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Crosstalk Analysis of Coupled Lines Connected with Vias in a 4-Layer PCB  

Han Jae-Kwon (Dept. of Radio Science & Engineering, Chungnam National University)
Park Dong-Chul (Dept. of Radio Science & Engineering, Chungnam National University)
Publication Information
Abstract
Multi-layer PCBs are of ien used In compact microwave circuit design as density of PCB layout is increased. In this paper, the crosstalk between coupled lines connected with vias in a 4-layer PCB is investigated theoretically based on the circiuit-concept approach. Coupled lines connected with vias in a 4-layer PCB are divided into three sections, which are coupled microstrip lines and upper via section, center via section, and lower via and coupled microstrip lines section, respectively. Each section is represented by ABCD matrix. By cascading these three ABCD matrices crosstalk between coupled lines connected with vias in a 4-layer PCB is approximately calculated. The validity of this theoretical approach is verified by comparing the calculated results with the simulated ones using HFSS.
Keywords
Crosstalk; 4-layer PCB; Coupled Lines; Vias; Circuit-Concept Approach; ABCD Matrices;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
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