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Bonkohara, Manabu
- Proceedings of the International Microelectronics And Packaging Society Conference
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- 2003.09a
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- pp.65-89
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- 2003
Next Highly sophisticated communication generation of the Advanced Electronics and Imaging processing society will require a vast information volume and super high speed signal transport and information instruction. This means that super high technology should be created for satisfying the demand. It's also required the high reliability of the communication system itself, It will be supported the new advanced packaging technology of the 3 Dimensional structured system and system integration technology. Here is introduced the new 3 Dimensional technology for IC nnd LSI packaging and Opt-electronics Packaging of ASET activity in Japan.
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Jo, Jung-Yeon;Min, Choon-Ki;Shin, Jun-Seop;Lee, Myung-Hoon;Sohn, Ki-Zoo
- KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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- v.7 no.2
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- pp.43-51
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- 2001
This study was carried out to analyze changes of the physical properties of corrugated fiberboard boxes for fruits packaging by various moisture and temperature changes. There were significant decrease in burst strength with increased relative humidity. And also compressive strength(ring crush test) of corrugated fiberboard and box were reduced with moisture content. The decreasing amounts of single wall(SW) corrugated fiberboard was bigger than that of double wall(DW). The physical properties reductions of corrugated fiberboard and box were mainly affected by relative humidity. Therefore, it is suggested that development of the water-resistant corrugated fiberboard and box be useful under the condition of low temperature and high relative humidity such as the cold chain system.
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Kim, Gun-Hee;Jung, Woo-Chul;Heo, Young-Moo;Yoon, Gil-Sang;Chang, Sung-Ho;Shin, Gwang-Ho
- Design & Manufacturing
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- v.2 no.2
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- pp.15-19
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- 2008
In this paper, the automatic assembly and packaging system was developed for PET blow molding products. The PET blow molding products mainly are used in groceries case and are in great demand. Generally, the molding process is compose of 4 processes such as plastic resin injection, molding, ejecting and packaging. In case of packaging process, although amount of work per hour is very large, all processes are still performed by the manual work. For this reason, the automatic packaging system was developed with the function of automatic hand-grip part assembly. For the development of system, the existing processes and the shape of molding product were analyzed and specifications were deducted. Finally, the automatic assembly and packaging system was developed and applied to the manufacturing field.
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