• Title/Summary/Keyword: patterned alignment layers

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Surface modification method for controlling liquid crystal alignment

  • Kim, Hak-Rin;Song, June-Yong;Bae, Kwang-Soo;Kim, Jae-Hoon
    • 한국정보디스플레이학회:학술대회논문집
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    • 2007.08a
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    • pp.299-302
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    • 2007
  • We propose a soft-lithographic patterning method for producing a multi-domain liquid crystal (LC) alignment. The LC alignment polyimide layers are periodically patterned in the pixel boundaries by a micromolding-in-capillaries method. In our structure, the initially homeotropic LC orientations in the pixel areas are changed to axially symmetric LC domains due to the symmetric pretilt of LC molecules on the pixel boundaries.

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Symmetric-viewing liquid crystal display with alternating alignment layers in an inverse-twisted-nematic configuration

  • Na, Jun-Hee;Li, Hongmei;Park, Seung-Chul;Lee, Sin-Doo
    • Journal of Information Display
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    • v.12 no.4
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    • pp.191-194
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    • 2011
  • A symmetric-viewing inverse-twisted-nematic (ITN) liquid crystal display (LCD) with alternating alignment layers was developed using a stamping-assisted rubbing (SAR) technique. A patterned layer of a fluorinated acrylate polymer was transferred onto the first rubbed vertical-alignment layer prepared on a substrate by stamping. The fluorinated acrylate polymer provided a protective layer covering the first rubbed alignment layer during the second rubbing process, which promoted the vertical alignment of the LC molecules. The LC cell in the ITN geometry with two orthogonally rubbed alignment layers showed symmetric-viewing characteristics with fourfold symmetry. The SAR technique was shown to be a mask-free alignment method of producing multidomains for symmetric-viewing LCDs.

Patterning of liquid crystal alignment layers using selective dewetting process in a thermoplastic polymer film

  • Kim, Hak-Rin;Shin, Min-Soo;Lee, You-Jin;Kim, Jae-Hoon
    • 한국정보디스플레이학회:학술대회논문집
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    • 2006.08a
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    • pp.1719-1722
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    • 2006
  • We proposed a soft-lithographic method for aligning a liquid crystal (LC) in patterned azimuthal orientations. It is demonstrated that a thermoplastic polystyrene layer is patterned from a thermally stable polyimide layer via pressure-assisted capillary force lithography, which provides multidirectional LC alignment condition simply followed by a unidirectional rubbing process.

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Liquid Crystal Alignment on Patterned Micro-grooved Polyimide Surfaces

  • Chiou, D.R.;Chen, L.J.;Lee, C.D.;Liu, H.M.
    • 한국정보디스플레이학회:학술대회논문집
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    • 2005.07a
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    • pp.774-777
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    • 2005
  • In this work, a soft embossing method is proposed to fabricate microgrooves on polyimide surfaces. Apply these resulting patterned micro-grooved polyimide surfaces as the liquid crystal alignment layers. The director of liquid crystal molecules aligns perfectly along the direction of microgrooves.

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Micro-Contact Printing Method for Patterning Liquid Crystal Alignment Layers

  • Jung, Jong-Wook;Kim, Hak-Rim;Lee, You-Jin;Kim, Jae-Hoon
    • Journal of Information Display
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    • v.7 no.2
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    • pp.12-15
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    • 2006
  • We propose a patterning method of liquid crystal (LC) alignment layer for producing multi-domain LC structures. By controlling thermal conditions during micro-contact printing procedures and facilitating wetting properties of patterning materials, patterned LC orientation can be easily obtained on a bare ITO surface or other polymer films. The newly proposed patterning method is expected to be a very useful tool for fabricating multi-domain LC structures to enhance or design electro-optic properties of LC-based devices.

Advanced LCD modes through surface modification using reactive mesogen mixed with alignment layers

  • Lee, You-Jin;Kim, Young-Ki;Jo, Soo-In;Yu, Chang-Jae;Kim, Jae-Hoon
    • 한국정보디스플레이학회:학술대회논문집
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    • 2009.10a
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    • pp.91-94
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    • 2009
  • We propose advanced liquid crystal display (LCD) modes through surface modification using UV curable reactive mesogen (RM) mixed with alignment layers. The LC directors on the modified alignment layer are controlled and memorized by the polymerized RMs under an applied voltage. Using the method proposed here, we can improve the response time and viewing angle characteristics through surface controlled patterned vertical alignment (SC-PVA) mode and 8-domains PVA mode, respectively. Also, we found that the method can be applicable to fabricate multi-domain structures using multiple UV exposure as same as conventional UV alignment method.

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Stamping-assisted Fabrication Technique of the Bidirectional Alignment Layer for Wide-Viewing Twisted-Nematic Liquid Crystal Displays

  • Koo, Kyung-Mo;Na, Jun-Hee;Kim, Yeun-Tae;Li, Hongmei;Lee, Sin-Doo
    • Journal of Information Display
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    • v.10 no.4
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    • pp.180-183
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    • 2009
  • A stamping-assisted rubbing technique for generating bidirectional alignment in the fabrication of wide-viewing twistednematic (TN) liquid crystal displays (LCDs) was developed. A patterned layer of a fluorinated acrylate polymer was transferred onto the first rubbed alignment layer prepared on a substrate by stamping. The fluorinated acrylate polymer provides a protective layer that covers the first alignment layer during the second rubbing process to facilitate the bidirectional alignment of the LC molecules. The LC cell in the twisted geometry with two bidirectional-alignment layers showed stable electro-optic properties and wide-viewing characteristics. The stamping-assisted rubbing technique serves as a mask-free alignment method of producing multidomains for wide-viewing LCDs.

Fabrication of a Bottom Electrode for a Nano-scale Beam Resonator Using Backside Exposure with a Self-aligned Metal Mask

  • Lee, Yong-Seok;Jang, Yun-Ho;Bang, Yong-Seung;Kim, Jung-Mu;Kim, Jong-Man;Kim, Yong-Kweon
    • Journal of Electrical Engineering and Technology
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    • v.4 no.4
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    • pp.546-551
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    • 2009
  • In this paper, we describe a self-aligned fabrication method for a nano-patterned bottom electrode using flood exposure from the backside. Misalignments between layers could cause the final devices to fail after the fabrication of the nano-scale bottom electrodes. A self-alignment was exploited to embed the bottom electrode inside the glass substrate. Aluminum patterns act as a dry etching mask to fabricate glass trenches as well as a self-aligned photomask during the flood exposure from the backside. The patterned photoresist (PR) has a negative sidewall slope using the flood exposure. The sidewall slopes of the glass trench and the patterned PR were $54.00^{\circ}$ and $63.47^{\circ}$, respectively. The negative sidewall enables an embedment of a gold layer inside $0.7{\mu}m$ wide glass trenches. Gold residues on the trench edges were removed by the additional flood exposure with wet etching. The sidewall slopes of the patterned PR are related to the slopes of the glass trenches. Nano-scale bottom electrodes inside the glass trenches will be used in beam resonators operating at high resonant frequencies.

Fabrication of Laminated Multi-layer Flexible Substrate with Cu/Sn Via (Cu/Sn 비아를 적용한 일괄적층 방법에 의한 다층연성기판의 제조)

  • Lee H. J.;Yu Jin
    • Journal of the Microelectronics and Packaging Society
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    • v.11 no.4 s.33
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    • pp.1-5
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    • 2004
  • A multi-layer flexible substrate is composed of copper(Cu)/polyimide that are known as good electrical conductivity, and low dielectric constant, respectively. In this study. conductor line of $5{\mu}m$-pitch was successfully fabricated without non-uniform pattern shape by electroplating copper and coating polyimide on patterned stainless steel. For multi-layer flexible substrate, via holes were drilled by UV laser and filled with electroplating copper and tin. And then, the PI layer with vias and conductor lines was stripped from stainless steel substrate. The PI layers were laminated at once with careful alignment between layers. Solid state reaction between tin and copper during lamination formed the intermetallic compounds of $Cu_6Sn_5$($\eta$-phase) and $Cu_3Sn$($\epsilon$-Phase) and achieved a complete inter-connection by vertically positioning the plugged via holes on via pad. The via formation process has several advantages; such as better electrical property and lower cost than V type via and paste via.

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