• 한국진공학회지
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• 제4권S1호
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• pp.190-195
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• 1995

The feature scale model for selective chemical vapor deopsition process was proposed and the simulation was performed to study the selectivity and uniformity of deposited thin film using Monte Carlo method and string algorithm. The effect of model parameters such as sticking coefficient, aspect ratio, and surface diffusion coefficient on the deposited thin film pattern was improved for lower sticking coefficient and higher aspect ratio. It was revealed that the selectivity loss ascrives to the surface diffusion. Different values of sticking coefficients on Si and on SiO2 surface greatly influenced the deopsited thin film profile. In addition, as the lateral wall angle decreased, the selectively deposited film had improved uniformity except the vicinity of trench wall. The optimum eondition for the most flat selective film deposition pattern is the case with low sticking coefficient and slightly increased surface diffusion coefficient.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1998년도 추계학술대회 논문집 학회본부 C
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• pp.770-772
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• 1998

The highest etch rate of Pt film was obtained at 10% $Cl_2$/90% Ar gas mixing ratio in our previous investigation. However, the problems such as the etch residues(fence) remained on the pattern sidewall, low selectivity to oxide as mask and low etch slope were presented. In this paper, the etching by additive $O_2$ gas to 10% $Cl_2$/90% Ar gas base was examined. As a result, the fence-free pattern and high etch slope was observed and the selectivity to oxide increased without decreasing of the etch rate. And the reasons for this phenomenon was investigated by XPS(x-ray photoelectron spectroscopy) surface analysis and plasma characteristic.

• 한국전기전자재료학회논문지
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• 제11권4호
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• pp.261-266
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• 1998

In developing the high density memory device, the etching of fine pattern is becoming increasingly important. Therefore, definition of ultra fine line and space pattern and minimization of damage and contamination are essential process. Also, the high density plasma in low operating pressure is necessary. The candidates of high density plasma sources are electron cyclotron resonance plasma, helicon wave plasma, helical resonator, and inductively coupled plasma. In this study, planar type magnetized inductively coupled plasma etcher has been built. The density and temperature of Ar plasma are measured as a function of rf power, flow rate, external magnetic field, and pressure. The oxide etch rate and selectivity to polysilicon are measured as the above mentioned conditions and self-bias voltage.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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• pp.113-114
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• 2005

Sufficient removal rate with adequate selectivity to realize the pattern mask of tetra-ethyl ortho-silicate (TEOS) film for the vertical sidewall angle were obtained by chemical mechanical polishing (CMP) with commercial silica slurry as a function of pH variation. The changes of X-ray diffraction pattern and dielectric constant by CMP process were negligible.

• 한국수산과학회지
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• 제37권6호
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• pp.469-477
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• 2004

This study examined distributional patterns of Asterias amurensis in Tongyeong, the central South Sea of Korea. The density of the sea star was estimated at 10 chosen sites in the inner and the outer parts of the Tongyeong coast from December 2000. The mean density of the species in this area was $2.4ind./m^{2}$. The seasonal surveys conducted at 3 arbitrary chosen sites (i.e., sea cage, reef and soft sediment) also showed that the abundance of the species at the sea cage site $(density:\;3.6\;ind./m^{2};\;biomass:\;250.7\;gwwt/m^{2})$ was significantly higher than at the reef site $(density:\;1.7\;ind./m^{2};\;biomass:\;63.5\;gwwt/m^{2})$ and the soft sediment site $(density:\;0.4\;ind./m^{2};\;biomass:\;18.9\;gwwt/m^{2})$. Densities were higher at sea cages areas than at reefs and soft bottom sites. At sea cage site, A. amurensis population exhibited a strong aggregated distributional pattern. In contrast, at reef and soft bottom sites, A. amurensis population showed a random distributional pattern. The spatial difference in prey species and its abundance was the primary factor determining the spatial heterogeneity of the sea star in its behavior characteristics. Experiments on the feeding preference indicated that A. amurensis had a strong selectivity on its prey, but this selectivity varied between populations living in different sites. In particular, A. amurensis populations at the reef site showed a strong selectivity on various sessile and mobile animals living in reef areas, suggesting that these animal groups may play a role as "windows for the survival of A. amurensis". These results suggest that the distribution of A. amurensis in Tongyeong is closely associated with abundance of prey species and the bottom composition.

• 한국안광학회지
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• 제18권4호
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• pp.533-540
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• 2013

목적: 본 연구에서는 발생 중[태어난 지 5일(P5), 10일(P10)] 마우스 망막의 ON-OFF 방향특이성 신경절세포 수상돌기 상에서 NMDA R1 수용체의 시냅스 패턴을 연구하고자 하였다. 방법: ON-OFF 방향특이성 신경절세포는 Lucifer yellow를 주사하여 형태학적 특징으로 동정하였다. 이극세포로부터의 글루타메이트의 흥분성 유입을 확인하기 위해 membrane traffic motor 단백질 마커인 kinesin을 이용하였다. 결과: 본 연구에서 P5, P10의 ON-OFF 방향특이성 신경절세포를 동정할 수 있었으며, NMDA R1의 면역반응반점은 내망상층에서 강하게 나타났다. ON-OFF 방향특이성 신경절세포의 수상돌기상의 수용체의 분포패턴에서 방향특이성을 예측할 수 있는 어떠한 비대칭성도 발견하지 못하였다. 결론: 이극세포로부터의 글루타메이트성 자극유입은 P5, P10 단계에서 모두 균형적으로 유입되며, 방향특이성은 NMDA R1 수용체의 특이적인 패턴에 있지 않음을 밝혔다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 추계학술대회 논문집
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• pp.525-526
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• 2007

Over-polishing is required to completely remove the material of top surface across whole wafer, in spite of a local dishing problem. This paper introduces the two-step CMP process using protective layer and high selectivity slurry, to reduce dishing amount and variation. The 30nm thick protective oxide layer was deposited on the pattern, and then polished with low selectivity slurry to partially remove the projected area while suppressing the removal rate of the recessed area. After the first step CMP process, high selectivity slurry was used to minimize the dishing amount and variation in pattern structure. Experimental result shows that two-step CMP process can be successfully applicable to reduce the dishing defect generated in over-polishing.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제48권6호
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• pp.451-455
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• 1999

The highest etch rate of Pt film was obtained at 10% $Cl_2$/90% Ar gas mixing ratio in our previous investigation. However, the problems such as the etch residues(fence) remained on the pattern sidewall, low selectivity to oxide as mask and low etch slope were presented. In this paper, the etching by additive $O_2$ gas to 10% $Cl_2$/90% Ar gas base was examined. As a result, the fence-free pattern and higher etch slope as about 60$^{\circ}$was observed and the selectivity to oxide increased to 2.4 without decreasing of the etch rate $1500{\AA}$/min. XPS surface analysis proved that a only little $O_2$ gas removes the Pt-CI compounds as residues on the etched surface.

• 한국전기전자재료학회논문지
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• 제21권3호
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• pp.203-207
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• 2008

Chemical mechanical polishing (CMP) allows the planarization of wafers with two or more materials. There are many elements such as slurry, polishing pad, process parameters and conditioning in CMP process. Especially, polishing pad is considered as one of the most important consumables because this affects its performances such as WIWNU(within wafer non-uniformity) and MRR(material removal rate). In polishing pad, grooves and pores on its surface affect distribution of slurry, flow and profile of MRR on wafer. A subject of this investigation is to apply CMP for planarization of shallow trench isolation structure using microstructure(MS) pad. MS pad is designed to have uniform structure on its surface and manufactured by micro-molding technology. And then STI CMP performances such as pattern selectivity, erosion and comer rounding are evaluated.

• 한국환경과학회지
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• 제18권6호
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• pp.595-601
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• 2009

The effects of the cation-to-anion resin ratio and bed depth on ion exchange performance of mixed-bed were studied at ultralow solution concentration. Breakthrough curves were experimentally obtained for NaCI solution as functions of resin ratio and bed depth. The bed depth affects the pattern of the sodium breakthrough curve but not the chloride breakthrough curve in beds because of the selectivity difference. Resin selectivity determines the shape of breakthrough curves, Some sodium and chloride breakthrough curves crossed at a point as a function of resin ratio. The lower cation-to-anion resin ratio showed the higher effluent concentration or treated volume of the crossover point regardless of the total resin weight.