• Title/Summary/Keyword: perpendicular adhesion ratio

Search Result 4, Processing Time 0.015 seconds

A Proposal of a New Model of Wheel and Tractor Dynamics that Includes Lift Resistance

  • Sakai, Jun;Choe, Jung-Seob;Kishimoto, Tadashi;Yoon, Yeo-Doo
    • Proceedings of the Korean Society for Agricultural Machinery Conference
    • /
    • 1993.10a
    • /
    • pp.1176-1185
    • /
    • 1993
  • The purpose of this study is to propose a new dynamic model of wheels and agricultural tractors through verification of the existence of " lift resistance " and "perpendicular adhesion" which also can be called " contra-retractive adhesion". The existence of these forces was proved through experiments including the development of a sensor which can measure the forces acting on a wheel accurately. Consequently " perpendicular adhesion ratio" which is defined as the ratio of the perpendicular adhesion to the distributed load was observed to be in the range of 0.05 to 0.3. This means the influence of the " lift resistance " is comparable to that of motion resistance in wheel dynamics. The perpendicular adhesion ratio was observed to decrease logarithmically with the increase of ground contact pressure, and to increase linearly with increase of the travel speed of the wheel . Some examples to express the new dynamic model compared to the conventional dynamics are explained.

  • PDF

Tractor Design for Rotary Tillage Considering Lift Resistance (상승저항력을 고려한 로터리경운작업을 위한 승용트랙터의 설계)

  • Sakai, J.;Yoon, Y.D.;Choe, J.S.;Chung, C.J.
    • Journal of Biosystems Engineering
    • /
    • v.18 no.4
    • /
    • pp.344-350
    • /
    • 1993
  • The purpose of this study is to develop design equations to calculate optimum specifications and dimensions such as weight, engine horsepower, etc. of the tractor necessary to perform stable rotary tillage. The main results of this study are as follows. 1. A wheel-lug ought to receive a special resistance in downward direction which resists the lug's upward motion on wet sticky soil surface. The authors introduce a new academic name of the "lift resistance(上昇抵抗力, 상승저항력)" for such a force which resists retraction of a wheel lug from the soil in the upward trochoidal motion. This force is composed of the frictional force acting on the trailing and the leading lug side, and the "perpendicular adhesion(鉛直付着力, 연직부착력)" acting on the lug face and the undertread face on adhesive soil. 2. The "lift resistance ratio(上昇抵抗力係數, 상승저항력계수)" and the "perpendicular adhesion ratio(鉛直付着力係數, 연직부착력계수)" were defined, which are something similar to the definition of the motion resistance ratio, the traction coefficient, etc. 3. The design equation of the optimum weight of a rotary tiller mounted on the tractor derived by calaulating the forces acting on the rotary blades. 4. The design equations to calculate optimum specifications and dimensions such as weight, engine horsepower, etc. of the tractor necessary to perform stable rotary tillage were derived. It becomes clear that the optimum weight of a rotary tiller and a tractor can be estimated in planning design by means of putting about 21 design factors of the target into the equation. These equations are useful for planning design to estimate the optimum dimensions and specifications of a rotary tiller as well as a tractor by the use of known and/or unknown design parameters.

  • PDF

Interaction and mechanical effect of materials interface of contact zone composite samples: Uniaxial compression experimental and numerical studies

  • Wang, Weiqi;Ye, Yicheng;Wang, Qihu;Luo, Binyu;Wang, Jie;Liu, Yang
    • Geomechanics and Engineering
    • /
    • v.21 no.6
    • /
    • pp.571-582
    • /
    • 2020
  • Aiming at the mechanical and structural characteristics of the contact zone composite rock, the uniaxial compression tests and numerical studies were carried out. The interaction forms and formation mechanisms at the contact interfaces of different materials were analyzed to reveal the effect of interaction on the mechanical behavior of composite samples. The research demonstrated that there are three types of interactions between the two materials at the contact interface: constraint parallel to the interface, squeezing perpendicular to the interface, and shear stress on the interface. The interaction is mainly affected by the differences in Poisson's ratio and elastic modulus of the two materials, stronger interface adhesion, and larger interface inclination. The interaction weakens the strength and stiffness of the composite sample, and the magnitude of weakening is positively correlated with the degree of difference in the mechanical properties of the materials. The tensile-shear stress derived from the interaction results in the axial tensile fracture perpendicular to the interface and the interfacial shear facture. Tensile cracks in stronger material will propagation into the weaker material through the bonded interface. The larger inclination angle of the interface enhances the effect of composite tensile/shear failure on the overall sample.

Adhesive bonding using thick polymer film of SU-8 photoresist for wafer level package

  • Na, Kyoung-Hwan;Kim, Ill-Hwan;Lee, Eun-Sung;Kim, Hyeon-Cheol;Chun, Kuk-Jin
    • Journal of Sensor Science and Technology
    • /
    • v.16 no.5
    • /
    • pp.325-330
    • /
    • 2007
  • For the application to optic devices, wafer level package including spacer with particular thickness according to optical design could be required. In these cases, the uniformity of spacer thickness is important for bonding strength and optical performance. Packaging process has to be performed at low temperature in order to prevent damage to devices fabricated before packaging. And if photosensitive material is used as spacer layer, size and shape of pattern and thickness of spacer can be easily controlled. This paper presents polymer bonding using thick, uniform and patterned spacing layer of SU-8 2100 photoresist for wafer level package. SU-8, negative photoresist, can be coated uniformly by spin coater and it is cured at $95^{\circ}C$ and bonded well near the temperature. It can be bonded to silicon well, patterned with high aspect ratio and easy to form thick layer due to its high viscosity. It is also mechanically strong, chemically resistive and thermally stable. But adhesion of SU-8 to glass is poor, and in the case of forming thick layer, SU-8 layer leans from the perpendicular due to imbalance to gravity. To solve leaning problem, the wafer rotating system was introduced. Imbalance to gravity of thick layer was cancelled out through rotating wafer during curing time. And depositing additional layer of gold onto glass could improve adhesion strength of SU-8 to glass. Conclusively, we established the coating condition for forming patterned SU-8 layer with $400{\mu}m$ of thickness and 3.25 % of uniformity through single coating. Also we improved tensile strength from hundreds kPa to maximum 9.43 MPa through depositing gold layer onto glass substrate.