• Proceedings of the Optical Society of Korea Conference
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• 2003.07a
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• pp.230-231
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• 2003

SOI (Silicon On insulator)는 SiO$_2$와 같은 절연체 위에 실리콘 (Si) 박막층이 놓여있는 구조로서 전자나 광소자들이 실리콘 박막층 위에 만들어진다. SOI의 기본적인 생각은 기생 정전용량 (parasitic capacitance)을 감소시킴으로서 소자의 스위칭 속도를 더 빠르게 하는 것이다. 최근에 초고속 광소자와 단위 광소자들의 집적을 위해 실리콘 이외의 GaAs, InP, SiC 등의 반도체 박막을 절연층 위에 만드는 연구가 많이 진행되고있다. (중략)

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.19 no.4
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• pp.71-78
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• 2005

This paper proposes a novel multi-level energy recovery sustaining driver for AC PDP(Plasma Display Panel), which solves the problems of the conventional multi-level sustaining driver. While the conventional circuit improves the voltage md current stress of the switching elements in Weber circuit not only there are parasitic resonant currents between resonant inductors and parasitic capacitance and hard switching, but also the changing period between 0 and sustain voltage is too long. Comparing the proposed circuit with the conventional circuit, the number of components are reduced and the parasitic resonant currents in resonant inductors are eliminated Moreover the hard switching problem is solved by using CIM(Current Injection Method) and the operating frequency will be high as much as possible by removing Vs/2 sustain period. And the circuit operations of the proposed circuit are analyzed for each mode and the validity is verified by the simulations using PSpice program.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.36D no.5
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• pp.44-53
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• 1999

This paper are reported a methodology and application for extracting parasitic capacitances in a multi-level interconnect semiconductor structure by a numerical technique. To calculate the parasitic capacitances between the interconnect lines, we employed finite element method (FEM) and calculated the distrubution of electric potential in the inter-metal layer dielecric(ILD) by solving the Laplace equation. The three-dimensional multi-level interconnect structure is generated directly from two-dimensional mask layout data by specifying process sequences and dimension. An exemplary structure comprising two metal lines with a dimension of 8.0$\times$8.0$\times$5.0$\mu\textrm{m}^3/TEX>, which is embedded in three dielectric layer, was simulated to extract the parasitic capacitances. In this calculation, 1960 nodes with 8892 tetrahedra were used in ULTRA SPARC 1 workstation. The total CPU time for the simulation was 28 seconds, while the memory size of 4.4MB was required.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.131-131
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• 2009

Silicon Carbide (SiC) is a material with a wide bandgap (3.26eV), a high critical electric field (~2.3MV/cm), a and a high bulk electron mobility ($\sim900cm^2/Vs$). These electronic properties allow high breakdown voltage, high-speed switching capability, and high temperature operation compared to Si devices. Although various SiC DMOSFET structures have been reported so far for optimizing performances, the effect of channel dimension on the switching performance of SiC DMOSFETs has not been extensively examined. This paper studies different channel dimensons ($L_{CH}$ : $0.5{\mu}m$, $1\;{\mu}m$, $1.5\;{\mu}m$) and their effect on the the device transient characteristics. The key design parameters for SiC DMOSFETs have been optimized and a physics-based two-dimensional (2-D) mixed device and circuit simulator by Silvaco Inc. has been used to understand the relationship. with the switching characteristics. To investigate transient characteristic of the device, mixed-mode simulation has been performed, where the solution of the basic transport equations for the 2-D device structures is directly embedded into the solution procedure for the circuit equations. We observe an increase in the turn-on and turn-off time with increasing the channel length. The switching time in 4H-SiC DMOSFETs have been found to be seriously affected by the various intrinsic parasitic components, such as gate-source capacitance and channel resistance. The intrinsic parasitic components relate to the delay time required for the carrier transit from source to drain. Therefore, improvement of switching speed in 4H-SiC DMOSFETs is essential to reduce the gate-source capacitance and channel resistance.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.10 no.5
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• pp.455-461
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• 2017

In this paper, a local DL (Data Line) sensing method with smaller parasitic capacitance replacing the previous distributed DB sensing method with large parasitic capacitance is proposed to reduce the time to transfer BL (Bit Line) voltage to DL in the read mode. A new BL switching circuit turning on NMOS switches faster is also proposed. Furthermore, the access time is reduced to 35.63ns from 40ns in the read mode and thus meets the requirement since BL node voltage is clamped at 0.6V by a DL clamping circuit instead of precharging the node to VDD-VT and a differential amplifier are used. The layout size of the designed 512Kb EEPROM memory IP based on a $0.13{\mu}m$ BCD is $923.4{\mu}m{\times}1150.96{\mu}m$ ($=1.063mm^2$).

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.9
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• pp.21-25
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• 2008

In this study, to maximize RF performance of MOSFETs, $f_T$ and $f_{max}$ dependent data on $W_u$ are measured and newly analyzed by extracting small-signal model parameters. From the physical analysis results, it is found that a peak value of $f_T$ is generated by $W_u$-independent parasitic gate-bulk capacitance at narrow $W_u$ and the wide width effect of reducing the increasing rate of transconductance at wide $W_u$. In addition, it is revealed that a maximum value of $f_{max}$ is caused by the non-quasi-static effect that the gate resistance is greatly reduced at narrow $W_u$ and becomes constant at wide $W_u$.

• Journal of Sensor Science and Technology
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• v.30 no.6
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• pp.436-440
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• 2021

The impact of the gate length (L_g) on the DC and high-frequency characteristics of indium-rich In_0.8Ga_0.2As channel high-electron mobility transistors (HEMTs) on a 3-inch InP substrate was inverstigated. HEMTs with a source-to-drain spacing (L_SD) of 0.8 ㎛ with different values of L_g ranging from 1 ㎛ to 19 nm were fabricated, and their DC and RF responses were measured and analyzed in detail. In addition, a T-shaped gate with a gate stem height as high as 200 nm was utilized to minimize the parasitic gate capacitance during device fabrication. The threshold voltage (V_T) roll-off behavior against L_g was observed clearly, and the maximum transconductance (g_{m_max}) improved as L_g scaled down to 19 nm. In particular, the device with an L_g of 19 nm with an L_SD of 0.8 mm exhibited an excellent combination of DC and RF characteristics, such as a g_{m_max} of 2.5 mS/㎛, On resistance (R_ON) of 261 Ω·㎛, current-gain cutoff frequency (f_T) of 738 GHz, and maximum oscillation frequency (f_max) of 492 GHz. The results indicate that the reduction of L_g to 19 nm improves the DC and RF characteristics of InGaAs HEMTs, and a possible increase in the parasitic capacitance component, associated with T-shap, remains negligible in the device architecture.

• Tribology and Lubricants
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• v.40 no.4
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• pp.111-117
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• 2024

Due to global CO₂ emission reductions and fuel efficiency regulations, the trend toward transitioning from internal combustion engine vehicles to electric vehicles (EVs) has accelerated. Consequently, the problem of EV failures has become a focal point of active research. The parasitic capacitance generated during motor-shaft rotation induces voltage that deteriorates the raceway and ball surfaces of bearings, causing electrical damage in EVs. Despite numerous attempts to address this issue, most studies have been conducted under high viscosity lubricant and low load conditions. However, due to factors such as high-speed operation, rapid acceleration and deceleration, motor heating, and motor system-decelerator integration, current EV applications have shown diminished stability in lubrication films of motor bearings, thereby leveraging the investigation to address the risk of electrical damage. This study investigates the electrical damage to rolling bearing elements in EV motor drive systems. The experimental analysis focuses on the effects of electric currents and operational loads on bearing integrity. A test rig is designed to generate high-rate voltage specific to a motor system's parasitic capacitance, and bearing samples are exposed to these currents for specified durations. Component evaluation involves visual inspections and vibration measurements. In addition, a predictive model for electrical failure is developed based on accumulated data, which demonstrates the ability to predict the likelihood of electrical failure relative to the duration and intensity of current exposure. This in turn reduces uncertainties in practical applications regarding electrical erosion modes.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.43 no.4 s.346
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• pp.16-22
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• 2006

Gigabit transimpedance amplifiers are realihzed in submicron CMOS technologies for Gigabit Ethernet applications. The regulated cascode technique is exploited to enhance the bandwidth and noise performance simultaneously so that it can isolate the large input parasitic capacitance including photodiode capacitance from the determination of the bandwidth. The 1.25Gb/s TIA implemented in a 0.6um CMOS technology shows the measured results of 58dBohm transimpedance gain, 950MHz bandwidth for a 0.5pF photodiode capacitance, 6.3pA/sqrt(Hz) average noise current spectral density, and 85mW power dissipation from a single 5V supply. In addition, a 10Gb/s TIA is realized in a 0.18um CMOS incorporating the RGC input and the inductive peaking techniques. It provides 59.4dBohm transimpedance gain, 8GHz bandwidth for a 0.25pF photodiode capacitance, 20pA/sqrt(Hz) noise current spectral density, and 14mW power consumption for a single 1.8V supply.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.38 no.1
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• pp.23-29
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• 2001

The effects of Ti-silicide process on the electrical properties of an analog polysilicon capacitor were investigated. To improve the linearity with the applied voltage both electrodes, which are polysilicon in our device, should have almost same material properties. The doping concentrations of both electrodes need to be high and to have the similar levels. Voltage Coefficient of Capacitance (VCC) is one of the properties to represent the linearity of analog capacitor, and it is related with the material and the structure of capacitor. In this study, it was possible to obtain the lower VCC by siliciding the polysilicon areas of capacitor. This is due to the parasitic capacitance at the interfaces between silicide and polysilicons, resulting the decrease of unit capacitance. However, we assumed the creation of positive oxide charge near the lower polysilicon electrode during the silicide process.