tripropyleneglycol diacrylate/ pentaerythritol triacrylate = 50/50 wt %, Irgacur 651 photoinitiator, and barrier rib powder were added and then the whole mixture was mixed in the three roll mill for 2 hr. The effect of component and concentration of photosensitive barrier paste on the photolithographic process was studied. After optimization of the paste formulation and photolithographic process, barrier rib could be obtained with good resolution up to $100{\mu}m$ height.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.823-827
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• 2005

Barrier ribs in the plasma display panel (PDP) function to maintain the discharge space between the glass plates as well as to prevent optical crosstalk. Patterning of barrier ribs is one of unique processes for making PDP. Barrier ribs could be formed by screen-printing, sand blasting, etching, and photolithographic process. In this work photosensitive barrier rib pastes were prepared by incorporating binder polymer, solvent, functional monomers photoinitiator, and barrier rib powder of which surface was treated with fumed silica particles. Studies on the function of materials for the barrier rib paste were undertaken. After optimization of paste formulation and photolithographic process, it was applied to the photosensitive barrier rib green sheet and was found that photolithographic patterning of barrier ribs could be formed with good resolution up to $110{\mu}m$ height and $60{\mu}m$ width after sintering.

• Applied Chemistry for Engineering
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• v.7 no.2
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• pp.379-386
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• 1996

Photosensitive compound, 1-methyl-4-[2-(4-diethylacetylphenyl)ethenyl] pridinium methosulfate(SbQ-A salt), was synthesized from dimethyl sulfate, terephthalaldehyde mono-(diethylacetal) and 4-picoline. SbQ-A salts were reacted with poly(vinyl alcohol)s, (PVA) in aqueous solution with phosphoric acid as catalyst to give photosensitive PVA-SbQ with different SbQ content and molecular weight. Relative photosensitivity of PVA-SbQ was determined by gray scale(GS) method. The rotative sensitivity of PVA-SbQ increased with increasing amount of bound SbQ in the case of high molecular weight(MW=77,000-79,000g/mol) as substrate and decreased with decreasing molecular weight of PVA with about constant(1.3mol%) amount of bound SbQ. The most sensitive polymer was obtained when SbQ group content in PVA-SbQ reached about 2.63mol% in the case of high molecular weight(77,000-79,000g/mol) PVA. This sample showed 90 times greater sensitivity than dichromated PVA as reference photosensitive system. PVA-SbQ photosensitive polymer synthesized was applied to the photolithographic screening process of phosphor on the panel of cathode ray tube(CRT). Phosphor slurry was made with PVA-SbQ, phosphor, a small amount of surfactant and other additives using water as medium. The slurry was coated onto panel, dried by heater, exposed to UV light and then developed by distilled water. When a small amount of cationic surfactant such as cetyltrimethylammonium chloride was used in the slurry formulation, the sharpness of phosphor pattern was equal to or better than that of dichromated PVA photosensitive polymer system used currently.

• Applied Chemistry for Engineering
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• v.21 no.4
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• pp.411-416
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• 2010

In this research, we intended to improve the tolerance of thick film resistor using photosensitive polymer resistor paste which was fabricated with alkali-solution developable photosensitive resin and conductive carbon black. At first, we investigated the effect of the selection of carbon black and photosensitive resin on the resistance range and tolerance level of polymer thick film resistor (PTFR). And then, a difference in resistance tolerance was evaluated according to the coating methods of photosensitive resistor paste on test board. In case that the photosensitive resistor paste was coated on whole surface of test board using screen printing, large positional tolerance was obtained because the formation of the thick film with uniform thickness was difficult. On the other hand, when the paste was coated with roller, the resistive thick film with uniform thickness was formed on the whole board area and the result of resistance evaluation showed low tolerance in ${\pm}10%$ range. The tolerance of PTFR could be improved by combination of the precise patterning using photo-process and the coating process for the resistive thick film with uniform thickness.

• Applied Chemistry for Engineering
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• v.20 no.6
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• pp.622-627
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• 2009

Using an alkali-solution developable photosensitive resin and a carbon black as a conductive filler, photo-patternable pastes for polymer thick film resistor were fabricated and evaluated. A photo solder resist (PSR), which is usually used as protecting layer of printed circuit board (PCB), was used as a photosensitive resin so that ultraviolet exposure and alkali-aqueous solution development of paste were possible. After fabricating the photosensitive polymer resistor paste, the electrical properties of thick film resistors were measured using PCB test boards. Sheet resistance was decreased with increasing amount of carbon black, but the developability was limited in excess loading of carbon black. The sheet resistance was also reduced by re-curing and the change rate was smaller in higher carbon black loading. Moreover, finely patterned meander-type thick film resistors were fabricated using photo-process and large resistance up to several tens of sheet resistance could be obtained in small area by this technique.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.893-896
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• 2007

A series of new photosensitive polyimides having long alkoxy cinnamate chains were synthesized for liquid crystal (LC) photoalignment material. The polymer after irradiating linearly polarized UV light induced homogeneous and stable LC alignment. The chemical structure of the polymeric material was characterized and their photochemical LC alignment behavior was evaluated.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.1225-1228
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• 2005

Barrier ribs in the plasma display panel(PDP) function to maintain the discharge space between the glass plates as well as to prevent optical crosstalk. Patterning of barrier ribs is one of unique processes for making PDP. In this work photosensitive barrier rib pastes were prepared by incorporating binder polymer, solvent, functional monomers photoinitiator, and barrier rib powder of which surface was treated with fumed silica particles. Study on the function of materials for the barrier rib paste were undertaken. After optimization of paste formulation and photolithographic process, it was found that photolithographic patterning of barrier ribs with photosensitive barrier rib green sheet could be used in the fabrication of high resolution PDP.

• 한국정보디스플레이학회:학술대회논문집
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• 2000.01a
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• pp.41-42
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• 2000

Photosensitive polyimides containing cinnamoyl and coumarin side groups were synthesized in a high molecular weight, giving a good quality of films. Nematic liquid-crystal (LC) molecules on the film were aligned along the direction with an angle of $97-99^{\circ}$ respect to the polarization of ultraviolet (UV) light. The LC alignment was induced mainly by the photoaligned polymer chains made by the first UV-exposure even though the film was treated by multiple exposures with changing the polarization of UV light. From these results, it is concluded that the LC alignment on the film is induced by the photodimerization rather than the trans-cis photoisomerization.

• Polymer(Korea)
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• v.24 no.3
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• pp.407-417
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• 2000

Photosensitive polyimides having cyclobutane or phenyl and aromatic sulfonyloxyimide units in the main chain have been synthesized and the photodegradation behavior was investigated in relation with the polymer structure. The polyimides were prepared by condensation polymerization of N-hydroxyl and sulfonyl chloride. The prepared polyimides were stable up to 25$0^{\circ}C$ without thermal degradation. It has been found that the photodegradation of polyimides upon irradiation of 254 nm UV light results from scission of N-O bonds or ring opening of imides moiety by spectroscopic measurements. The polyimides were useful as positive working photodegradable polymers. Especially, the positive tone image of polyimide containing a pyromellitic diimide moiety exhibited high sensitivity and resolution.

• Journal of the Korean Graphic Arts Communication Society
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• v.11 no.1
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• pp.71-84
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• 1993

Practically to put use high-photosensitive polymer, poly(vinyl cinnamoyl acetate), we investigated and confirmed UCHIDA`s synthesis, according to control solvent, which is the esterification of poly (vinyl alcohol) with monochloroacetic acid and can be freely conrolled the successive cinnamoyl acetoxyl esterfication of PVCiA, and intruducing photosensitizers,studied the photosensitivity of PVCiA.