• 대한기계학회논문집A
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• 제33권8호
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• pp.739-744
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• 2009

Rail-pad is an important and readily replaceable component of a railway track, as it is the elastic layer between the rail and the sleeper. Characteristics and useful lifetime prediction of rail-pad was very important in design procedure to assure the safety and reliability. In this paper, the degradation of rail pad properties as a function of their in-service life is studied with a view of developing a technique for predicting the optimum period of track maintenance with regard to pad replacement. In order to investigate the useful lifetime, the accelerate test were carried out. Accelerated test results changes as the threshold are used for assessment of the useful life and time to threshold value were plotted against reciprocal of absolute temperature to give the Arrhenius plot. By using the acceleration test, several useful lifetime prediction for rail-pads were proposed.

• 한국철도학회:학술대회논문집
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• 한국철도학회 2009년도 춘계학술대회 논문집
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• pp.1010-1015
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• 2009

Rail-pad is an important and readily replaceable component of a railway track, as it is the elastic layer between the rail and the sleeper. Characteristics and useful lifetime prediction of rail-pad was very important in design procedure to assure the safety and reliability. In order to investigate the useful lifetime, the accelerate test were carried out. Accelerated test results changes as the threshold are used for assessment of the useful life and time to threshold value were plotted against reciprocal of absolute temperature to give the Arrhenius plot. By using the acceleration test, several useful lifetime prediction for rail-pads were proposed.

• 한국전기전자재료학회논문지
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• 제14권9호
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• pp.703-703
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• 2001

• 한국염색가공학회지
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• 제29권3호
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• pp.155-161
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• 2017

In CPB(Cold-Pad-Batch) dyeing, the rubber of the padder roll is influenced by the heat, chemical and mechanical influences and thus aging of the padder roll rubber occurs. This study presents an accelerated thermal aging test of the CPB padder roll rubber with strong alkali conditions. Using Arrhenius formula of the various property values for the various aging temperatures($80^{\circ}C$, $90^{\circ}C$, $100^{\circ}C$) of the padder roll, the accelerated life predictions could be calculated. The threshold value of the property was set at different values. The hardness was set at the point where 5% degradation occurs based on the actual use conditions, and the tensile strength was set at the point where 50% degradation occurs based on the general life prediction standards. From the results of the different physical properties at differing temperatures, the Arrhenius plot could be obtained. Through the usage of the Arrhenius Equation, significant duration expectation could be predicted, and the chemical aging behavior of the CPB padder roll could be found at the arbitrary and actual temperatures.

• 한국전기전자재료학회논문지
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• 제14권9호
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• pp.707-713
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• 2001

As the integrated circuit device shrinks to smaller dimensions, chemical mechanical polishing (CMP) process was requirdfo the global planarization of inter-metal dielectric (IMD) layer with free-defect. However, as the IMD layer gest thinner, micro-scratches are becoming as major defects. However, as the IMD layer gets thinner, micro-scratches are becoming as major defects. Micro-scratches are generated by agglomerated slurry, solidified and attached slurry in pipe line of slurry supply system. To prevent agglomerated slurry particle from inflow, we installed 0.5${\mu}{\textrm}{m}$ point of use (POU) filter, which is depth-type filter and has 80% filtering efficiency for the 1.0${\mu}{\textrm}{m}$ size particle. In this paper, we studied the relationship between defect generation and polished wafer counts to understand the exact efficiency fo the slurry filteration, and to find out the appropriate pad usage. Our experimental results showed that it sis impossible to prevent defect-causing particles perfectly through the depth-type filter. Thus, we suggest that it is necessary to optimize the slurry flow rate, and to install the high spray bar of de-ionized water (DIW) with high pressure, to overcome the weak-point of depth type filter.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회A
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• pp.1295-1300
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• 2008

During the manufacturing and the service life of Au-Al wire bonded electronic packages, the ball bonds experience elevated temperatures and hence accelerated thermal diffusion reactions that promote the transformation of the Au-Al phases and the IMC growth. In this paper, the IC under high temperature storage (HTS) tests at $175^{\circ}C,\;200^{\circ}C$, and $250^{\circ}C$ are meticulously investigated. Thermal exposure resulted in the IMC growth, Kirkendall void and the crack of the Au-Al phases. The crack propagation occurs resulting in the failure of the Au-Al ball bonds. As the IC was exposed at the high temperature, decreased in the lifetime.

• International Journal of Railway
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• 제6권1호
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• pp.13-25
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• 2013

Railpad prevents damage of the tie and ballast by reducing the impact and high frequency vibration, which occurs when a vehicle load transfers to a tie. But elasticity of the railpad can decrease under vehicle load and over usable period. If that happens, railpad will become stiffer. Increase in stiffness of the railpad also translates into a rise in track maintenance cost because it accelerates the damage of the track. In this study, accelerated heat ageing test was performed to predict an expectable lifetime of the railpad. As a result, it was predicted to be about sixteen years at $25^{\circ}C$ that life time of railpad using NR rubber from Arrhenius relationship. Also, it was predicted to be about thirty-two days at $100^{\circ}C$. At this time, a standard rate of thickness change is approximately within 12%.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
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• pp.359-361
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• 2006

As circuits become increasingly complex and devices sizes shrinks, the demands placed on global planarization of higher level. Chemical Mechanical Polishing (CMP) is an indispensable manufacturing process used to achieve global planarity. In the CMP process, Diamond Disk (DD) plays an important role in the maintenance of removal rate. According to studies, the cause of removal rate decrease in the early or end stage of diamond disk lifetime comes from pad surface change. We also presented pad cutting rate (PCR) as a useful cutting ability index of DD and studied PCR trend about variable parameters that including size, hardness, shape of DD and RPM, pressure of conditioner It has been shown that PCR control ability of pressure and shape is superior to RPM and size. High pressure leads to a decrease of cell open ratio of pad surface because polyurethane of pad is destroyed by pressure. So low pressure high RPM condition is a proper removal rate sustain. By examining correlations between RPM and pressure of conditioner, it has been shown that PCR safe zoneto satisfy proper removal rate has the range 0.06mm/hr to 0.12mm/hr.

• Tribology and Lubricants
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• 제35권6호
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• pp.330-336
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• 2019

Conditioning is a process involving pad surface scraping by a moving metallic disk that is electrodeposited with diamond abrasives. It is an indispensable process in chemical-mechanical planarization, which regulates the pad roughness by removing the surface residues. Additionally, conditioning maintains the material removal rates and increases the pad lifetime. As the conditioning continues, the pad profile becomes unevenly to be deformed, which causes poor polishing quality. Simulation calculates the density at which the diamond abrasives on the conditioner scratch the unit area on the pad. It can predict the profile deformation through the control of conditioner dwell time. Previously, this effect of the diamond shape on conditioning has been investigated with regard to microscopic areas, such as surface roughness, rather than global pad-profile deformation. In this study, the effect of diamond shape on the pad profile is evaluated by comparing the simulated and experimental conditioning using two conditioners: a) random-shaped abrasive conditioner (RSC) and b) uniform-shaped abrasive conditioner (USC). Consequently, it is confirmed that the USC is incapable of controlling the pad profile, which is consistent with the simulation results.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2001년도 춘계학술대회 논문집
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• pp.1117-1120
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• 2001

Chemical mechanical planarization(CMP) has emerged as the planarization technique of choice in both front-end and back-end integrated circuit manufacturing. Conventional CMP process utilize a polyurethane polishing pad and liquid chemical slurry containing abrasive particles. There have been serious problems in CMP in terms of repeatability and defects in patterned wafers. Since IBM's official announcement on Copper Dual Damascene(Cu2D) technology, the semiconductor world has been engaged in a Cu2D race. Today, even after~3years of extensive R&D work, the End-of-Line(EOL) yields are still too low to allow the transition of technology to manufacturing. One of the reasons behind this is the myriad of defects associated with Cu technology. Especially, dishing and erosion defects increase the resistance because they decrease the interconnection section area, and ultimately reduce the lifetime of the semiconductor. Methods to reduce dishing & erosion have recently been interface hardness of the pad, optimization of the pattern structure as dummy patterns. Dishing & erosion are initially generated an uneven pressure distribution in the materials. These defects are accelerated by free abrasive and chemical etching. Therefore, it is known that dishing & erosion can be reduced by minimizing the abrasive concentration. Minimizing the abrasive concentration by using Ce$O_2$ is the best solution for reducing dishing & erosion and for removal rate. This paper introduce dishing & erosion generating mechanism and a method for developing a semi-rigid abrasive pad to minimize dishing & erosion during CMP.