• Title/Summary/Keyword: packaging system

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A Study on the Design and Characteristics of thin-film L-C Band Pass Filter

  • Kim In-Sung;Song Jae-Sung;Min Bok-Ki;Lee Won-Jae;Muller Alexandru
    • KIEE International Transactions on Electrophysics and Applications
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    • v.5C no.4
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    • pp.176-179
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    • 2005
  • The increasing demand for high density packaging technologies and the evolution to mixed digital and analogue devices has been the con-set of increasing research in thin film multi-layer technologies such as the passive components integration technology. In this paper, Cu and TaO thin film with RF sputtering was deposited for spiral inductor and MOM capacitor on the $SiO_2$/Si(100) substrate. MOM capacitor and spiral inductor were fabricated for L-C band pass filter by sputtering and lift-off. We are analyzed and designed thin films L-C passive components for band pass filter at 900 MHz and 1.8 GHz, important devices for mobile communication system. Based on the high-Q values of passive components, MOM capacitor and spiral inductors for L-C band pass filter, a low insertion loss of L-C passive components can be realized with a minimized chip area. The insertion loss was 3 dB for a 1.8 GHz filter, and 5 dB for a 900 MHz filter. This paper also discusses a analysis and practical design to thin-film L-C band pass filter.

Fabrication and Evaluation of the Flexible and Implantable Micro Electrode (생체 삽입형 유연한 마이크로 전극의 제작 및 평가)

  • Baek Ju-Yeoul;Kwon Gu-Han;Lee Sang-Woon;Lee Ky-Am;Lee Sang-Hoon
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.55 no.2
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    • pp.93-99
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    • 2006
  • In this paper, we fabricated and evaluated polydimethylsiloxane(PDMS)-based flexible and implantable micro electrodes. The electrode patterning was carried out with the photolithography and chemical etching process after e-beam evaporation of 100 ATi and 1000 A Au. The PDMS substrate was treated by oxygen plasma using reactive ion etching(RIE) system to improve the adhesiveness of PDMS and metal layers. The minimum line width of fabricated micro electrode was 20 $\mu$m. After finished patterning, we did packaging with PDMS and then brought up the electrode's part about 40 $\mu$m with gold electroplating. The Hank's balanced salt solution(HBSS) test was carried out for 6 month for endurance of fabricated micro electrode. We carried out in-vivo test for the evaluation of biocompatibility by implanting electrodes under the ICR mouse skin for 42 days.

Analysis of Gene Expression in Cyclooxygenase-2-Overexpressed Human Osteosarcoma Cell Lines

  • Han, Jeong A.;Kim, Ji-Yeon;Kim, Jong-Il
    • Genomics & Informatics
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    • v.12 no.4
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    • pp.247-253
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    • 2014
  • Osteosarcoma is the most common primary bone tumor, generally affecting young people. While the etiology of osteosarcoma has been largely unknown, recent studies have suggested that cyclooxygenase-2 (COX-2) plays a critical role in the proliferation, migration, and invasion of osteosarcoma cells. To understand the mechanism of action of COX-2 in the pathogenesis of osteosarcoma, we compared gene expression patterns between three stable COX-2-overexpressing cell lines and three control cell lines derived from U2OS human osteosarcoma cells. The data showed that 56 genes were upregulated, whereas 20 genes were downregulated, in COX-2-overexpressed cell lines, with an average fold-change > 1.5. Among the upregulated genes, COL1A1, COL5A2, FBN1, HOXD10, RUNX2, and TRAPPC2 are involved in bone and skeletal system development, while DDR2, RAC2, RUNX2, and TSPAN31 are involved in the positive regulation of cell proliferation. Among the downregulated genes, HIST1H1D, HIST1H2AI, HIST1H3H, and HIST1H4C are involved in nucleosome assembly and DNA packaging. These results may provide useful information to elucidate the molecular mechanism of the COX-2-mediated malignant phenotype in osteosarcoma.

Composite $BaTiO_3$ Embedded capacitors in Multilayer Printed Circuit Board (다층 PCB에서의 $BaTiO_3$ 세라믹 Embedded capacitors)

  • You, Hee-Wook;Park, Yong-Jun;Koh, Jung-Hyuk
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.17 no.2
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    • pp.110-113
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    • 2008
  • Embedded capacitor technology is one of the effective packing technologies for further miniaturization and higher performance of electric packaging system. In this paper, the embedded capacitors were simulated and fabricated in 8-layered printed circuit board employing standard PCB processes. The composites of barium titanante($BaTiO_3$) powder and epoxy resin were employed for the dielectric materials in embedded capacitors. Theoretical considerations regarding the embedded capacitors have been paid to understand the frequency dependent impedance behavior. Frequency dependent impedance of simulated and fabricated embedded capacitors was investigated. Fabricated embedded capacitors have lower self resonance frequency values than that of the simulated embedded capacitors due to the increased parasitic inductance values. Frequency dependent capacitances of fabricated embedded capacitors were well matched with those of simulated embedded capacitors from the 100MHz to 10GHz range. Quality factor of 20 was observed and simulated at 2GHz range in the 10 pF embedded capacitors. Temperature dependent capacitance of fabricated embedded capacitors was presented.

Characterization of a Hybrid Cu Paste as an Isotropic Conductive Adhesive

  • Eom, Yong-Sung;Choi, Kwang-Seong;Moon, Seok-Hwan;Park, Jun-Hee;Lee, Jong-Hyun;Moon, Jong-Tae
    • ETRI Journal
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    • v.33 no.6
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    • pp.864-870
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    • 2011
  • As an isotropic conductive adhesive, that is, a hybrid Cu paste composed of Cu powder, solder powder, and a fluxing resin system, has been quantitatively characterized. The mechanism of an electrical connection based on a novel concept of electrical conduction is experimentally characterized using an analysis of a differential scanning calorimeter and scanning electron microscope energy-dispersive X-ray spectroscopy. The oxide on the metal surface is sufficiently removed with an increase in temperature, and intermetallic compounds between the Cu and melted solder are simultaneously generated, leading to an electrical connection. The reliability of the hybrid Cu paste is experimentally identified and compared with existing Ag paste. As an example of a practical application, the hybrid Cu paste is used for LED packaging, and its electrical and thermal performances are compared with the commercialized Ag paste. In the present research, it is proved that, except the optical function, the electrical and thermal performances are similar to pre-existing Ag paste. The hybrid Cu paste could be used as an isotropic conductive adhesive due to its low production cost.

A Case Study of Comparing the Measuring Methods for Workloads of Resources in a Manufacturing Processes of Semiconductor-Parts (반도체부품 생산공정 자원의 부하 측정방법 비교분석 사례연구)

  • Kim, Dong-Soo;Moon, Dug-Hee
    • Journal of the Korea Society for Simulation
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    • v.20 no.3
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    • pp.49-58
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    • 2011
  • The workloads of facilities and laborers are important for the capacity planning in a factory. They are always referenced whenever a factory develops a new product, increases the production quantity and makes a plan of new investment. There are many measuring methods for estimating the workload effectiveness of facilities and laborers. In this paper, various measuring methods including survey, work sampling, micro-motion study, data gathering from ERP system and simulation, are analyzed for comparing the accuracy of workload. This case study is conducted in a Korean company that produces semiconductor parts like leadframe and packaging substrate.

Cure Kinetics of Self-Extinguishing Epoxy Resin Systems with Charge Transfer Complex Type Latent Catalyst for Semiconductor Encapsulation (전하전이착체형 잠재성 촉매를 사용한 반도체 성형용 자소성 에폭시 수지 시스템의 경화 반응속도 연구)

  • Kim, Whan Gun
    • Journal of the Semiconductor & Display Technology
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    • v.13 no.4
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    • pp.27-32
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    • 2014
  • The cure properties of self-extinguishing epoxy resin systems with different charge transfer type latent catalysts were investigated, which are composed of YX4000H as a biphenyl epoxy resin, MEH-7800SS as a hardener, and charge transfer type latent catalysts. We designed and used five kinds of charge transfer type latent catalyst and compared to epoxy resin systems with Triphenylphosphine-Benzoquinone(TPP-BQ) as reference system. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The epoxy resin systems with Triphenylphosphine-Quinhydrone(TPP-QH), Triphenylphosphine-Benzanthrone(TPP-BT) and Triphenylphosphine-Anthrone(TPP-AT) as a charge transfer type latent catalyst showed a cure conversion rate of equal or higher rate than those with TPP-BQ. These systems with TPP-QH and Triphenylphosphine-Tetracyanoethylene(TPP-TCE) showed a critical cure reaction conversion of equal or higher conversion than those with TPP-BQ. The increases of cure conversion rates could be explained by the decrease of the activation energy of these epoxy resin systems. It can be considered that the increases of critical cure reaction conversion would be dependent on the crystallinity of the biphenyl epoxy resin systems.

Evaluation of Web Sites on Sexuality Education for the Adolescents

  • Moon, In-Ok;Kim, Hye-Kyeong
    • Korean Journal of Health Education and Promotion
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    • v.22 no.3
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    • pp.83-95
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    • 2005
  • Objectives: The aim of this study was to assess the quality of the information and characteristics associated with information packaging, and develop suggestions for how this web site might be improved. Methods: The 50 sites were selected for evaluation. Inclusion criteria for evaluation were the purpose and the popularity of the sites. Two kinds of evaluation tool were employed for the analysis: one that evaluate the quality of information and the design of the web sites, and another that evaluate the covered contents. A scoring system allowed the sites point on yes/no basis on the evaluation items. The association between quality of the web sites on sexuality education and their site characteristics were assessed using ANOVA. Conclusions: Major conclusions were as follows. First, the scope and currency of the selected web sites were found to be appropriate. Second, the authority of the information was found to be the most serious problem of the selected sites. Third, the category of sexual behavior found to be the most frequently mentioned and sexual health was the second. The least mentioned category was personal skills. Finally, sites operated by private organization were found to have more accurate information and better design feature than those operated by public organization and/or individual.

Operational Characteristics of Pulsating Heat Pipes for the Application to the Heat Dissipation of LED Lighting (LED 조명 방열 환경에서 진동형 히트파이프의 작동 특성)

  • Bang, Kwang-Hyun;Kim, Hyoung-Tak;Park, Hae-Kyun
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.25 no.10
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    • pp.830-836
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    • 2012
  • An efficient cooling system is essential for the electronic packaging such as a high-luminance LED lighting. A special heat transport technology, Pulsating Heat Pipe (PHP), can be applied to the cooling of LED lighting. In this paper, the operational characteristics of the PHP in the imposed thermal boundary conditions of LED lighting were experimentally investigated. The experimental PHP was made of copper tubes of internal diameter of 2.1 mm. The working fluids of ethanol, FC-72, water, acetone and R-123 were chosen for comparison. The results showed that an optimum range of charging ratio exists for high cooling performance; 50% for most of the fluids. Among the five working fluids, water showed the highest heat transfer rate of 260 W. Two distinguished characteristics of pulsating direction were identified. It is also identified that high vapor pressure gradient is one of key parameters for better heat transfer performance.

Micro System Packaging using New Micro-Heater (새로운 미세 가열기를 이용한 마이크로 시스템의 패키징)

  • Shim, Young-Dae;Shin, Kyu-Ho;Choa, Sung-Hun;Kim, Yong-Hun
    • Proceedings of the KIEE Conference
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    • 2002.11a
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    • pp.57-59
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    • 2002
  • 기존에 연구된 미세 가열기를 이용한 마이크로 시스템 패키징의 문제점을 해결하기 위해 새로운 미세 가열기를 제작하여 접합 실험을 실시하였다. 기존 형상의 미세 가열기와 새로운 미세 가열기의 형상을 각각 제작하여 접합시 미세 가열기에 발생하는 열분포를 IR 카메라를 이용하여 실험하였으며, 기존 형상의 미세 가열기가 불균일하게 가열되는 반면, 새로운 형상의 미세 가열기는 매우 균일하게 가열되는 형상을 나타내었다. 카메라 실험 결과를 바탕으로 접합 실험을 실시하기 위해서 폭 $50{\mu}m$, 두께 $2{\mu}m$의 미세 가열기를 제작하였으며, 0.2 Mpa의 압력을 Pyrex glass cap에 가한 상태에서 150 mA의 전류를 공급함으로서 접합을 완료하였다. 접합이 완료된 시편들에 대해서 IPA를 통한 leak 실험을 실시하였으며, 기존 형상의 미세 가열기를 이용한 시편들은 66%가 테스트를 통과한 반면 새로운 형상의 미세 가열기를 이용한 시편들은 85%이상이 테스트를 통과하였다. Leak 실험을 통과한 각각의 시편들에 대해서 접합력 측정을 실시한 결과, 기존 형상의 미세 가열기를 이용한 시편들은 $15{\sim}21$ Mpa의 접합력을 나타내었고, 새로울 형상의 미세 가열기를 이용한 시편들은 $25{\mu}30$ Mpa의 우수한 접합력을 나타내었다.

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