• Journal of agriculture & life science
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• v.44 no.6
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• pp.9-14
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• 2010

The present study was performed to identify the possibility of the disused paper-sludge to substitute an substrate for nursery plants. Tosilee substrate as control, paper-sludge and tosilee substrate (1:1, v:v), and paper sludge substate were used in this experiment. After harvesting tomato seedlings, there were no significant differences in growth parameters such as plant height, root length, and fresh and dry weight grown for tosilee substrate, and paper-sludge and tosilee mixture substrate. However, the seedlings grown for paper-sludge substrate alone were extremely depressed. These growth pattern was followed by cucumber seedlings. As the result of this experiment, we suggest that it must need to stabilize the pH and EC, and Zn concentration in paper-sludge for increasing its material for substrate.

• Proceedings of the Korea Society for Industrial Systems Conference
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• 2002.06a
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• pp.195-199
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• 2002

This paper describes the effect of substrate back bias of CMOS Inverter. When the substrate back bias applied in body, the MOS transistor threshold voltage increased and drain saturation current decreased. The back gate reverse bias or substrate bias has been widely utilized and the following advantage has suppressing subthreshold leakage, lowering parasitic junction capacitance, preventing latch up or parasitic bipolar transistor, etc. When the reverse voltage applied substrate, this paper stimulated the propagation delay time CMOS inverter.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.504-505
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• 2005

In this report, we demonstrate a high performance polymer thin-film transistor fabricated on a paper substrate. As a water barrier layer, parylene was coated on the paper substrate by using vacuum deposition process. Using poly (3-hexylthiophene) as an active layer, a polymer thin-film transistor with field-effect of up to 0.086 $cm^2/V{\cdot}s$ and on/off ratio of $10^4$ was achieved. The fabrication of polymer thin-film transistor built on a cheap paper substrate is expected to open a channel for future applications in flexible and disposable electronics with extremely low-cost.

• Journal of the Semiconductor & Display Technology
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• v.19 no.4
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• pp.116-120
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• 2020

In this paper, we developed an electrochemical glucose sensor strip using a paper substrate. The paper glucose sensor strip is eco-friendly because it uses paper as a substrate, and it has the advantage that it can be manufactured only with four printing, drying and cutting processes. The paper glucose sensor is significantly simplified by the production process than the conventional glucose sensors because the production of only four printing on the paper substrate. In this paper, eco-friendly tracing paper was used to develop a paper glucose sensor strip, and screen-printing technology was used to form a carbon/silver electrode, insulating layer and glucose oxidase(GOD) layer. The developed paper glucose sensor strip has a flat structure with a size of 30 × 4.6 ㎟, and blood injection is a type of direct contact with the exposed enzyme layer above the strip. In this paper, the performance of paper glucose sensor strips was evaluated by analyzing the cyclic voltammetry(CV) and chronoamperometry(CA) characteristics.

• Journal of electromagnetic engineering and science
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• v.11 no.3
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• pp.201-206
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• 2011

This paper presents a miniaturized epsilon negative (ENG) zeroth-order resonance (ZOR) patch antenna with an improved bandwidth. The miniaturization and the broad bandwidth of the ENG ZOR patch antenna are achieved by using a meandered via and a high permeability substrate instead of a straight via and a dielectric substrate. The use of a meandered via allows miniaturization of the ENG ZOR patch antenna without narrowing the bandwidth. The use of a high permeability substrate allows further miniaturization of the ENG ZOR patch antenna and improvement of the bandwidth. A high permeability substrate consisting of a multi-layered substrate is designed to have a small material loss. The antenna (kr=0.32) has a 10 dB fractional bandwidth of ~1 %, which is 1.74 times as broad as that of an antenna with a dielectric substrate.

• 한국정보디스플레이학회:학술대회논문집
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• 2001.08a
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• pp.3-8
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• 2001

This paper will review the state of the latest development of AMLCD manufacturing facilities for large Substrate and discuss the future technologies. The trend of the display size enlargement of Note book PC has hauled the enlargement of the mother glass substrate in past 10 years. The enlargement of a substrate size has brought about the productivity improvement of the TFT panel with process innovation as yet. Will this trend be continuing hereafter too? The issues of the processing and facilities related with the large square substrate and mask step reduction will be overviewed and the future processing and facilities will be discussed.

• Proceedings of the Korea Technical Association of the Pulp and Paper Industry Conference
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• 2006.04a
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• pp.124-131
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• 2006

It is well known that smoother surface in substrate for coating or converting can obtain better results. Generally paper substrate is taking machine calendar process in papermaking system to give more uniformity and to get better coating runnability. This paper was prepared to find better idea for obtaining smoother surface after precalendering precoated paper as a substrate of double coating system. It was shown precalendering had effect on roughness improvement for precoating layer but was difficult to say it was effected to supercalendering results for double coating. The porosity and ink evaluation with precalendered double coated paper is needed to identify more essential clue for precalendering effect.

• Journal of the Semiconductor & Display Technology
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• v.23 no.2
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• pp.12-18
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• 2024

A Electrostatic chuck is a device that fixes the substrate, using the force between charges applied between two parallel plates to attract substrates such as wafers or OLED panels. Unlike mechanical suction methods, which rely on physical fixation, this method utilizes the force of electrostatics for fixation, making it important to verify the adhesion force. As the size of the substrate increases, deformations due to gravity or chucking force also increase, and the adhesion force decreases rapidly as the distance between the chuck and the substrate increases. The outlook for displays is shifting from small to large OLEDs, necessitating consideration of substrate deformations. In this paper, to confirm the deformation of the substrate through various patterns, a simplified 2D model using Ansys' electromagnetic field analysis program, Maxwell, and the static structural analysis program, Mechanical, was utilized to observe changes in adhesion force according to the variation in the air gap between the substrate and the chuck. Additionally, the chucking force was analyzed for the size of the substrate, and the deformation of the substrate was confirmed when gravity and chucking force act simultaneously.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.30 no.4
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• pp.79-84
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• 1998

The process of double coating consists of bottom coating using relatively coaser pigments to improve characteristics of base paper and top coating using finer pigments to cover unevenness of the bottom coating and to give various function of the coated paper. The structure of precoating is influenced not only by its components, but also characteristics of base paper, Moreover pore size and its size distribution of precoating are expected to influence the top coating properties, but this is not well understood. Coating and printing operations involve the application of pigmented fluid on top of a porous substrate. The porosity of the substrate has been shown to influence the properties of the coating, but a good understanding of the mechanisms is lacking in the literature. The role of pore size and void volume on top coating structure is unclear.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.202-205
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• 2002

Polycrystalline silicon thin film transistors (poly-Si TFTs) are used in a wide variety of applications, and will figure prominently future high-resolution, high-performance flat panel display technology However, it was very difficult to fabricate high performance poly-Si TFTs at a temperature lower than 300$^{\circ}C$ for glass substrate. Conventional process on a glass substrate were limited temperature less than 600$^{\circ}C$ This paper proposes a high temperature process above 750$^{\circ}C$ using a flexible molybdenum substrate deposited hydrogenated amorphous silicon (a-Si:H) and than crystallized a rapid thermal processor (RTP) at the various temperatures from 750$^{\circ}C$ to 1050$^{\circ}C$. The high temperature annealed poly-Si film illustrated field effect mobility higher than 30 $\textrm{cm}^2$/Vs, achieved I$\sub$on//I$\sub$off/ current ratio of 10$^4$ and crystall volume fraction of 92%. In this paper, we introduce the new TFTs Process as flexible substrate very promising roll-to-roll process, and exhibit the properties of high temperature crystallized poly-Si Tn on molybdenum substrate.