• Proceedings of the Korean Society of Propulsion Engineers Conference
• /
• 2008.03a
• /
• pp.45-52
• /
• 2008

In order to investigate the initiation and propagation processes of a spherical detonation wave induced by direct initiation, numerical simulations were carried out using two-dimensional compressible Euler equations with an axisymmetric assumption and a one-step reaction model based on Arrhenius kinetics with various levels of ignition energy. By varying the amount of ignition energy, three typical initiation behaviors, which were subcritical, supercritical and critical regimes, were observed. Then, the ignition energy of more than $137.5{\times}10^6$ in non-dimensional value was required for initiating a spherical detonation wave, and the minimum ignition energy(i.e., critical energy) was less than that of the one-dimensional simulation reported by a previous numerical work. When the ignition energy was less than the critical energy, the blast wave generated from an ignition source continued to attenuate due to the separation of the blast wave and a reaction front. Therefore, detonation was not initiated in the subcrtical regime. When the ignition energy was more than the minimum initiation energy, the blast wave developed into a multiheaded detonation wave propagating spherically at CJ velocity, and then a cellular pattern radiated regularly out from the ignition center in the supercritical regime. The influence on ignition energy was observed in the cell width near the ignition center, but the cell width on the fully developed detonation remained constant during the expanding of detonation wave due to the consecutive formation of new triple points, regardless of ignition energy. When the ignition energy was equal to the critical energy, the decoupling of the blast wave and a reaction front appeared, as occurred in the subcrtical regime. After that, the detonation bubble induced by the local explosion behind the blast wave expanded and developed into the multiheaded detonation wave in the critical regime. Although few triple points were observed in the vicinity of the ignition core, the regularly located cellular pattern was generated after the onset of the multiheaded detonation. Then, the average cell width on the fully developed detonation was almost to that in the supercritical regime. These numerical results qualitatively agreed with previous experimental works regarding the initiation and propagation processes.

• Journal of Advanced Navigation Technology
• /
• v.25 no.5
• /
• pp.384-389
• /
• 2021

An optimal ground station (GS) antenna pattern design method for network-based UAV command and control communication systems considering complexity and performance is presented. The GS antenna consists of multiple side sectors and one upward sector. The antenna gain for each vertical/horizontal angle of the GS antenna according to the change of antenna design parameters such as the number of sectors, horizontal and vertical beam-width, and tilt-angle is modeled, and the effect of the parameter changes on the signal-to-noise ratio (SNR) distribution in the virtual three-dimensional space is analyzed. It is observed that the tilt-angle of the side sectors has the greatest effect on the performance, and the longer the distance between GSs, the higher the maximum altitude and the smaller the number of side sectors, the tilt-angle should be lower. In addition, it is observed that the wider vertical beam-width of the side sector is advantageous in maximizing the lowest SNR, but narrow vertical beam-width is advantageous in maximizing the average SNR.

• Journal of the Semiconductor & Display Technology
• /
• v.22 no.2
• /
• pp.30-34
• /
• 2023

Since dishing in the CMP process is a major factor that hinders the uniformity of the semiconductor thin film, many studies have focused this issue to improve the non-uniformity of the film due to dishing. In the metal layer, the dishing mainly occurs in the central part of the metal due to a difference in a selection ratio between the metal and the dielectric, thereby generating a step on the surface of the metal layer. Factors that cause dishing include the shape of the thin film, the chemical reaction of the slurry, thermal deformation, and the rotational speed of the pad and head, and dishing occurs due to complex interactions between them. This study analyzed the stress generated on the metal layer surface in the CMP process using ANSYS software, a commercial structure analysis program. The stress caused by the vertical load applied from the pad was analyzed by changing the area density and line width of the dummy metal. As a result of the analysis, the stress in the active region decreased as the pattern density and line width of the dummy metal increased, and it was verified that it was valid compared with the previous study that studied the dishing according to the dummy pattern density and line width of the metal layer. In conclusion, it was confirmed that there is a relationship between dishing and normal stress.

• The Research Journal of the Costume Culture
• /
• v.31 no.5
• /
• pp.640-650
• /
• 2023

This study aimed to suggest a suitable collar pattern by visually evaluating the appearance of the amount of collar drape by the starting position of the lapel line of a double-breasted tailored jacket using a 3d virtual fitting program. It created an avatar based on the mean size of women in their 20s (the 8th Size Korea) using clo network (double fastening: 10cm, collar width: 4.5cm, collar stand: 3cm, and lapel width: 8.5cm). The starting of the lapel twist line was waistline level, the 1/2 level of bustline and waistline, or bustline level, and collar laying amount was 4.5, 5.5, 6.5, or 7.5cm. It was evaluated by garment construction experts using 5, 6, and 4 items on the front, sides, and back, respectively. Descriptive statistics, F-test, Duncan-test, and reliability analysis were conducted using SPSS 22. When collar laying amount was 6.5cm, it was best rated regardless of the starting point. Under waist line, when collar laying amount was 6.5cm, it was best rated regardless of the starting point. When collar laying amount was large, the collar's outline length increased, resulting in unnecessary wrinkles from the neckline to the lapel, affecting the overall collar appearance. When collar laying amount was the smallest, the collar was lifted and the width was narrowed, exposing the seam connecting the collar and neckline. The length of the collar's outline varied depending on collar laying amount, which was important to make the outline sit comfortably on the body.

• Journal of the Korean Home Economics Association
• /
• v.24 no.2
• /
• pp.1-11
• /
• 1986

The subject, in the blouses that sleeve caps and sleeve lengthes are different from, did sensory test by right arm movement and both arms movement. This sensory test which is used in fabric good, is Shef's. RESULTS : 1) The ease of bust size is very significant by cap height, at 5%, 1% level by sleeve length. 2) The front area of arm hole is affected by cap height, sleeve length movements more than the back and the under area of arm hole are 3) Sleeve width is affected by cap height, sleeve length both arms movement. That is, they should be designed according to the use because they affect the ease of blouse very much. Especially bust size should be considered with sleeve pattern because the ease bust becomes different with sleeve pattern.

• Design & Manufacturing
• /
• v.11 no.1
• /
• pp.14-18
• /
• 2017

Recently, the injection-molded products are lighter, and thinner than ever. In this work, Injection molding simulation was conducted to analysis the filling pattern imbalance in high speed injection molding process for thin-wall injection component, 8 inches LGP. Numerical analysis shows that shear heated polymer near the side wall causes filling imbalance between center and side of cavity. Short shot experiments were conducted and compared with simulation results. Filling imbalance ratio showed a tendency to increase for wider fan gate.

• Proceedings of the IEEK Conference
• /
• 1998.06a
• /
• pp.465-468
• /
• 1998

For porous silicon layer to be used as active layer in various devices, it is necessary to be formed locally along with a designed pattern on the wafer. However, there is still no suitable masking layer to withstand against the high concentration of HF for a time of some minutes up to some hours during the anodic process effectively. In this work, we investigated the property of selectivity between p$^{+}$ and n layers to form localized porous silicon even without a mask by the difference of the anodic I-V characteristics on the doping level and doping type. The width of the pattern made in the sample was 2mm, and the formed porous silicon layer was observed by SEM to see the morphology on the cross section below the surface. As the results, it was found that the selectivity was reasonable for the pattern size over 100.mu.m.m.

• Journal of the Microelectronics and Packaging Society
• /
• v.18 no.4
• /
• pp.63-70
• /
• 2011

Anorthite forming glass frits in amounts up to 25 vol% of the silver powder were added to improve the adhesion between the conductor pattern formed by thick film photoimageable process and the low temperature co-fired ceramics (LTCC) substrate. The sheet resistance of the conductor pattern was raised from 0.13 ${\Omega}/{\square}$ to 2.25 ${\Omega}/{\square}$ as the volume percentage of glass frit increased up to 25 vol%. The adhesion strength was improved with this glass frit increase, but it decreased when the glass content exceeded 20 vol% which are possibly attributed to the liquid pool effect and the reduced fracture toughness in the interface between conductor and LTCC layer. The shrinkage of the width of the conductor pattern decreased with the addition of glass contents.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.16 no.12
• /
• pp.1097-1102
• /
• 2003

In this paper, we used only PR as etching mask, while it used usually Cr/AU as etching mask, and in order to fabricate a photosensor has the increased sensitivity, we investigated on the sensitivity of general type and p-i-n type diode. we designed microchannel size width max 10um, min 5um depth max 10um, reservoir size max 100um, min 2mm. Fabrication of microfluidic devices in glass substrate by glass wet etching methods and glass to glass fusion bonding. The p-i-n diode has higher sensitivity than photodiode, Considering these results, we fabricated p-i-n diodes on the high resistive(4㏀$.$cm) wafer into rectangle and finger pattern and compared internal resistance of each pattern. The internal resistance of pin diode can be decreased by the application of finger pattern has parallel resistance structure from 571Ω to 393Ω.

• Journal of the Korean Society for Precision Engineering
• /
• v.29 no.6
• /
• pp.686-692
• /
• 2012

Solid free-form fabrication (SFF) technology was developed to fabricate three-dimensional (3D) scaffolds for tissue engineering (TE) applications. In this study, we developed a polymer deposition system (PDS) and created 3D microstructures using a bioresorbable polycaprolactone (PCL) polymer. Fabrication of 3D scaffolds by PDS requires a combination of several devices, including a heating system, dispenser, and motion controller. The system can process a polymer with extremely high precision by using a 200 ${\mu}m$ nozzle. Based on scanning electron microscope (SEM) images, both the line width and the piled line height were fine and uniform. Several 3D micro-structures, including the ANU pattern (a pattern named after Andong National University), $45^{\circ}$ pattern square, frame, cylindrical, triangular, cross-shaped, and hexagon, have been fabricated using the polymer deposition system.