• Journal of Korean Society for Atmospheric Environment
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• v.29 no.5
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• pp.513-527
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• 2013

Recently, hazardous air pollutants (HAPs) have been of great concern in Korea, largely due to public awareness on the importance of their impacts on environmental health. A group of HAPs includes a large number of various chemicals such as VOCs, PAHs, PCBs, dioxines, furans, organochlorinated pesticides, and some heavy metals. These groups of pollutants are generally known to have genetic toxicity and to be persistent in the environment. In addition, most of chemicals belong to the category of HAPs are widely distributed not only in air, but also in water and soil environments, and has therefore undergone considerable scrutiny for the last three decades. In this article, environmental implications and management of HAPs in Korea will be reviewed, with a particular emphasis on the monitoring of HAPs in the ambient air. A number of field studies will be introduced, which were recently conducted in large urban and industrial areas. Based on the filed studies, eight pollutants have been suggested to be intensively managed as higher priority pollutants, which are benzene, 1,3-butadiene, formaldehyde, acrolein, trichloroethylene, benzo(a)pyrene, hexa-valent Cr, and $PM_{2.5}$. Finally, future directions for a mega scale project for comprehensive monitoring of ambient atmosphere in large urban areas will be suggested. Such an innovative project is believed to provide more realistic information on the nature of the population exposure, which can not be simply identified by emission inventories or source investigations. Therefore, any strategy for the management of HAPs should be developed by not only emission-based approaches, but also observation-based approaches.

• Journal of the Korean Chemical Society
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• v.38 no.11
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• pp.819-826
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• 1994

This study described a simple, rapid and cost effective analytical technique for the ultra-trace analysis of dioxins in environmental samples. Liquid-Liquid extraction methods were used for the initial extraction and enrichment of the analyte. Subsequent clean-up procedures were achieved by using strong cation exchanger, silica and Florisil cartridges. Extracts were analysed by HRGC/HRMS-SIM. The efficiency of these analytical methods was tested by recovery and selectivity for elimination of interferences such as phenols, pesticides and PCBs in each step. The mean recovery of 1,2,3,4-TCDD spiked at 10 ppt in sea water was about 92(${\pm}$1.6)%. This analytical method was applied to Kwangyang sea water and 4.5pg/L of 2,3,7,8-TCDD was determined.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.4
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• pp.47-56
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• 2015

In this paper, the Thermal behavior and reliability characteristics of carbon CCL (Copper Claded Layer), which can be used as the core of HDI (High Density Interconnection) PCB (Printed Circuit Board) are evaluated through experiments and numerical analysis using CAE (Computer Aided Engineering) software. For the characterization of the carbon CCL, it is compared with the conventional FR-4 core and Heavy Cu core. From research results, the deformation amount of the flexure strength of PCB is the highest with pitch grade carbon and thermal behavior of PCB is lowest as temperature increases. In addition, TC (Thermal Cycling), LLTS (Liquid-to-Liquid Thermal Shock) and Humidity tests have been applied in the PCB with carbon core and the reliability of PCB with carbon core is confirmed through reliability tests. Also, possibility of uneven surface of the via hole and wear of the drill bit due to the carbon fibers are analyzed. surface of the via hole is uniform, the surface of the drill bit is smooth. Therefore, it is proved that the carbon CCL has the drilling workability of the same level as conventional core material.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.35-40
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• 2010

In this study, the reliability of thermal shock, thermal cycle, and complex vibration test at high temperature were examined for 3 types of lead-free solder alloys, Sn-3.5Ag, Sn-0.7Cu and Sn-5.0Sb. For the reliability test, daisychained BGA chips with ENIG-finished Cu pad was assembled with the three lead-free solders on OSP-finished PCBs. Among the 3 types solder alloys, Sn-3.5Ag solder alloy showed the highest degradation rate of electrical resistance and joint strength. On the other hand, Sn-0.7Cu solder alloy had high stability after the reliability tests.

• Journal of Digital Convergence
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• v.13 no.10
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• pp.337-342
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• 2015

SMT is an equipment that picks up electronic components and does precise placing onto PCBs. In order to do this, it stops in front of a camera installed in the middle to go over vision inspection. And after that it is move for placing. There are 16 different types of routes in this process. This paper presents the fastest algorithm to place (sLa-Camera-pLb) among all these routes. In order to do this, instead of stopping in front of camera the object should move on while going over the vision inspection. Among all possible tracks, this thesis will provide algorithm to find out the fastest tracks to do vision inspection and placing. And as a result, this thesis have demonstrated that this method can save about 16% of time compared to going over inspection while the object is standing still through simulation.

• Proceedings of the Korean Society of Developmental Biology Conference
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• 2003.10a
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• pp.63-63
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• 2003

In an effort to uncover the spermatogenic impairment by the polychlorinated biphenyls (PCBs), the expression of tight junctions (TJs) genes important for the formation of the blood testis barrier (BTB) were examined following the 3,3',4,4',5-pentachloro biphenyl (PCB126) treatment in cultured neonatal testis in mice. At 4 days (D4) after 10 and 100 nM PCB126 treatment the expression of claudin-11 was significantly increased when compared with vehicle control. In contrast no difference in occludin and claudin-1 expression was found among the experimental group. On D8, 100 nM PCB126 significantly increased the expression of claudin-11 but not occludin and claudin-1. 1 uM PCB126 treatment significantly decreased expressions of occludin and ciaudin -1, suggesting the general toxic effect on the Sertoli cell. Because PCB126 does not alter the proliferative activity of spermatogenic cells and Sertoli cells in neonatal testis, it is likely that increase in the expression of claudin-11 by low dose of PCB126 may attribute to the alteration of the Sertoli cells differentiation in testis. It also emphasized that PCB126 might have differentially affected the transcription of TJ genes in Sertoli cells. In conclusion, this result suggests that the structure of TJ may be targeted by PCB126 in neonatal testis in mice and that co-PCB is potentially harmful to spermatogenesis by alteration of the development of BTB.

• Resources Recycling
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• v.16 no.3 s.77
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• pp.3-11
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• 2007

Presently, most of gold is smelted from gold concentrates and anode slimes. Anode slimes are by-products of nonferrous smelters such as lead and copper. In addition, gold is recovered from waste dental and medical materials, waste gold coating solution, and waste printed circuit boards (waste PCBs). The smelting method of gold from gold concentrates and various wastes containing high concentration of gold is largely divided into chlorination, cyanidation, and amalgamation methods. For the anode slimes, electrolysis method is usually used, which largely consists of roasting, high temperature melting and electrolysis processes. Also, various wastes containing low concentration of gold are mainly treated by pyrometallursical processes. In the paper, current status on gold smelting technology is reviewed, and a novel process for gold smelting which is researched in the recent is briefly introduced.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.17 no.6 s.109
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• pp.529-537
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• 2006

Multi-layer PCBs are of ien used In compact microwave circuit design as density of PCB layout is increased. In this paper, the crosstalk between coupled lines connected with vias in a 4-layer PCB is investigated theoretically based on the circiuit-concept approach. Coupled lines connected with vias in a 4-layer PCB are divided into three sections, which are coupled microstrip lines and upper via section, center via section, and lower via and coupled microstrip lines section, respectively. Each section is represented by ABCD matrix. By cascading these three ABCD matrices crosstalk between coupled lines connected with vias in a 4-layer PCB is approximately calculated. The validity of this theoretical approach is verified by comparing the calculated results with the simulated ones using HFSS.

• Journal of Microbiology and Biotechnology
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• v.18 no.9
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• pp.1564-1571
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• 2008

We investigated whether the threshold concentration for polychlorinated biphenyl (PCB) dechlorination may be lower in biosurfactant-amended sediments compared with biosurfactant-free samples. At PCB concentrations of 40, 60, and 120 ppm, the surfactant amendment enhanced the PCB dechlorination rate at all concentrations and the rate was also faster at higher concentrations. On a congener group basis, dechlorination proceeded largely with group A (congeners with low threshold) in both surfactant-free and -amended sediments, accumulating mainly group C (residual products of dechlorination) congeners, and surfactant enhanced the dechlorination rate of group A congeners. Since the PCB threshold concentration for the inoculum in the experiment was lower than 40 ppm, we carried out another experiment using sediments with lower PCB concentrations, 10, 20, and 30 ppm. Sediments with 100 ppm were also performed to measure dechlorination at a PCB saturation concentration. Comparison between the plateaus exhibited that the extent of dechlorination below 40 ppm PCBs was much lower than that at a saturation concentration of 100 ppm. There was no significant difference in the extent of dechlorination between surfactant-free and -amended sediments. Moreover, surfactant did not change the congener specificity or broaden the congener spectrum for dechlorination at PCB concentrations below 40 ppm. Taken together, it seems that at a given PCB concentration, dechlorination characteristics of dechlorinating populations may be determined by not only the congener specificity of the microorganisms but also the affinity of dechlorinating enzyme(s) to individual PCB congeners.

• Transactions on Electrical and Electronic Materials
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• v.17 no.5
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• pp.280-288
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• 2016

Microelectronic product consumers may already be expecting another paradigm shift with smarter phones over smart phones, but the current status of microelectronic manufacturing engineering education (MMEE) in universities hardly makes up the pace for such a fast moving technology paradigm shift. The purpose of MMEE is to educate four-year university graduates to work in the microelectronics industry with up-to-date knowledge and self-motivation. In this paper, we present a comprehensive curriculum for a four-year university degree program in the area of microelectronics manufacturing. Three hands-on experienced-based courses are proposed, along with a methodology for undergraduate students to acquire hands-on experience, towards integrated circuits (ICs) design, fabrication and packaging, are presented in consideration of manufacturing engineering education. Semiconductor device and circuit design course for junior level is designed to cover how designed circuits progress to micro-fabrication by practicing full customization of the layout of digital circuits. Hands-on experienced-based semiconductor fabrication courses are composed to enhance students’ motivation to participate in self-motivated semiconductor fab activities by performing a series of collaborations. Finally, the Microelectronics Packaging course provides greater possibilities of mastered skillsets in the area of microelectronics manufacturing with the fabrication of printed circuit boards (PCBs) and board level assembly for microprocessor applications. The evaluation of the presented comprehensive curriculum was performed with a students’ survey. All the students responded with “Strongly Agree” or “Agree” for the manufacturing related courses. Through the development and application of the presented curriculum for the past six years, we are convinced that students’ confidence in obtaining their desired jobs or choosing higher degrees in the area of microelectronics manufacturing was increased. We confirmed that the hypothesis on the inclusion of handson experience-based courses for MMEE is beneficial to enhancing the motivation for learning.