• Title/Summary/Keyword: peel thickness

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Strength Evaluation of Adhesive Bonded Joint for Light Weight Structure by T-Peel Joint Test (T형 이음 접합에 의한 경량구조물용 접착이음강도의 평가)

  • 이강용;공병석;우형표
    • Transactions of the Korean Society of Automotive Engineers
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    • v.6 no.4
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    • pp.56-65
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    • 1998
  • The bonding strength evaluation of the light weight materials for an electrical vehicle has been performed through the T-peel joint test in which the design paramete- rs such as joint style, adherend type, adherend thickness, adhesive thickness, and adhesive type are considered. It is experimentally observed that the peel strength of joint increases with the increase of the adherend thickness. With the increase of the adhesive thickness, however, the peel strength of joint increases a little. Aluminum-FRP adherend combination shows such higher peel strength than that of Aluminum-Aluminum adherend combination. For the adhesive bonded joint, the results of FEM analysis agree with those of experiment. The adhesive bonded joint reinfored with a rivet gives higher peel strength than that of the joint without rivet.

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Factors Affecting on Quality Evaluation of Citrus unshiu Produced in Cheju (제주산 온주밀감의 품질평가에 미치는 요인)

  • 고정삼;양영택
    • Food Science and Preservation
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    • v.1 no.1
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    • pp.9-14
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    • 1994
  • Soluble solids($^{\circ}$Brix), acid content and edible part ratio of Citrus unshiu collected at sorting Places in south Cheju area wee more lowered, and peel thickness was more thickened with increasing fruit size. Compared to early variety of Citurs unshiu(C. unshiu Miyakawa Mar), peel thickness of medium variety of Citurs unshiu(C. unshiu Hayashi Mar) was more thickened, and edible part ratio was more lowered with increasing fruit size. Soluble solids of medium variety of Citurs unshiu were lowered, and acid contents were increased compared to early variety. Processing properties for pressing concentrated juice was good for early variety of Citurs unshiu, especially on fruit diameter of 50-65mm. Soluble solids, acid contents and juice ratio were decreased with increasing peel thickness. The quality properties for fresh fruit with peel thickness had a good correlation on early variety of Citurs unshiu, and these data are supposed to be applied to the quality evaluation of Citurs unshiu produced in Cheju.

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Fatigue Strength Evaluation of T-Peel Adhesive Joing for Light Weight Material (경량 재료의 T형 접합이음의 피로강도 평가)

  • Lee, K.Y.;Kong, B.S.;Choi, H.S.
    • Transactions of the Korean Society of Automotive Engineers
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    • v.6 no.6
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    • pp.166-173
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    • 1998
  • The evaluation of joint fatigue strength of light weight materials for an electrical vehicle body has been performed through T-peel joint tests with the design parameters such as joint style, adherend type, adherend thickness, adhesive thickness, and various adhesives. Fatigue strength was evaluated through 5-Hz, tension-tension, load controlled test with the zero stress ratio. It was observed that the fatigue strength of the joint increases with the increase of the adherend thickness. With the increase of the adhesive thickness, however, the fatigue strength of the joint increases insignificantly. An aluminum-FRP adherend combination shows much higher fatigue strength than an aluminum-aluminum adherend combination. The results of fatigue tests were found to be consistent with those of static tests.

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Effects of Tape Thickness and Inorganic Fillers on the Adhesion Properties of Double-sided Acrylic Adhesive Tape by Ultraviolet Curing (자외선 경화형 아크릴 양면 점착테이프의 두께 및 무기물 충전제 종류에 따른 접착특성)

  • Kim, Dong-Bok
    • Polymer(Korea)
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    • v.38 no.3
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    • pp.397-405
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    • 2014
  • To manufacture of high-performance semi-structural double-sided adhesive tape, 2-ethylhexyl acrylate (2-EHA) and acrylic acid (AAC) were used, and the syrup was prepared by UV irradiation in this study. The effects of the thickness, various inorganic filler contents, and filler types on the semi-structural properties of acrylic double-sided adhesive tape were investigated. The peel strength increased with increasing thickness and wetting time. In case of the thin thickness (under $250{\mu}m$) with decreasing true density of inorganic filler, the peel strength increased with increasing wetting time. The initial peel strength showed a higher value at a big size of inorganic filler, and the filler's size in adhesive tapes was confirmed by SEM images. The peel strength and dynamic shear strength increased as a proportional relationship with various inorganic fillers and contents, and these inorganic fillers in $0.1{\mu}m$ thickness indicated more effect on the dynamic shear strength of double-sided adhesive tape. From these results the thin acrylic double-sided adhesive tape determined to be use for applications as a high-performance semi-structural.

A Study on the Improvement of Adhesion according to the Process Variables of Ion Beam in the Cu/Polyimide Thin Film (이온빔의 공정변수에 따른 Cu/Polyimide 박막의 접착력향상에 관한 연구)

  • Shin Youn-Hak;Kim Myung-Han;Choi Jae-Ha
    • Korean Journal of Materials Research
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    • v.15 no.7
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    • pp.458-464
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    • 2005
  • In microelectronics packaging, the reliability of the metal/polymer interfaces is an important issue because the adhesion strength between dissimilar materials is often inherently poor. The modification of polymer surfaces by ion beam irradiation and rf plasma is commonly used to enhance the adhesion strength of the interface. T-peel strengths were measured using a Cu/polyimide system under varying $N_2^+$ ion beam irradiation conditions for pretreatment. The measured T-peel strength showed reversed camel back shape regarding the fixed metal-layer thickness, which was quite different from the results of the 90° peel test. The elementary analysis suggests that the variation of the T-peel strength is a combined outcome of the plastic bending work of the metal and polymer strips. The results indicate that the peel strength increases with $N_2^+$ ion beam irradiation energy at the fixed metal-layer thickness.

A Study on the Improvement of Adhesion according to the Surface Modification of Cu/Polyimide Films by ion Beam Irradiation (이온빔에 의한 Cu/Polyimide 표면개질에 따른 접착력향상에 관한 연구)

  • Shin Youn-Hak;Chu Jun-Sick;Lee Seoung-Woo;Jung Chan-Hoi;Kim Myung-Han
    • Korean Journal of Materials Research
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    • v.15 no.1
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    • pp.42-46
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    • 2005
  • In microelectronics packaging, the reliability of the metal/polymer interfaces is an important issue because the adhesion strength between dissimilar materials is often inherently poor. The modification of polymer sufaces by ion beam irradiation and rf plasma are commonly used to enhance the adhesion strength of the interface. T-peel strengths were measured using a Cu/polyimide system under varying $Ar^+$ ion beam irradiation pretreatment conditions. The measured T-peel strength showed reversed camel back shape regarding the fixed metal-layer thickness, which was quite different from the results of the $90^{\circ}$ peel test. The elementary analysis suggests that the variation of the T-peel strength is a combined outcome of the plastic bending work of the metal and polymer strips. The results indicate that the peel strength increases with $Ar^+$ ion beam irradiation energy at the fixed metal-layer thickness.

A Study on Discrimination of Watercore Apple using Transmitted Light and Effects of various Factors (투과광을 이용한 밀병 사과의 판별 가능성 및 영향인자 조사)

  • 손미령;정경원;조래광
    • Food Science and Preservation
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    • v.7 no.4
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    • pp.357-361
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    • 2000
  • Watercore influences storage and distribution industry of fruit. Therefore, the technique for nondestructive discrimination of watercore fruit is needed. This work reports about the possibility of watercore discrimination of ante using transmitted light, and the effects of various factors. CCD camera was used to capone images of each apple fruit. An excess watercore apples were higher light transmission score than little watercore apples. The accuracy fur discrimination of watercore apple was about 70% using transmitted light. Peel thickness, anthocyanin layer thickness and density of apple affected the light transmission. Apples having thin peel, thin pigment layer and low density tended to high transmitted light score. Apples of good color degree were more probability of existence watercore than ones of bad color degree. But color distribution of apple peel was not correlated with watercore.

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changers of Mechanical Properties of Wool Woresed fabrics with fusible Interlingings(Part II) (모직물의 접착심 접착에 의한 물성의 변화 (제2보))

  • 지주원;유효선;이대훈
    • Journal of the Korean Society of Clothing and Textiles
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    • v.23 no.1
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    • pp.22-29
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    • 1999
  • This paper descrived the changes of peel strength wrinkle recovery and dimensional stability after fusing 4 different wool face fabrics with 3 different fusible interlinings. The fusing condition was conducted by fusing press machine under 4kg.f/cm2 at 15$0^{\circ}C$. To determine the effect of the varous physical properties of the fused fabrics face fabrics and interlinings on the peel strength wrinkle recovery and dimensional stability(hygral expansion and relaxation shrinkage) of fused fabrics correlation among the KES values of fused fabrics face fabrics and interlinings to the peel strength rinkle recovery and dimensional stability of fused fabrics were expeerimentally analyzed,. As the results the peel strength was mainly influenced by the cover factor of face fabric and interlinings. After fusing wrinkle recovery and hygral expansion were decreased. The cover factor wrinkle recovery weight thickness shear rigidity and frictional properties of face fabric and the thickness of fused fabrics were not influence to the wrinkle recovery of fused fabrics. In addition the dimensional stabilities of fused fabrics were mainly influenced by the tensile and frictional properties of the wrinkle recovery of fused fabrics. In addition the dimensional stabilities of fused fabrics were mainly influenced by the tensile and frictional properties of the face fabrics.

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A Study on Correlation between Busbar Electrodes of Heterojunction Technology Solar Cells and the Peel Strength (실리콘 이종접합 태양전지의 버스바 전극 두께와 접합강도의 상관관계)

  • Da Yeong Jun;Jiyeon Moon;Godeung Park;Zulmandakh Otgongerel;Hyeryeong Nam;Oryeon Kwon;Hyunsoo Lim;Sung Hyun Kim
    • Current Photovoltaic Research
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    • v.11 no.2
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    • pp.44-48
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    • 2023
  • In heterojunction technology (HJT) solar cells, low-temperature curing paste is used because the passivation layer deteriorates at high temperatures of 200℃ or higher. However, manufacturing HJT photovoltaic (PV) modules is challenging due to the weak peel strength between busbar electrodes and cells after soldering process. For this issue, the electrode thicknesses of the busbars of the HJT solar cell were analyzed, and the peel strengths between electrodes and wires were measured after soldering using an infrared (IR) lamp. As a result, the electrodes printed by the screen printing method had a difference in thickness due to screen mask. Also, as the thickness of the electrode increased, the peel strength of the wire increased.

A Study on the Relationship between Factors Affecting Soldering Characteristics and Efficiency of Half-cell Soldering Process with Multi-wires (Half-cell 기반 multi-wires 접합 공정에서 접합 특성에 영향을 주는 요인과 효율의 상관관계 연구)

  • Kim, Jae Hun;Son, Hyoung Jin;Kim, Sung Hyun
    • Current Photovoltaic Research
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    • v.7 no.3
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    • pp.65-70
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    • 2019
  • As a demand of higher power photovoltaic modules, shingled, multi-busbar, half-cell, and bifacial techniques are developed. Multi-busbar module has advantage for large amount of light havesting. And, half-cell is high power module for reducing resistive losses and higher shade tolerance. Recently, researches on multi-busbar is focused on reliability according to adhesion and intermetallic compound between Sn-Pb solder and Ag electrode. And half-cell module is researched to comparing with full-sized cell module for structure difference. In this study, we investigated the factors affecting to efficiency and adhesion of multi-wires half-cell module according to wire thickness, solder thickness, and flux. The results of solar simulator and peel test was that peel strength and efficiency of soldered cell is not related. But samples with flux including high solid material showed high efficiency. The results of FE-SEM and EDX line scan on cross-section between wire and Ag electrode for different flux showed thickness of solder joint between wire and Ag electrode is increasing through solid material increasing. Flux including high solid material would affect to solder behavior on Ag electrode. Higher solid material occurred lower growth of IMC layer because solder permeate to sider of wire ribbon than Ag electrode. And it increased fill factor for high efficiency. In soldering process, amount of solid material in flux and solder thickness are the factor related with characteristic of soldered photovoltaic cell.