• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.2
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• pp.1308-1311
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• 2004

It is very important that get polishing characteristic that to be stable that accomplish planarization of high efficiency in chemical mechanical polishing, and there is repeatability Groove of pad causes much effects in flow of slurry among various factors that influence in polishing characteristic, is expected to cause change of lubrication state and polishing characteristic in contact between wafer and pad. Therefore, divided factors of pad groove by groove pattern, groove profile, groove dimensions. This research wishes to study effect that dimension of pad groove gets in polishing performance. When changed dimension (width, depth, pitch of groove) of groove, measured change of removal rate and friction force. According as groove dimension changes, could confirm that removal rate and friction force change. While result of this experiment studies effect of pad groove in CMP, it is expected to become small help.

• Transactions on Electrical and Electronic Materials
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• 제8권1호
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• pp.26-31
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• 2007

The goal of this study is to determine if High Pressure Micro Jet (HPMJ) conditioning can be used as a substitute for, or in conjunction with, conventional diamond pad conditioning. Five conditioning methods were studied during which 50 ILD wafers were polished successively in a 100-mm scaled polisher and removal rate (RR), coefficient of friction (COF), pad flattening ratio (PFR) and scanning electron microscopy (SEM) measurements were obtained. Results indicated that PFR increased rapidly, and COF and removal rate decreased significantly, when conditioning was not employed. With diamond conditioning, both removal rate and COF were stable from wafer to wafer, and low PFR values were observed. SEM images indicated that clean grooves could be achieved by HPMJ pad conditioning, suggesting that HPMJ may have the potential to reduce micro scratches and defects caused by slurry abrasive particle residues inside grooves. Regardless of different pad conditioning methods, a linear correlation was observed between temperature, COF and removal rate, while an inverse relationship was seen between COF and PFR.

• 한국전기전자재료학회논문지
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• 제23권5호
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• pp.358-363
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• 2010

The polishing pad is important element for polishing characteristic such as material removal rate(MRR) and within wafer non-uniformity(WIWNU) in the chemical mechanical planarization(CMP). The result of the viscoelasticity measurement shows that 1st elastic modulus is increased and 2nd elastic modulus is decreased when the top pad is thickened. The finite element analysis(FEA) was conducted to predict characteristic of polishing behavior according to the pad thickness. The result of polishing experiment was similar with the FEA, and it shows that the 1st elastic modulus affects instantaneous deformation of pad related to MRR. And the 2nd elastic modulus has an effect on WIWNU due to the viscoelasticity deformation of pad.

• Journal of Mechanical Science and Technology
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• 제17권2호
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• pp.246-253
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• 2003

The tribological mechanism between the valve plate and the cylinder block in oil hydraulic axial piston pumps plays an important role on high power density. In this study, the fluid film thickness between the valve plate and the cylinder block was measured with discharge pressure and rotational speed by use of a gap sensor, and a slip ring system in the operating period. To investigate the effect of the valve plate shapes, we designed two valve plates with different shapes . the first valve plate was without a bearing pad, while the second valve plate had a bearing pad. It was found that both valve plates behaved differently with respect to the fluid film thickness characteristics. The leakage flow rates and the shaft torque were also experimented in order to clarify the performance difference between the valve plate without a bearing pad and the valve plate with a bearing pad. From the results of this study, we found out that in the oil hydraulic axial piston pumps, the valve plate with a bearing pad showed better film thickness contours than the valve plate without a bearing pad.

• 한국철도학회:학술대회논문집
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• 한국철도학회 2005년도 춘계학술대회 논문집
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• pp.504-509
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• 2005

Railway noise and vibration has been recognized as major problems with the speed-up of rolling stock. As a kind of solution to these problems, the decrease of stiffness of track pad have been tried. However, in this case, overturning of rail due to lateral force should be considered because it can have effect on the safety of running train. Therefore, above two things - decrease of stiffness of track pad and overturning of rail due to lateral force - should be considered simultaneously for the appropriate determination of spring coefficient of track pad. With this viewpoint, minimum spring coefficient of track pad is estimated through the comparison between the theoretical relationship about the overturning of rail and 3-dimensional FE analysis result. Two kinds of Lateral force and wheel load are used as input loads. Extracted values from the conventional estimation formula and the Shinkansen design loads are used. It is found that the overturning of rail changes corresponding to the change of the stiffness of track pad and the ratio of lateral force to wheel load. Moreover, it is found that the analysis model can have influence on the results. Through these procedure, minimum spring coefficient of track pad is estimated.

• 한국화재소방학회논문지
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• 제20권3호
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• pp.113-117
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• 2006

본 연구는 가정용 전열제품인 전기장판에 대한 화재실험과 난연성실험을 통하여 화재위험성을 분석하였다. 화재실험은 정상조건에서 정격전압을 인가하는 경우와 온도조절기 고장시 정격전압이 인가되는 경우를 모델링하였다. 난연성실험은 UL 94의 수직 연소시험방법을 이용하여 전기장판의 난연성능을 평가하였다. 실험에 사용된 전기장판의 종류는 전기매트, 전기요, 비닐장판이다. 실험결과 온도조절기가 고장난 상태에서 정격전압이 인가되는 경우 화재위험성이 높은 것으로 나타났으며 전기장판의 재질은 난연성이 없는 것으로 나타났다.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2000년도 추계학술대회논문집A
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• pp.407-412
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• 2000

In this study, a research for process design in bending of structural frame of AA6061-T6 with rubber pad was conducted. In this process, the conventional lower die made of metal is replaced with a polyurethane pad, resulting in high flexibility during bending. Vulcanized polyurethane rubber with shore A hardness of 60 was used for the pad. Experiments on a newly developed bending machine were carried out by controlling the stroke of the roller and horizontal movement of roller pad lower die. From this, the relation between roller path and geometry of the materials bent was obtained for the process design of producing roof rail part of a passenger car and the experimental result was compared with the target profile. For more accurate process design, it is required to control the roller path interactively. Based on the experience in developing the prototype bending machine, it is construed that a fully automated bending system with rubber pad to produce various light-weight components for automotive body frames can be successfully developed.

• 한국화재소방학회논문지
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• 제24권4호
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• pp.104-108
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• 2010

본 논문은 카본열선을 사용하는 전기장판에서 발생한 전기화재에 관하여 기술하였다. 카본열선을 사용하는 전기장판은 카본 재질의 특성상 전기용접이나 납땜 등의 방법으로 접속이 불가능하며, 열선 끝단을 카본 재질의 연결부를 만들어 접속해야 한다. 이러한 과정에서 열선 사이의 불완전 접속이 발생되며, 불완전 접속부에는 접촉저항의 증가로 국부적인 발열이 발생되고, 최종적으로 화재사고로 진전된다. 본 논문에서는 카본 열선 접속부에서 불완전 접속이 형성되는 경우, 접속부에서 전기적 발열에 의해 발생되는 열선의 손상 형태를 분석하여 화재원인을 규명하였다. 이러한 분석 결과는 카본 열선을 사용하는 전기장판의 화재원인 조사의 기초 자료로 활용 가능할 것으로 기대한다.

• Macromolecular Research
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• 제12권3호
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• pp.263-268
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• 2004

We have synthesized a water-soluble polyimide precursor, poly(amic acid) amine salt (PAD), from pyromellitic dianhydride (PMDA), 4,4'-oxydianiline, and N,N -dimethylethanolamine (DMEA) and have investigated in detail its properties with respect to the degree of salt formation (D$\_$sf/). The maximum value of D$\_$sf/ we obtained upon precipitation of the precursor solution into acetone was 79%. We synthesized a PAD having a D$\_$sf/ of 100% (PAD100) by the solid state drying of an organic solution. The precursors showed different solubility depending on the D$\_$sf/ to make up to 4 wt% solutions in water containing a small amount of DMEA. PAD100 is completely soluble in pure water. We investigated the imidization behavior of PAD in aqueous solution using various spectroscopic methods, which revealed that PAD 100 has faster imidization kinetics relative to that of the poly(amic acid)-type precursors. The resulting polyimide films prepared from an aqueous precursor solution possess almost similar physical and thermal properties as those prepared from N-methyl-2-pyrrolidone(NMP) solution. Therefore, we have demonstrated that PAD can be used as a water-based precursor of polyimide; this procedure avoids the use of toxic organic solvents, such as NMP.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.563-564
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• 2006

Recently, CMP (Chemical Mechanical Polishing) is one of very important processing in semiconductor technology because of large integration and application of design role. CMP is a planarization process of wafer surface using the chemical and mechanical reactions. One of the most important components of the CMP system is the polishing pad. During the CMP process, the pad itself becomes smoother and glazing. Therefore it is necessary to have a pad conditioning process to refresh the pad surface, to remove slurry debris and to supply the fresh slurry on the surface. A diamond disk use during the pad conditioning. There are diamonds on the surface of diamond disk to remove slurry debris and to polish pad surface slightly, so density, shape and size of diamond are very important factors. In. this study, we characterized diamond disk with 9 kinds of sample.