• Journal of the Microelectronics and Packaging Society
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• v.30 no.2
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• pp.13-20
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• 2023

The process of microelectromechanical system (MEMS) fabrication involves surface treatment to impart functionality to the device. Such surface treatment method is the self-assembled monolayer (SAM) technique, which modifies and functionalizes the surface of MEMS components with organic molecule monolayer, possessing a precisely controllable strength that depends on immersion time and solution concentration. These monolayers spontaneously adsorb on polymeric substrates or metal/ceramic components offering high precision at the nanoscale and modifying surface properties. SAM technology has been utilized in various fields, such as tribological property control, mass-production lithography, and ultrasensitive organic/biomolecular sensor applications. This paper provides an overview of the development and application of SAM technology in various fields.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.3
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• pp.88-93
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• 2023

As the demand for High Bandwidth Memory (HBM) increases and the handling capability of larger wafers expands, ensuring reliable Total Thickness Variation (TTV) measurement for stacked wafers becomes essential. This study presents the design of a measurement module capable of measuring TTV across the entire area of a 300mm wafer, along with estimating potential mechanical measurement errors. The module enables full-area measurement by utilizing a center chuck and lift pin for wafer support. Modal analysis verifies the structural stability of the module, confirming that both the driving and measuring parts were designed with stiffness exceeding 100 Hz. The mechanical measurement error of the designed module was estimated, resulting in a predicted measurement error of 1.34 nm when measuring the thickness of a bonding wafer with a thickness of 1,500 ㎛.

• Journal of Distribution Science
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• v.7 no.4
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• pp.47-56
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• 2009

The purpose of this study is to present an alternative improving the efficient and reasonable of the physical distribution system management is influenced by many factors. Therefore, the study depends on the documentary method and survey method to achieve the purpose of this study. The major components of a physical distribution system are refers to as elements, include warehouse·storage system, transportation system, inventory system, physical distribution information system. The factors used in this study are ① factor of product(quality·A/S·added value of product·adaption of product·technical competitive power to other enterprises), ② factor of market(market channel·kinds of customer·physical distribution share), ③ factor of warehouse·storage(warehouse design·size·direction·storage ability·warehouse quality), ④ factor of transportation(promptness·reliability·responsibility·kinds of transportation·cooperation united transportation system·national transportation network), ⑤ factor of packaging (packaging design·material·educating program·pollution degree measure program), ⑥ factor of inventory(ordinary inventory criterion·consistence for inventories record), ⑦ factor of unloaded(unloaded machine·having machine ratio), ⑧ factor of information system (physical distribution quantity analysis·usable computer part), ⑨ factor of physical distribution cost(sales ratio to product) ⑩ factor of physical distribution system(physical distribution center etc). The implication of this study can be summarized as follows: ① In firms that have not adopted a systems integrative approach, physical distribution is a fragmented and often uncoordinated set of activities spread throughout various functions with function having its own set of priorities and measurements. ② The physical distribution is recognized as more an important strategic factor than a simple cost reduction factor, ③ It can be used a strategic competition tool to enterprise.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.1
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• pp.438-444
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• 2015

The aim of this research was to apply a HACCP system (Hazard Analysis Critical Control Point) to fermented milk. The main ingredients of fermented milk, work facilities and workers were obtained from a company named YD, which is located in Seobuk-gu, Cheonan-si between November 5 2013 to April 13, 2014. A manufacturing process chart was prepared by referring to the manufacturing process of fermented milk manufacturers in common. The manufacturing process chart was made with raw materials; Raw milk, High Fructose Corn Syrup, Oligosaccharides, Lactic Acid bacteria and Subsidiary ingredients, Warehousing of packaging materials, Storage, Input, Preheating, Mixing, Homogeneity, Sterilization, Precooling, Culture, Filtration, In packaging, Out packaging, Storage, and Consignment, as listed Table 1. The results of the microbiological hazard analysis on the raw materials was safe after sterilization($90^{\circ}C{\pm}5^{\circ}C$, $35{\pm}3min.$) On the other hand,a microorganism test of an environment and workers suggested that the microbiological hazard should be reduced through systematic cleaning and disinfection accompanied by improved personal hygiene based on hygienic education on workers and the management of microorganisms in air.

• Korean Journal of Organic Agriculture
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• v.27 no.4
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• pp.437-452
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• 2019

The HACCP evaluation standards for the meat packaging plant are divided into general scale HACCP evaluation standard and small scale HACCP evaluation standard. There are 69 evaluation items in the general scale HACCP evaluation criteria, of which 54 items in the prerequisite management and 15 items in the HACCP management are included. The number of small scale HACCP evaluation items are 20 and about 29% of the general scale HACCP evaluation items. This may not be enough to produce a safety livestock products for the purpose of implementing the HACCP system due to the nature of the meat packaging plant, which does not show much difference in the production process or method of product depending on the scale. To improve the small scale HACCP evaluation standard, the importance of each item was compared with the small scale HACCP evaluation based on the rate of non-compliance and the severity levels in the general scale HACCP evaluation items. As a result of the study, 8 items were derived from the prerequisites management, 2 items were derived from the HACCP management, and some similar evaluation items were grouped together. Finally, 10 items were added to the 20 items of the existing small scale HACCP evaluation items. In this study, study on the safety management of domestic livestock products are continuously carried out, so that it is possible to provide safety livestock products to consumers and contributes to securing competitiveness of domestic livestock industry.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.85-91
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• 2002

Even though electroless Hi and Sn-Ag-Cu solder are widely used materials in electronic packaging applications, interfacial reactions of the ternary Ni-Cu~Sn system have not been known well because of their complexity. Because the growth of intermetallics at the interface affects reliability of solder joint, the intermetallics in Ni-Cu-Sn system should be identified, and their growth should be investigated. Therefore, in present study, interfacial reactions between electroless Ni UB7f and 95.5Sn-4.0Ag-0.5Cu alloy were investigated focusing on morphology of the IMCs, thermodynamics, and growth kinetics. The IMCs that appear during a reflow and an aging are different each other. In early stage of a reflow, ternary IMC whose composition is Ni$_{22}$Cu$_{29}$Sn$_{49}$ forms firstly. Due to the lack of Cu diffusion, Ni$_{34}$Cu$_{6}$Sn$_{60}$ phase begins growing in a further reflow. Finally, the Ni$_{22}$Cu$_{29}$Sn$_{49}$ IMC grows abnormally and spalls into the molten solder. The transition of the IMCs from Ni$_{22}$Cu$_{29}$Sn$_{49}$ to Ni$_{34}$Cu$_{6}$Sn$_{60}$ was observed at a specific temperature. From the measurement of activation energy of each IMC, growth kinetics was discussed. In contrast to the reflow, three kinds of IMCs (Ni$_{22}$Cu$_{29}$Sn$_{49}$, Ni$_{20}$Cu$_{28}$Au$_{5}$, and Ni$_{34}$Cu$_{6}$Sn$_{60}$) were observed in order during an aging. All of the IMCs were well attached on UBM. Au in the quaternary IMC, which originates from immersion Au plating, prevents abnormal growth and separation of the IMC. Growth of each IMC is very dependent to the aging temperature because of its high activation energy. Besides the IMCs at the interface, plate-like Ag3Sn IMC grows as solder bump size inside solder bump. The abnormally grown Ni$_{22}$Cu$_{29}$Sn$_{49}$ and Ag$_3$Sn IMCs can be origins of brittle failure.failure.

• Journal of Sensor Science and Technology
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• v.25 no.2
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• pp.155-159
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• 2016

In this work, we have developed a test system to examine whether the charge indicator of the plug-in hybrid electric vehicle (PHEV) works properly or not. In PHEV, the driver should charge the necessary electricity by plugging in manually and be able to know the charging status through the charge indicator conveniently located for the charging individual. Our system used the CAN bus to transmit the same commands from ECU to the indicator to test the proper operation of the indicator lights. It measured the electric current values during operation and analyzed to determine the quality of the indicators. The inspection items included the proper packaging, the electrical shorts, the LED lighting during charging, the LED lighting for charging failure, and the LED lighting when errors occur. We developed the system for the operators in the factory allowing them to approve the test results at the site. We developed the hardware, the control software, and the software to store the test results and the history of the products in the database. Serial numbers were given to the good quality products and the bar code labels were printed to trace the products afterwards. Through this work, we developed a system to inspect the electric parts in real time upon fabrication. We are planning to further improve our system to inspect the brightness of the indicator by adding the vision inspection in future.

• Journal of the Semiconductor & Display Technology
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• v.11 no.2
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• pp.45-51
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• 2012

Multilayer co-extrusion blown film construction is a popular technique for producing plastic films for various packaging industries. Automated detection of defective films can improve the quality of film production process. In this paper, we propose a film inspection system that can detect and classify film defects robustly. In our system, first, film images are acquired through a high speed line-scan camera under an appropriate lighting system. In order to detect and classify film defects, an inspection algorithm is developed. The algorithm divides the typical film defects into two groups: intensity-based and texture-based. Intensity-based defects are classified based on geometric features. Whereas, to classify texture-based defects, a texture analysis technique based on local binary pattern (LBP) is adopted. Experimental results revealed that our film inspection system is effective in detecting and classifying defects for the multilayer co-extrusion blown film construction line.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.20 no.2
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• pp.29-33
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• 2014

Active air flushing mini-pumps were installed in a rigid polypropylene container ($32cm{\time}23cm{\time}18cm$) containing 900 g of fresh green peppers for effectively controlling its $O_2$ concentration on real time basis to preserve the product quality. The performance of the constructed system was compared to that of the modified atmosphere (MA) container system with gas diffusion tube controlled in close/open cycles responding to real time $O_2$ concentration at 10 and $20^{\circ}C$. In the control logic, the $O_2$ concentration was programmed to be located exactly at 13% or stay in the range of 13-15%. The active air flushing system could control the $O_2$ concentration in the desired level or range at both temperatures, while the passive diffusion system could work only under the low temperature condition of $10^{\circ}C$. At higher temperature of $20^{\circ}C$, the passive diffusion system could not manage the produce respiration increased more highly than the gas transfer through the diffusion tube, resulting in too low $O_2$ concentration and too high $CO_2$ concentration which would be injurious to the green pepper. When tested at $20^{\circ}C$, the MA container system could preserve the green pepper better than the perforated air package in terms of weight loss, ascorbic acid and chlorophyll contents and firmness.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.14 no.6
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• pp.77-83
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• 2015

This paper is a study of the functions required for the system to quantify the closest target weight by combining several random weights such as chips, snacks, fruits, and vegetables. The multi-head weigher is designed for high-performance applications requiring increased production rates and tight accuracy tolerances. This combination system has 12 heads considered in the form of a rectangular array of $2{\times}6$ or $3{\times}4$. Channel combination can usually occur between 1 and n, and the frequency was the highest with two or three combinations. Experimental result of a combination system for a total target weight was measured at the range from 100g to 500g by increments of 50g, and the average success rate was about 70%. The average elapsed time was about 1.7 seconds, which means it can be used for the packaging of agricultural products with a variety of items.