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http://dx.doi.org/10.9725/kts.2019.35.6.330

Effect of Diamond Abrasive Shape of CMP Conditioner on Polishing Pad Surface Control  

Lee, Donghwan (Dept. of Mechanical Engineering, Pusan National University)
Lee, Kihun (Dept. of Mechanical Engineering, Pusan National University)
Jeong, Seonho (Dept. of Mechanical Engineering, Pusan National University)
Kim, Hyungjae (Precision Manufacturing and Control R&D Group, Dongnam Division, Korea Institute of Industrial Tech)
Cho, Hanchul (Precision Manufacturing and Control R&D Group, Dongnam Division, Korea Institute of Industrial Tech)
Jeong, Haedo (Dept. of Mechanical Engineering, Pusan National University)
Publication Information
Tribology and Lubricants / v.35, no.6, 2019 , pp. 330-336 More about this Journal
Abstract
Conditioning is a process involving pad surface scraping by a moving metallic disk that is electrodeposited with diamond abrasives. It is an indispensable process in chemical-mechanical planarization, which regulates the pad roughness by removing the surface residues. Additionally, conditioning maintains the material removal rates and increases the pad lifetime. As the conditioning continues, the pad profile becomes unevenly to be deformed, which causes poor polishing quality. Simulation calculates the density at which the diamond abrasives on the conditioner scratch the unit area on the pad. It can predict the profile deformation through the control of conditioner dwell time. Previously, this effect of the diamond shape on conditioning has been investigated with regard to microscopic areas, such as surface roughness, rather than global pad-profile deformation. In this study, the effect of diamond shape on the pad profile is evaluated by comparing the simulated and experimental conditioning using two conditioners: a) random-shaped abrasive conditioner (RSC) and b) uniform-shaped abrasive conditioner (USC). Consequently, it is confirmed that the USC is incapable of controlling the pad profile, which is consistent with the simulation results.
Keywords
abrasive wear; chemical mechanical planarization; conditioning simulation; pad conditioning; pad profile;
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Times Cited By KSCI : 1  (Citation Analysis)
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