• Journal of Korean Ophthalmic Optics Society
• /
• v.1 no.1
• /
• pp.73-84
• /
• 1996

Satisfactory for children's spectacles fitting can only be achieved with the resonable selection and assortment of frames of different pad shapes, size, materials, the general property of sample frame are flexibility for the temple. Loughness for bridge and variety for the length of temple, a selection of the lens is chosen usually by the characteristic of the power, safty, size and so on, it will be comport fit of frame controlled the hight and width of pad and angle of pad between the nose side, frontal angle of pad will be determinded that whether a frame may be capable of providing a comport fit. An important part of the fitting of spectacles is the final adjustment before the wearer takes them away, and also their continued adjustment to maintain the optimum comport and lens efficiency. It is suggested that spectacle adjustment is essentially a practical art that can only be acquired by continual practice.

• Tribology and Lubricants
• /
• v.34 no.5
• /
• pp.183-190
• /
• 2018

Tilting pad journal bearing is widely used for steam turbines because of its excellent dynamic stability. As the turbine capacity increases, power loss in the bearings becomes a matter of concern. Power loss in tilting pad journal bearings can be reduced by increasing the bearing clearance and reducing the pad arc length. In this study, the tilting pad journal bearing is tested by changing the seal tooth clearance to verify the static characteristics of the bearing. Bearing power loss and bearing metal temperature are evaluated to compare the bearing's performance and reliability for several test cases. The test bearing is a tilting pad journal bearing with 300.62mm inner diameter and 120.00mm active length. The bearing power loss, its metal temperature, and oil film thickness are measured and evaluated based on the rotor's rotational speed, oil flow rate, and bearing load. Test results show that a tilting pad journal bearing with large seal tooth clearance has 40% lower power loss compared with a bearing with a small seal tooth clearance. As the seal tooth clearance is increased, the power loss of the tilting pad journal bearing decreases. However, with respect to the bearing metal temperatures, a detuning point is observed that makes the minimum bearing metal temperature. Moreover, as the seal tooth clearance is increased, the oil film thickness increases due to high viscosity.

• Tribology and Lubricants
• /
• v.34 no.2
• /
• pp.43-48
• /
• 2018

This paper presents the thermohydrodynamic analysis of tilting journal pad bearings supporting a power turbine rotor applied to a 250 kW super-critical $CO_2$ cycle. In the analysis, the generalized Reynolds equation and 3D energy equation are solved to predict oil film temperature and the 3D heat conduction equation is solved for pad temperature. The power turbine rotor is supported by two tilting pad bearings consisting of five pads with an oil supply block between the pads. Copper backing pads with higher thermal conductivity compared to steel backing pads are adopted to improve thermal management. The predicted maximum pad temperature is around $55^{\circ}C$ which is approximately $15^{\circ}C$ higher than oil supply temperature. In addition, the predicted minimum film thickness is 50 mm at a rotating speed of 5,000 rpm. These results indicate that there is no issue in the thermal behavior of the bearing. An operation test is performed with a power turbine module consisting of a power turbine, a reduction gear and a generator. Thermocouples are installed at the 75% position from the leading edge of the pad to monitor pad temperature. The power turbine uses compressed air at a temperature of $250^{\circ}C$ in its operation. The steady state pad temperatures measured in the test show good agreement with the predicted temperatures.

• Archives of Plastic Surgery
• /
• v.37 no.1
• /
• pp.31-36
• /
• 2010

Purpose: The primary goal of palatoplasty is to enable normal speech with harmonious growth of face. Some children who had palatoplasty display typical findings of transverse maxillary deficiency requiring orthodontic widening of the maxilla. Levi (2009) described a cleft palate repair coupled with pedicled buccal fat pad flaps to cover bone exposed areas of the hard palate. Hence we report clinical experiences of cleft palate repair using pedicled buccal fat pad flap. Methods: Four Veau class II and a Veau class I cleft palate patients underwent palatoplasty with buccal fat pad flap by single surgeon from April 2009 to August 2009. Two patients received 2-flap palatoplasty and three patients 1-flap palatoplasty, respectively. After the cleft palate repair, sharp mosquito scissors was placed in the superior buccal sulcus just lateral to the maxillary tuberosity and inserted directly through the mucosa resulting in buccal fat pad extrusion. The elevated flap was moved to cover mucoperiosteal defect in hard palatal area. Results: Five patients underwent primary palatoplasty using buccal fat pad flap. Flap harvest and inset took on average 9 minutes per flap. Mucosal epithelization took 18 days on average. No patients had complications related to the buccal fat pad flap. Conclusion: Buccal fat pad pedicled flap has significant potential to function as an added vascularized tissue layer in cleft palate repair and we can expect better growth of maxilla with this method although longer duration of follow-up was unavailable.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2001.11a
• /
• pp.171-175
• /
• 2001

Chemical mechanical polishing(CMP) process has been widely used to planarize dielectrics and metal, which can apply to employed in integrated circuits for sub-micron technology. Despite the increased use of CMP process, it is difficult to accomplish the global planarization of free-defects in inter level dielectrics and metal. Especially, defects like (micro-scratch) lead to severe circuit failure, and affects yield. Current conditioning method - bladder type, orbital pad motion - usually provides unsuitable pad profile during ex-situ conditioning near the end of pad life. Since much of the pad wear occurs by the mechanism of bladder tripe conditioning and its orbital motion without rotation, we need to implement new ex-situ conditioner which can prevent abnormal regional force on pad caused by bladder-type and also need to rotate the pad during conditioning. Another important study of ADPC is related to the orbital scratch of which source is assumed as diamond grit dropped from the strip during ex-situ conditioning. Scratch from diamond grit damaged wafer severely so usual1y scraped. Figure 1 shows the typical shape of scratch damaged from diamond. We suspected that intensive forces to the edge area of bladder type stripper accelerated the drop of Diamond grit during conditioning, so new designed Flat stripper was introduced.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2007.11a
• /
• pp.47-48
• /
• 2007

A CMP Process has many factors that affect result of a polished wafer. Dominant factors are velocity, pressure and temperature in process. A pad profile is also considered as affecting factor of CMP. Accoding to variation of a pad profile, the each pan of a wafer is differently pressured. It appears to affect the uniformity of a wafer. A pad profile varies as a swing arm conditioner which have been ordinarily used in industry. A swing arm conditioner has several sectors in its swing path. This study aims that a wafer get a good uniformity as swing arm conditioner's path on pad is analyzed and simulated. Through the simulation, tendency of pad profile after conditioning will be predicted and the result of simulation compared with the result of experiment. The optimized pad profile would be made by to vary swing arm's velocity on each sector. In order to maintain the optimized profile, conditioner design or swing arm's velocity should be changed and designed.

• Tribology and Lubricants
• /
• v.31 no.6
• /
• pp.294-301
• /
• 2015

In this paper, we predict the rotordynamic force coefficients of tilting pad journal bearings (TPJBs) with rocker-back pivots, and we compare the predictions to recently published predictions and test data. The present TPJB model considers the rocker-back pivot stiffness calculated based on the Hertzian contact-stress theory, which is nonlinear with the application of a force . For the five-pad TPJB in load-between-pad and load-on-pad configurations, the predictions show the pressure- and film-thickness distributions, the deflection and stiffness of the individual pivots, and bearing stiffness and damping coefficients. The minimum film thickness and peak pressure occur at the bottom pad on which the applied load is directed. Because of the preload, the pres- sure is positive even at the upper pad in the opposite direction to the applied load. The pivot deflection and stiff- ness are maximum at the bottom pad that receives the heaviest pressure load. The predicted stiffness coefficients increase as the static load and rotor speed increase, while the damping coefficients decrease as the rotor speed increases, but increase as the static load increases. In general, the predicted stiffness coefficients agree well with the test data. The predicted damping coefficients overestimate the test data, particularly for large static loads. In general, the current predictive model considering the pivot stiffness improves the accuracy of the rotordynamic performance compared to previously reported models.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2005.10a
• /
• pp.362-365
• /
• 2005

Currently Chemical Mechanical Planarization (CMP) has become an essential step in the overall semiconductor wafer fabrication technology. Especially the CMP pad conditioner, one of the diamond tools, is required to have strong diamond retention. Strong cohesion between diamond grits and metal matrix prevents macro scratch on the wafer. If diamond retention is weak, the diamond will be pulled out of metal matrix. The pulled diamond grits are causative of macro scratch on wafer during CMP process. Firstly, some results will be reported of cohesion between diamond grits and metal matrix on the diamond tools prepared by three different manufacturing methods. A measuring instrument with sharp cemented carbide connected with a push-pull gauge was manufactured to measure the cohesion between diamond grits and metal matrix. The retention force of brazed diamond tool was stronger than the others. The retention force was also increased in proportion to the contact area of diamond grits and metal matrix. The brazed diamond tool has a strong chemical combination of the interlayer composed of chrome in metal matrix and carbon which enhance the interfacial cohesion strength between diamond grits and metal matrix. Secondly, we measured real-time data of the coefficient of friction and the pad wear rate by using CMP tester (CETR, CP-4). CMP pad conditioner samples were manufactured by brazed, electro-plated and sintered methods. The coefficient of friction and the pad wear rate were shown differently according to the arranged diamond patterns. Consequently, the coefficient of friction is increased according as the space between diamonds is increased or the concentration of diamonds is decreased. The pad wear rate is increased according as the degree of diamond protrusion is increased.

• Journal of the Korea Institute of Information and Communication Engineering
• /
• v.18 no.1
• /
• pp.84-90
• /
• 2014

Secret communication has developed from analogue communication to digital one. Secret communication which is based on digital communication has been designed succeeding safety of one-time pad. One-time pad's safety is attributed to the security of secret key's mutual storage and mutual synchronization that is the key's interchange basis is one of the essential factors. This manuscript examines mathematical stability of BB84 algorithm which is one of the quantum cryptography system, and conducts transmission of quantum key. The created key suggests One-time Pad algorithm which interchanges ciphertext implemented AES's 64th round.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2006.11a
• /
• pp.359-361
• /
• 2006

As circuits become increasingly complex and devices sizes shrinks, the demands placed on global planarization of higher level. Chemical Mechanical Polishing (CMP) is an indispensable manufacturing process used to achieve global planarity. In the CMP process, Diamond Disk (DD) plays an important role in the maintenance of removal rate. According to studies, the cause of removal rate decrease in the early or end stage of diamond disk lifetime comes from pad surface change. We also presented pad cutting rate (PCR) as a useful cutting ability index of DD and studied PCR trend about variable parameters that including size, hardness, shape of DD and RPM, pressure of conditioner It has been shown that PCR control ability of pressure and shape is superior to RPM and size. High pressure leads to a decrease of cell open ratio of pad surface because polyurethane of pad is destroyed by pressure. So low pressure high RPM condition is a proper removal rate sustain. By examining correlations between RPM and pressure of conditioner, it has been shown that PCR safe zoneto satisfy proper removal rate has the range 0.06mm/hr to 0.12mm/hr.