• 마이크로전자및패키징학회지
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• 제23권4호
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• pp.31-34
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• 2016

System In Package (SiP) is getting popular and momentum for the recent wearable, IoT and connectivity application apart from mobile phone. This is driven by market demands of cost competitive, lighter and smaller/thinner and higher performance. As one of many semiconducting assembly products, Leadframe product has been widely used for low cost solution, light/ small and thin form factor. But It has not been applied for SiP although Leadframe product has many advantages in cost, size and reliability performance. SiP is mostly based on laminate substrate and technically difficult on Leadframe substrate because of a limitation in SMT performance. In this paper, Leadframe based SiP product has been evaluated about key technical challenges in SMT performance and electrical shield technology. Mostly Leadframe is considered not available to apply EMI shield because of tie-bar around package edge. In order to overcome two major challenges, connection bars were deployed properly for SMT pad to pad and additional back-side etching was implemented after molding process to achieve electrical isolation from outer shield coating. This product was confirmed assembly workability as well as reliability.

• 대한기계학회논문집A
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• 제25권6호
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• pp.959-964
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• 2001

An experimental investigation on the near-field electromagnetic loss of thin copper layers has been presented using microfabricated microwave transceivers for applications to multi-chip microsystems. Copper layers in the thickness range of 0.2$\mu$m∼200$\mu$m have been electroplated on the Pyrex glass substrates. Microwave transceivers have been fabricated using the 3.5mm$\times$3.5mm nickel microloop antennas, electroformed on the silicon substrates. Electromagnetic radiation loss of the copper layers placed between the microloop transceivers has been measured as 10dB∼40dB for the wave frequency range of 100MHz∼1GHz. The 0.2$\mu$m-thick copper layer provides a shield loss of 20dB at the frequencies higher than 300MHz, whereas showing a predominant decreases of shield loss to 10dB at lower frequencies. No substantial increase of the shield effectiveness has been found for the copper shield layers thicker that 2 $\mu$m.

• 마이크로전자및패키징학회지
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• 제16권4호
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• pp.55-60
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• 2009

불산과 에탄올 혼합용액에서 전기화학적 에칭을 통하여 다공성 실리콘 층을 제작하였다. 에칭 시 인가된 초음파의 주파수, 전류밀도, 에칭시간의 변화에 따른 다공성 실리콘 층의 변화를 확인하였다. 초음파를 가해주지 않은 시편은 표면에 특별한 변화가 일어나지 않았으나, 초음파 진동자의 주파수가 40 kHz와 130 kHz인 초음파 발생조에서 실험한 시편을 관찰한 결과, 가해준 초음파의 주파수가 높을수록 다공성 실리콘 층의 기공의 크기가 더 커지고 실리콘 표면에서의 에칭이 더 균일하게 일어났다. 후면접촉 에칭조와 current shield를 이용한 결과 다공성 실리콘 층 전면에 걸쳐 균일하게 기공이 발생하였다. 다공성 실리콘 층의 기공의 크기는 전류밀도가 증가함에 따라 함께 증가하였고, 에칭 시간에는 영향을 받지 않았다.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 1999년도 제3회 압연심포지엄 논문집 압연기술의 미래개척 (Exploitation of Future Rolling Technologies)
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• pp.10-21
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• 1999

Recent progress in manufacture of hot and cold rolled steel strip products and their applications were reviewed. The main trend in the technological development has been to meet the customers' requests for quality improvement and cost reduction. The weight reduction to reduce the fuel consumption is the main issue in the automotive industry and, therefore, various steels have been developed to improve formability as well as strength. The steels include super-EDDQ steels, bainitic steels, TRIP steels, etc. In the oil industry, efforts have been focused to improve strength together with either low temperature toughness or HIC/SSCC resistance. The packaging industry is also a highly competitive market, and steel and canmaking companies have worked cooperatively to develop cost-effective canmaking processes as well as high performance steels. This type of cooperation has also been found important in other industries such as the appliance and electronic industries for the benefits of both steelmakers and customers.

• ETRI Journal
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• 제24권4호
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• pp.290-298
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• 2002

We present, for the first time, a prototype active-matrix field emission display (AMFED) in which an amorphous silicon thin-film transistor (a-Si TFT) and a molybdenum-tip field emitter array (Mo-tip FEA) were monolithically integrated on a glass substrate for a novel active-matrix cathode (AMC) plate. The fabricated AMFED showed good display images with a low-voltage scan and data signals irrespective of a high voltage for field emissions. We introduced a light shield layer of metal into our AMC to reduce the photo leakage and back channel currents of the a-Si TFT. We designed the light shield to act as a focusing grid to focus emitted electron beams from the AMC onto the corresponding anode pixel. The thin film depositions in the a-Si TFTs were performed at a high temperature of above 360°C to guarantee the vacuum packaging of the AMC and anode plates. We also developed a novel wet etching process for $n^+-doped$ a-Si etching with high etch selectivity to intrinsic a-Si and used it in the fabrication of an inverted stagger TFT with a very thin active layer. The developed a-Si TFTs performed well enough to be used as control devices for AMCs. The gate bias of the a-Si TFTs well controlled the field emission currents of the AMC plates. The AMFED with these AMC plates showed low-voltage matrix addressing, good stability and reliability of field emission, and good light emissions from the anode plate with phosphors.

• 방사성폐기물학회지
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• 제20권2호
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• pp.243-253
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• 2022

Spent filters with a high radiation dose rate of 2 mSv·hr^-1 or more are not easily managed. So far, the Korean policy for spent filter disposal is to store them temporarily at nuclear power plants until the waste filters can be easily managed. Nuclear power plant decommissioning in Korea is starting with Kori unit 1. Volume reduction of waste generated during decommissioning can reduce the cost and optimize the space usage at disposal site. Therefore, efficient volume reduction is a very important factor during the decommissioning process. A conceptual method, based on the experiences of developing 200 and 800 ton compactors at Orion EnC, has been developed considering worker exposure with the followings a crusher (upgrade of compaction efficiency), an automatic dose measuring system with a NaI(Tl) detector, a shield box, an inner drum to prepare for easy handling of drums and packaging, a 30 ton compactor, and an automatic robot system. This system achieves a volume reduction ratio of up to 85.7%; hence, the system can reduce the disposal cost and waste volume. It can be applied to other types of wastes that are not easily managed due to high dose rates and remote control operation necessity.