• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.432-432
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• 2009

본 연구에서는 HW-PLD(Hot-walled Pulsed Laser Deposition) 법을 이용하여 ZnO 나노와이어를 $Al_2O_3$ 기판 위에 성장하였다. 성장된 ZnO 나노와이어는 SEM, XRD, PL 분석을 통하여 구조적 특성을 확인하였으며, 성장된 나노와이어를 photolithography 공정을 통하여 FET(Field Effect Transistor)소자를 제작하였다. 제작된 소자의 I-V 특성 측정 결과 Ti/Au 전극과 ZnO nanowire 채널 간에 ohmic 접합이 형성된 것을 확인하였으며 게이트 전압의 증가에 따라 소스와 드레인 사이의 전류가 증가하는 전형적인 n-type FET소자 특성을 나타내었다.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.10 no.1
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• pp.1-7
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• 2011

Micromachining is gaining popularity due to recent advancements in MEMS(Micro Electro Mechanical Systems). Using conventional micromachining, it is relatively difficult to produce moving components in the order of microns. Photolithography for silicon material has high accuracy machining, but it has low aspect ratio. X-ray lithography has ultra high accuracy machining, but it has expensive cost. Micro-EDM(electro discharge machining) has been gaining popularity as a new alternative method to fabricate micro-structures. In this study, Micro-EDM machine is developed available for fabricate micro-structures and two processes such as side cut EDM and milling EDM is proposed. Several sets of experiment results have been performed to study the characteristics of the machining process.

• Journal of the Korea Computer Industry Society
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• v.10 no.4
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• pp.121-126
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• 2009

In this paper, the patch antenna for 2.64GHz S-DMB applications has been studied. The patch antenna was designed by HFSS (High Frequency Structural Simulator) program and the optimized antenna was fabricated using photolithography method on the FR-4 substrate. To find optimal conditions of microstrip patch antenna, design parameters with different patch size, length of feedline and metal thickness were analyzed.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.8
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• pp.152-156
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• 2004

A new tool of surface patterning technique for general purpose lithography was developed based on shadow mask method. This paper describes the fabrication of a new type of miniaturized shadow mask. The shadow mask is fabricated by photolithography and etching of 100-mm full wafer. The fabricated shadow mask has over 388 membranes with apertures of micrometer length scale ranging from 1${\mu}{\textrm}{m}$ to 100s ${\mu}{\textrm}{m}$ made on each 2mm${\times}$2mm large low stress silicon nitride membrane. It allows micro scale patterns to be directly deposited on substrate surface through apertures of the membrane. This shadow mask method has much wider choice of deposit materials, and can be applied to wider class of surfaces including chemical functional layer, MEMS/NEMS surfaces, and biosensors.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1518-1521
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• 2005

The application of focused ion beam (FIB) technology in micro/nano machining has become increasingly popular. Its usage in micro/nano machining has advantages over contemporary photolithography or other micro/nano machining technologies such as small feature resolution, the ability to process without masks and being accommodating for a variety of materials and geometries This paper focus to apply the sputtering technology accumulated by experiments to 3d structure fabrication with high resolution. Therefore some verifications and discussions of the characteristics of FIB sputtering results according to focal length were described in this paper. And we suggested the definition of rectangular pattern profile and made the verifications of sputtering results based on definition of it.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.3 s.180
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• pp.56-60
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• 2006

A high-resolution shadow mask, or called a nanostencil was fabricated for high resolution lithography. This high-resolution shadowmask was fabricated by a combination or MEMS processes and focused ion beam (FIB) milling. 500 nm thick and $2{\times}2mm$ large membranes wore made on a silicon wafer by micro-fabrication processes of LPCVD, photolithography, ICP etching and bulk silicon etching. A subsequent FIB milling enabled local membrane thinning and aperture making into the thinned silicon nitride membrane. Due to the high resolution of the FIB milling process, nanoscale apertures down to 70 nm could be made into the membrane. By local deposition through the apertures of nanostencil, nanoscale patterns down to 70 nm could be achieved.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.503-507
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• 2002

Mask manufacturing is a high COC and COO process in developing of semiconductor devices, because of the mass production tool with high resolution. Direct writing has been thought to be one of the patterning method to cope with development or small-lot production of the device. This study focused on the development of the direct, mastless patterning process using stereolithography tool for the easy and convenient application to micro and miso scale products. Experiments are utilized by three dimensional CAD/CAM as a mask and photo-curable resin as a photo-resist in a conventional stereo-lithography apparatus. Results show that the resolution of the pattern was achieved about 300 micron because of complexity of SLA apparatus settings, inspite of 100 micro of inherent resolution. This paper concludes that photo resist and laser spot diameter should be adjusted to get finer patterns and the proposed method is significantly feasible to mastless and low cost patterning with micro and miso scale.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.1 s.190
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• pp.79-84
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• 2007

Some surface pattern of tribological application is an attractive technology of engineered surface. Therefore, friction reduction is considered to be necessary for improved efficiency of machine. This study investigated the effect of friction property for angles of micro-crosshatch groove surface pattern on bearing steel using pin-on-disk test. We obtain sample which can be fabricated by photolithography process. We discuss the friction property depend on an angle of crosshatch groove surface pattern. We can verify the lubrication mechanism as Stribeck curve, which has a relationship between the friction coefficient and a dimensionless parameter under the lubrication condition. It was found that the friction coefficient was related to angle of crosshatch groove pattern on contact surface.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.925-928
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• 2004

The application of focused ion beam (FIB) technology in micro/nano machining has become increasingly popular. Its use in micro/nano machining has advantages over contemporary photolithography or other micro/nano machining technologies such as small feature resolution, the ability to process without masks and being accommodating for a variety of materials and geometries. This paper was carried out some experiments and verifications of mechanism on FIB-CVD using SMI8800 made by Seiko. FIB-CVD has in fact proved to be commercially useful for repair processes because the beam can be focused down to 0.05$\mu\textrm{m}$ dimensions and below and because the same tool can be used to sputter off material with sub-micrometer precision simply by turning off the gas ambient. Recently the chemical vapour deposition induced ion beam has been required more deposition rate and accurate pattern because of trying to manufacture many micro and nano parts. Therefore this paper suggested the optimization parameters and discussed some mechanism of chemical vapour deposition induced ion beam on FIB-CVD for simple pattern.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.871-874
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• 2004

Fabrication of a high-resolution shadow mask, or called nanostencil, is presented. This high-resolution shadowmask is fabricated by a combination of MEMS processes and focused ion beam (FIB) milling. 500 nm thick and 2x2 mm large membranes are made on a silicon wafer by micro-fabrication processes of LPCVD, photolithography, ICP etching and bulk silicon etching. Subsequent FIB milling enabled local membrane thinning and aperture making into the thinned silicon nitride membrane. Due to high resolution of FIB milling process, nanoscale apertures down to 70 nm could be made into the membrane.