• Journal of Advanced Navigation Technology
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• v.28 no.2
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• pp.246-249
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• 2024

In this paper, we present a miniaturized differential line (DL) using inductance-enhanced corrugated ground planes (LCGP) for effective common-mode (CM) noise suppression in high-speed packages and printed circuit boards. The LCGP-DL demonstrates the CM noise suppression in the frequency range from 2.09 GHz to 3.6 GHz. Furthermore, to achieve the same low cutoff frequency, the LCGP-DL accomplishes a remarkable 23.2% reduction in size compared to a reference DL.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.18 no.1_2
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• pp.27-32
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• 2012

There are many possibilities that recycled papers adulterate contaminants during the process. The objective of this research was to evaluate safety of paper-based packaging materials for food, especially commercial pizza boxes in Korea. Ultimately, we compared recycled and non-recycled commercial paper packaging materials. This study was based on Korean Food and Drug Administration (KFDA) regulation. PCBs were measured by GC-ECD. Arsenic and lead were analyzed using an ICP-MS. Formaldehyde was determined by LC-MS. Fluorescent materials were detected by UV lamp. The result of this study shows that non-recycled paper packaging materials meets all the tested hygienic specifications for food packaging materials, whereas recycled paper-based paperboard box may be contaminated by fluorescent whitening agent. Though these results need to be further studied, it is recommended to avoid using recycled paper in direct contact with food when used in food packaging.

• Analytical Science and Technology
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• v.14 no.1
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• pp.88-93
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• 2001

To measure the levels of dioxins in food selling at local markets, meat was analyzed by high resolution gas chromatography/high resolution ass spectrometry (HRGC/HRMS). The food samples were obtained from 5 large cities of Seoul, Chunchon, Daejon, Kwangju and Busan in Korea. All the samples were minced and extracted with Soxhlet extractor for 18 hours. After extraction, extracts were cleaned up by sulfuric acid impregnated silica gel, purified on a series of silica gel, alumina, carbon column chromatography and then analyzed by HRGC/HRMS. The contaminated levels were calculated as the TEQs by multiplying with the corresponding WHO-TEFs for each congeners. The overall recoveries were ranged from 80% to 153% and the limit of detection was about 0.01 ppt at S/N>3. The levels of PCDD/Fs for beef, pork and chicken were 0.018, 0.008 and <0.001 pgTEQ/g, respectively. In addition, the levels of non-ortho-co-planar PCBs for beef, pork and chicken were 0.008, 0.002 and 0.001 pgTEQ/g, respectively. Among food samples analyzed, chicken showed the lowest level of dioxin-like compounds. Regarding congener pattern, OCDD and PCB #77 were the highest contributing congeners.

• Analytical Science and Technology
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• v.12 no.1
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• pp.68-74
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• 1999

The Concentrations of PCDDs/PCDFs and their precusors(chlorophenols, chlorobenzenes, PCB) were analyzed from the dioxin control device such as EP and SCR to know the emission patterns of these compounds and find the dioxin index compounds. The dioxin concentration increased 7 times in outlet part than inlet part of EP and the concentration of CBs, CPs and PCBs also were increased through this control device. These phenomia may be related to the operating temperature of Electroprecipitator(EP), which the operating temperature is near the $300^{\circ}C$, the method of the decreasing the operating temperature need to consider to prevent the formation of these compounds. In the selected catalytic reactor with wet scrubber(SCR+WS), these compounds were removed after passing the device over 90% for CPs, 30~40% for CBs and 60% for PCBs. But, the systematic study have to perform to reduce the formation of PCDDs/PCDFs and precusors.

• 한국생물공학회:학술대회논문집
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• 2004.07a
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• pp.1-20
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• 2004

Polychlorinated biphenyls (PCBs), one a group of persistent and widespread environmental pollutants, have been considered to be involved in immunotoxicity, carcinogenesis, and apoptosis. However, the toxic effects and physical properties of a PCB congener are dependent on the structure. In the present study, we investigate the toxic effects and action mechanisms of PCBs In cells. Among the various congeners tested, 2,2',4,6,6'-PeCB-pentachlorobiphenyl (PeCB), a highly ortho-substituted congener having negligible binding affinity for aryl hydrocarbon receptor (AhR), caused the most potent toxicity and specific effects in several cell types. 2,2',4,6,6'-PeCB induced apoptotic cell death of human monocytic cells, suggesting that PCB-induced apoptosis may be linked to immunotoxicity. In addition, 2,2',4,6,6'-PeCB induced mitotic arrest by interfering with mitotic spindle assembly in NIH3T3 fibroblasts, followed by genetic instability which triggers p53 activation. Which suggests that 2,2',4,6,6'-PeCB may be involved in cancer development by causing genetic instability through mitotic spindle damage. On the other hand, 2,2',4,6,6'-PeCB increased cyclooxygenase-2 (COX-2) involved in cell survival through ERK1/2 MAPK and p53 in Rat-1 fibroblasts and mouse embryonic fibroblasts, triggering compensatory mechanism for abating its toxicity. Taken together, these results demonstrate that PCB congeners of different structure have distinct mechanism of action and 2,2',4,6,6'-PeCB causes several toxicity as well as compensatory mechanism in cells.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.19 no.3
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• pp.366-375
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• 2008

Generally a return current plane(RCP) of high speed digital and analog part is partitioned. This is achieved in order to decrease the noise interference between subsystem in PCBs(Printed Circuit Boards). However, when the connected signal line exists between each sub system, this partition will cause unwanted effects. In a circuital point of view, RCP partition has a bad influence upon signal integrity. In a EMI(Electromagnetic Interference) point of view, the partition of the return current plane becomes a primary factor to increase the radiated emission. Component bridge(CB) is usecl for the way of maintaining signal integrity, still specific user's guide doesn't give sufficient principle. In a view point of signal integrity, design principle of multi-CB using method will be analyzed by measurement and simulation. And design principle of noise mitigation will be provided. Generally interval of CB is ${\lambda}/20$ ferrite bead. In this study. When multi-CB connection is applied, design principle of ferrite bead and chip resistor is proved by measurement and simulation. Multi-connected chip resistance$(0{\Omega})$ is proved to be more effective design method in the point of signal integrity.

• Proceedings of the Korean Society of Soil and Groundwater Environment Conference
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• 2002.09a
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• pp.44-52
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• 2002

Low temperature thermal desorption (LTTD) has become one of the cornerstone technologies used for the treatment of contaminated soils and sediments in the United States. LTTD technology was first used in the mid-1980s for soil treatment on sites managed under the Comprehensive Environmental Respones, Compensation and Liability Act (CERCLA) or Superfund. Implementation was facilitated by CERCLA regulations that require only that spplicable regulations shall be met thus avoiding the need for protracted and expensive permit applications for thermal treatment equipment. The initial equipment designs used typically came from technology transfer sources. Asphalt manufacturing plants were converted to direct-fired LTTD systems, and conventional calciners were adapted for use as indirect-fired LTTD systems. Other innovative designs included hot sand recycle technology (initially developed for synfuels production from tar sand and oil shale), recycle sweep gas, travelling belts and batch-charged vacuum chambers, among others. These systems were used to treat soil contaminated with total petroleum hydrocarbons (TPH), polycyclic aromatic hydrocarbons (PAHs), pesticides, polychlorinated biphenyls (PCBs) and dioxin with varying degrees of success. Ultimately, performance and cost considerations established the suite of systems that are used for LTTD soil treatment applications today. This paper briefly reviews the develpoment of LTTD systems and summarizes the design, performance and cost characteristics of the equipment in use today. Designs reviewed include continuous feed direct-fired and indirect-fired equipment, batch feed systems and in-situ equipment. Performance is compared in terms of before-and-after contaminant levels in the soil and permissible emissions levels in the stack gas vented to the atmosphere. The review of air emissions standards includes a review of regulations in the U.S. and the European Union (EU). Key cost centers for the mobilization and operation of LTTD equipment are identified and compared for the different types of LTTD systems in use today. A work chart is provided for the selection of the optmum LTTD system for site-specific applications. LTTD technology continues to be a cornerstone technology for soil treatment in the U.S. and elsewhere. Examples of leading-edge LTTD technologies developed in the U.S. that are now being delivered locally in global projects are described.

• Korean Journal of Materials Research
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• v.27 no.1
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• pp.39-42
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• 2017

E-glass (electrical glass) fiber is the widely used as a reinforced composite material of PCBs (printed circuit boards). However, E-glass fiber is not stable because it has a dielectric constant of 6~7. On the other hand, D-glass (dielectric glass) fiber has a low dielectric constant of 3~4.5. Thus, it is adaptable for use as a reinforcing material of PCBs. In this study, we fabricated D-glass compositions with low dielectric constant, and measured the electrical and optical properties. In the glass composition, the boron content was changed from 9 to 31 wt%. To confirm the dependence of the dielectric constant on melting properties, D-glass with 22 wt% boron was melted at $1550^{\circ}C$ and $1650^{\circ}C$ for 2hrs. The glass melted at $1650^{\circ}C$ had a lower dielectric constant than the glass melted at $1550^{\circ}C$. Therefore, the D-glass with boron of 9~31 wt% was fabricated by melting at $1650^{\circ}C$ for 2hrs, and transparent clear glass was obtained. We identified the non-crystalline nature of the glass using an XRD (x-ray diffractometer) graph. The visible light transmittance values depending on the boron contents were measured and found to be 88.6 % ~ 82.5 %. Finally, the dielectric constant of the D-glass with 31 wt% boron was found to have decreased from 4.18 to 3.93.

• Korean Journal of Agricultural Science
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• v.19 no.2
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• pp.194-200
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• 1992

In order to use organic resource like a compost 44 samples of paper mill sludge were collected from each paper manufacturer. Some metal and PCBs(polychlorinated biphenyls) contents in/on sludge were investigated and metal contents of soil treated with kraft and paper board sludge were checked in contrast io the non-treated soil. The staple results were the same as followings. 1. Average contents of Pb in sludge ranged 14.5-25.7 ppm, and Al, Cd, Cu, Fe, Zn were similar concentration to unpolluted soil. Also, Cr and Hg were not detected from any sludge sample. 2. PCBs contents in sludge of kraft, paper board and news print paper were determined. Less than 10 ppb of $PCB_s$ contents were detected from kraft and paper board sludges, but a little more was found in sludge of news print paper. 3. Some metal contents in sludge treated soil were much similar to non-treated soil and the concentration also were ranged under the average of unpolluted natural soil. 4. From these results paper mill sludge seemed to be no harmful effects to soil.

• Korean Journal of Materials Research
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• v.12 no.9
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• pp.750-760
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• 2002

In this study, three solders, Sn-37Pb, Sn-3.5Ag, and Sn-3.8Ag-0.7Cu were screen printed on both electroless Ni/Au and OSP metal finished micro-via PCBs (Printed Circuit Boards). The interfacial reaction between PCB metal pad finish materials and solder materials, and its effects on the solder bump joint mechanical reliability were investigated. The lead free solders formed a large amount of intermetallic compounds (IMC) than Sn-37Pb on both electroless Ni/Au and OSP (Organic Solderabilty Preservatives) finished PCBs during solder reflows because of the higher Sn content and higher reflow temperature. For OSP finish, scallop-like $Cu_{6}$ /$Sn_{5}$ and planar $Cu_3$Sn intermetallic compounds (IMC) were formed, and fracture occurred 100% within the solder regardless of reflow numbers and solder materials. Bump shear strength of lead free solders showed higher value than that of Sn-37Pb solder, because lead free solders are usually harder than eutectic Sn-37Pb solder. For Ni/Au finish, polygonal shaped $Ni_3$$Sn_4$ IMC and P-rich Ni layer were formed, and a brittle fracture at the Ni-Sn IMC layer or the interface between Ni-Sn intermetallic and P-rich Ni layer was observed after several reflows. Therefore, bump shear strength values of the Ni/Au finish are relatively lower than those of OSP finish. Especially, spalled IMCs at Sn-3.5Ag interface was observed after several reflow times. And, for the Sn-3.8Ag-0.7Cu solder case, the ternary Sn-Ni-Cu IMCs were observed. As a result, it was found that OSP finished PCB was a better choice for solders on PCB in terms of flip chip mechanical reliability.