• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2002.04a
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• pp.603-607
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• 2002

Recently, the need leer transporting and manipulating minute amount of fluids in microscale channels (so-called micro-fluidics) has been increasing, especially in biotechnology and biochemical processing. This work demonstrates that the mechano-chemical process which consists of mechanical abrasive action combined with chemical process can be used to fabricate micro-fluidic channels more rapidly and cost effectively than other methods. In this work, capillary filling of fluids in micro-channels was investigated by theoretical approaches and experiments. From the experimental results, it is expected that a complex micro-fluidic system can be fabricated using the micro- fabrication technique and microsystem packaging method described in this work.

• Proceedings of the Korean Operations and Management Science Society Conference
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• 2004.05a
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• pp.672-675
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• 2004

JACK$^{\circledR}$, SAFEWORK$^{\circledR}$과 같은 인간공학적 설계지원 시스템들은 인체모델의 눈 위치로부터 생성된 시야원추(view cone)를 이용하여 자동차 내장 설계의 시계성을 평가하여왔다. 그러나, 시야원추를 이용한 시계성 평가 방법은 내장 부품의 시야원추 내 존재 여부에 대한 시각적 판단으로 정성적 평가 결과만을 제공한다. 본 연구는 세분화된 눈과 머리의 회전범위를 이용하여 시계영역을 5 부분으로 구분하였고 각 부분에 1 ${\sim}$ 5까지의 점수를 할당하여 내장 설계의 시계성을 정량적으로 평가하는 척도를 개발하였다. 그리고, 다양한 크기의 인체모델들의 눈 위치에서 생성된 시계영역 이용하여 내장 부품들의 시계성을 정략적으로 평가하고 부품들의 상대적 중요도을 고려하여 종합적 시계성 평가 점수를 산출하는 시스템을 Microsoft$^{\circledR}$Access 를 이용하여 개발하였다.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1718-1723
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• 2007

The Probe Card is a test component which is to classify the good semiconductor chips before the packaging. The yield of semiconductor product can be better from analysis of probe test information. Recently the technology of the probe card needs narrow width and large amount of probe tip. In this research, the probe tip based on the MEMS(micro electro mechanical system) technology was designed and fabricated to improve the reliability of the test and to meet 2-dimensional Array of tip. The mechanical and electrical properties of proposed tip were evaluated and it has over 100,000 of repetition times in the condition of 5gf, $20{\mu}m$ Over Drive.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.7
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• pp.1218-1223
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• 2007

A surface micro machined angular rate sensor utilizing a vibrating MEMS structure on a silicon has been developed. These tuning fork angular rate sensors are extremely rugged, inherently balanced, and easy to fabricate. The device is fabricated using a temperature compensation method based on automatic gain control technique. A linearity of approximately 0.6%, limited by the on-chip electronics has been obtained with this new sensor. Tests of the sensor demonstrate that its performance is equivalent to that required for implementation of a yaw control system. Vehicle handling and safety are substantially improved using the sensor to implement yaw control.

• Journal of the Korean Society of Industry Convergence
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• v.2 no.1
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• pp.105-112
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• 1999

Model predicting the respiration rate of pear under modified LDPE film pouch has been developed. The assumptions of the model have three bases; 1) respiration rate is depending on $CO_2$ and $O_2$ concentration in the package, 2) the oxidation of glucose in pear generates carbon dioxides, and 3) gases permeation through the package film bases on the Langmuir adsorption theory and Fick's law. The simulated results agreed fairly well with the experimental data so as this model to be useful in designing the modified atmospheric packaging system.

• Journal of the Korean Society for Railway
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• v.12 no.1
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• pp.175-182
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• 2009

Needs on ensuring compatibility and conformity of equipments that are used in logistics functions - such as packaging, transporting, loading/unloading and storing - are raised. This article presents a classification scheme for analyzing the interfacing characteristics of logistics equipments focusing on standardized pallets of unit load system. International and domestic classification systems are reviewed and analyzed; as a result several problems are issued. Methods to resolve the problems, to specify the attributes of logistics equipments and to represent the semantics among them using semantic web technology are proposed. This study could make it possible to examine the conformities of interfacing equipments automatically.

• Proceedings of the SAREK Conference
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• 2004.11a
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• pp.99-99
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• 2004

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.10 no.2
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• pp.137-146
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• 1998

The experimental study is concerned with two-phase closed thermosyphons, (i.e., wickless heat pipes) for the cooling of high power electronic components in telecommunication system. The thermosyphon which can deal with a high heat flux of up to $4.9W/cm^2$ is developed, and the cooling characteristics of thermosyphon is analyzed according to design parameters which are the types of and quantity of working fluid, number of pipes, wire insertion in pipe, inclination angle of thermosyphon, and cooling air velocity. Using water as working fluid is superior cooling performance compared to using acetone, and cooling performance is improved as the number of thermosyphon becomes larger, inserting wires in the pipes, and inclination of $30~60^{\circ}$.

• Proceedings of the KWS Conference
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• 2006.10a
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• pp.190-192
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• 2006

The 3-dimensional(3D) chip stacking technology is one of the leading technologies to realize a high density and high performance system in package(SIP). It could be found that it is the advanced process of through-hole via formation with the minimum damaged on the Si-wafer. Laser ablation is very effective method to penetrate through hole on the Si-wafer because it has the advantage that formed under $100{\mu}m$ diameter through-hole via without using a mask. In this paper, we studied the optimum method for a formation of through-hole via using femto-second laser heat sources. Furthermore, the processing parameters of the specimens were several conditions such as power of output, pulse repetition rate as well as irradiation method and time. And also the through-hole via form could be investigated and analyzed by microscope and analyzer.

• Transactions of Materials Processing
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• v.21 no.2
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• pp.131-137
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• 2012

With the advantages of power savings, increased life expectancy and fast response time over traditional incandescent bulb, LEDs are increasingly used for many applications including automotive, aviation, display, and special lighting applications. Since the high heat generation of LED chips can reduce service life, degrade luminous efficiency, and cause variation of color temperature, many studies have been carried out on the optimization of LED packaging and heat sinks. In this study, a fin expansion type cooling device using heat pipe, instead of a solid aluminum heat sink, was designed for LED security lightings based on thermal resistance analysis. Numerical analysis and experimental validation were carried out to evaluate its cooling performance.