• Proceedings of the Korean Fiber Society Conference
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• 2001.04b
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• pp.47-50
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• 2001

• Proceedings of the Materials Research Society of Korea Conference
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• 1999.05a
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• pp.62-62
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• 1999

• Proceedings of the Korean Vacuum Society Conference
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• 2002.06a
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• pp.38-39
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• 2002

• Proceedings of the Korean Ceranic Society Conference
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• 2002.10a
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• pp.42.2-42
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• 2002

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 1998.05a
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• pp.65-65
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• 1998

• Proceedings of the Materials Research Society of Korea Conference
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• 1998.11a
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• pp.15-15
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• 1998

• Proceedings of the Materials Research Society of Korea Conference
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• 2002.11a
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• pp.110-110
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• 2002

• Bulletin of the Korean Chemical Society
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• v.14 no.6
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• pp.655-657
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• 1993

• Applied Chemistry for Engineering
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• v.17 no.2
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• pp.217-222
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• 2006

Polyimides have been investigated extensively and used widely over the past three decades because of their high performance properties such as excellent thermal, mechanical, and electrical properties. Polyimides are difficult to be processed because of the aromatic moieties, imide group, and insoluble nature in most organic solvents. The soluble polyimides were synthesized from 2,2,-bis(3-amino-4-hydroxyphenyl) hexafluoropropane (BAPAF) and 3,3,-diamino-4,4-dihydroxybyphenyl (HAB) as aromatic diamines and 4,4-(hexafluoroisopropylidene)diphthalic dianhydride (6FDA), pyromellitic dianhydride (PMDA), 4,4-oxydiphthalic dianhydride (OPDA), 3,3,4,4-benzophenone tetracarboxylic dianhydride (BTDA) and 3,3,4,4-diphenylsulfone tetracarboxylic dianhydride (DSDA) as aromatic dianhydrides. The polyimides were characterized by NMR, FR-IR, TGA and the dielectric constant of the obtained polyimides was calculated from storage of electro-capacity. A novel photosensitive polyimide was synthesized by the reaction of polyimide, containing hydroxyl group and methacryloyl chloride using triethylamine. The good micro-pattern was obtained with photosensitive polyimide from the photolithographic technique.

• Journal of the Korean institute of surface engineering
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• v.46 no.3
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• pp.99-104
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• 2013

The simple and cost-effective microfabrication method of photosensitive glass (PSG) using metal patterning and blank exposure was proposed. Conventional photolithography for micromachining of PSG needs a costly quartz mask which has high transmittance as an optical property. However, in this study the process was improved through the combination of micro-patterned Ti thin film and blank UV exposure without quartz mask. The effect of UV exposure time as well as the DHF etching condition was investigated. UV exposure test was performed within the range from 3 min to 9 min. The color and etch result of PSG exposed for 5 min were the most clear and effective to etch more precisely, respectively. The etching results of PSG in diluted hydrofluoric acid (DHF) with a concentration of 5, 10, 15 vol% were compared. The effect on the side etch was insignificant while the etch rate was proportional as the concentration increased. 10 vol% DHF results not only high etch rate of 75 ${\mu}m/min$ also lower side etch value after PSG etching. This method facilitates the microfabrication of PSG with various patterns and high aspect ratio for applying to advanced applications.