• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.1308-1311
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• 2004

It is very important that get polishing characteristic that to be stable that accomplish planarization of high efficiency in chemical mechanical polishing, and there is repeatability Groove of pad causes much effects in flow of slurry among various factors that influence in polishing characteristic, is expected to cause change of lubrication state and polishing characteristic in contact between wafer and pad. Therefore, divided factors of pad groove by groove pattern, groove profile, groove dimensions. This research wishes to study effect that dimension of pad groove gets in polishing performance. When changed dimension (width, depth, pitch of groove) of groove, measured change of removal rate and friction force. According as groove dimension changes, could confirm that removal rate and friction force change. While result of this experiment studies effect of pad groove in CMP, it is expected to become small help.

• Transactions on Electrical and Electronic Materials
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• v.8 no.1
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• pp.26-31
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• 2007

The goal of this study is to determine if High Pressure Micro Jet (HPMJ) conditioning can be used as a substitute for, or in conjunction with, conventional diamond pad conditioning. Five conditioning methods were studied during which 50 ILD wafers were polished successively in a 100-mm scaled polisher and removal rate (RR), coefficient of friction (COF), pad flattening ratio (PFR) and scanning electron microscopy (SEM) measurements were obtained. Results indicated that PFR increased rapidly, and COF and removal rate decreased significantly, when conditioning was not employed. With diamond conditioning, both removal rate and COF were stable from wafer to wafer, and low PFR values were observed. SEM images indicated that clean grooves could be achieved by HPMJ pad conditioning, suggesting that HPMJ may have the potential to reduce micro scratches and defects caused by slurry abrasive particle residues inside grooves. Regardless of different pad conditioning methods, a linear correlation was observed between temperature, COF and removal rate, while an inverse relationship was seen between COF and PFR.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.5
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• pp.358-363
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• 2010

The polishing pad is important element for polishing characteristic such as material removal rate(MRR) and within wafer non-uniformity(WIWNU) in the chemical mechanical planarization(CMP). The result of the viscoelasticity measurement shows that 1st elastic modulus is increased and 2nd elastic modulus is decreased when the top pad is thickened. The finite element analysis(FEA) was conducted to predict characteristic of polishing behavior according to the pad thickness. The result of polishing experiment was similar with the FEA, and it shows that the 1st elastic modulus affects instantaneous deformation of pad related to MRR. And the 2nd elastic modulus has an effect on WIWNU due to the viscoelasticity deformation of pad.

• Journal of Mechanical Science and Technology
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• v.17 no.2
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• pp.246-253
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• 2003

The tribological mechanism between the valve plate and the cylinder block in oil hydraulic axial piston pumps plays an important role on high power density. In this study, the fluid film thickness between the valve plate and the cylinder block was measured with discharge pressure and rotational speed by use of a gap sensor, and a slip ring system in the operating period. To investigate the effect of the valve plate shapes, we designed two valve plates with different shapes . the first valve plate was without a bearing pad, while the second valve plate had a bearing pad. It was found that both valve plates behaved differently with respect to the fluid film thickness characteristics. The leakage flow rates and the shaft torque were also experimented in order to clarify the performance difference between the valve plate without a bearing pad and the valve plate with a bearing pad. From the results of this study, we found out that in the oil hydraulic axial piston pumps, the valve plate with a bearing pad showed better film thickness contours than the valve plate without a bearing pad.

• Proceedings of the KSR Conference
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• 2005.05a
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• pp.504-509
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• 2005

Railway noise and vibration has been recognized as major problems with the speed-up of rolling stock. As a kind of solution to these problems, the decrease of stiffness of track pad have been tried. However, in this case, overturning of rail due to lateral force should be considered because it can have effect on the safety of running train. Therefore, above two things - decrease of stiffness of track pad and overturning of rail due to lateral force - should be considered simultaneously for the appropriate determination of spring coefficient of track pad. With this viewpoint, minimum spring coefficient of track pad is estimated through the comparison between the theoretical relationship about the overturning of rail and 3-dimensional FE analysis result. Two kinds of Lateral force and wheel load are used as input loads. Extracted values from the conventional estimation formula and the Shinkansen design loads are used. It is found that the overturning of rail changes corresponding to the change of the stiffness of track pad and the ratio of lateral force to wheel load. Moreover, it is found that the analysis model can have influence on the results. Through these procedure, minimum spring coefficient of track pad is estimated.

• Fire Science and Engineering
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• v.20 no.3 s.63
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• pp.113-117
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• 2006

This study presents analysis of fire hazard of electrical heating pad. In order to analyze fire hazard fire experimental and flammability experiment is conducted. The fire experiment is conducted to simulate normal condition and abnormal condition such as breakdown of thermostat. Vertical burning test(UL 94) is conducted for the fire retardant experiment. Kinds of electric heating pad used for experiment are electric mat, fabric pad, vinyl pad. The results show that fire hazard is high in case of breakdown of thermostat with the rating voltage supply. And Material of electric heating pad has not fire retardant performance.

• Proceedings of the KSME Conference
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• 2000.11a
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• pp.407-412
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• 2000

In this study, a research for process design in bending of structural frame of AA6061-T6 with rubber pad was conducted. In this process, the conventional lower die made of metal is replaced with a polyurethane pad, resulting in high flexibility during bending. Vulcanized polyurethane rubber with shore A hardness of 60 was used for the pad. Experiments on a newly developed bending machine were carried out by controlling the stroke of the roller and horizontal movement of roller pad lower die. From this, the relation between roller path and geometry of the materials bent was obtained for the process design of producing roof rail part of a passenger car and the experimental result was compared with the target profile. For more accurate process design, it is required to control the roller path interactively. Based on the experience in developing the prototype bending machine, it is construed that a fully automated bending system with rubber pad to produce various light-weight components for automotive body frames can be successfully developed.

• Fire Science and Engineering
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• v.24 no.4
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• pp.104-108
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• 2010

This paper describes electrical fire on electric pad using carbon type hot wires. A carbon type hot wires electric pad is virtually impossible to connect hot wire as a method of electrical welding or soldering. In order to connect between hot wires, that has to splice carbon type material connector. If junction of hot wires was occurrence of poor connection on electric pad, it increase contact resistance on this junction point. With increasing contact resistance, junction of hot wires on electric pad generates local heating and finally leads to electrical fire. In this paper, we analyzed shape of damage in hot wires caused by electrical local heating and investigated fire cause on electric pad using by carbon type hot wires.

• Macromolecular Research
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• v.12 no.3
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• pp.263-268
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• 2004

We have synthesized a water-soluble polyimide precursor, poly(amic acid) amine salt (PAD), from pyromellitic dianhydride (PMDA), 4,4'-oxydianiline, and N,N -dimethylethanolamine (DMEA) and have investigated in detail its properties with respect to the degree of salt formation (D$\_$sf/). The maximum value of D$\_$sf/ we obtained upon precipitation of the precursor solution into acetone was 79%. We synthesized a PAD having a D$\_$sf/ of 100% (PAD100) by the solid state drying of an organic solution. The precursors showed different solubility depending on the D$\_$sf/ to make up to 4 wt% solutions in water containing a small amount of DMEA. PAD100 is completely soluble in pure water. We investigated the imidization behavior of PAD in aqueous solution using various spectroscopic methods, which revealed that PAD 100 has faster imidization kinetics relative to that of the poly(amic acid)-type precursors. The resulting polyimide films prepared from an aqueous precursor solution possess almost similar physical and thermal properties as those prepared from N-methyl-2-pyrrolidone(NMP) solution. Therefore, we have demonstrated that PAD can be used as a water-based precursor of polyimide; this procedure avoids the use of toxic organic solvents, such as NMP.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.563-564
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• 2006

Recently, CMP (Chemical Mechanical Polishing) is one of very important processing in semiconductor technology because of large integration and application of design role. CMP is a planarization process of wafer surface using the chemical and mechanical reactions. One of the most important components of the CMP system is the polishing pad. During the CMP process, the pad itself becomes smoother and glazing. Therefore it is necessary to have a pad conditioning process to refresh the pad surface, to remove slurry debris and to supply the fresh slurry on the surface. A diamond disk use during the pad conditioning. There are diamonds on the surface of diamond disk to remove slurry debris and to polish pad surface slightly, so density, shape and size of diamond are very important factors. In. this study, we characterized diamond disk with 9 kinds of sample.